TW200526496A - Substrate holding tool and substrate treating device for treating semiconductor - Google Patents

Substrate holding tool and substrate treating device for treating semiconductor Download PDF

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Publication number
TW200526496A
TW200526496A TW94101448A TW94101448A TW200526496A TW 200526496 A TW200526496 A TW 200526496A TW 94101448 A TW94101448 A TW 94101448A TW 94101448 A TW94101448 A TW 94101448A TW 200526496 A TW200526496 A TW 200526496A
Authority
TW
Taiwan
Prior art keywords
substrate
processed
wafer
mounting
processing
Prior art date
Application number
TW94101448A
Other languages
English (en)
Chinese (zh)
Inventor
Nobuaki Shigematsu
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200526496A publication Critical patent/TW200526496A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
TW94101448A 2004-02-05 2005-01-18 Substrate holding tool and substrate treating device for treating semiconductor TW200526496A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004029611A JP2005223142A (ja) 2004-02-05 2004-02-05 基板保持具、成膜処理装置及び処理装置

Publications (1)

Publication Number Publication Date
TW200526496A true TW200526496A (en) 2005-08-16

Family

ID=34835959

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94101448A TW200526496A (en) 2004-02-05 2005-01-18 Substrate holding tool and substrate treating device for treating semiconductor

Country Status (3)

Country Link
JP (1) JP2005223142A (ja)
TW (1) TW200526496A (ja)
WO (1) WO2005076343A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007073827A (ja) * 2005-09-08 2007-03-22 Dainippon Screen Mfg Co Ltd 減圧乾燥装置
JP2010520634A (ja) * 2007-03-08 2010-06-10 ソスル カンパニー， リミテッド 昇降装置を用いる基板処理装置及び方法
JP2010126797A (ja) * 2008-11-28 2010-06-10 Tokyo Electron Ltd 成膜装置、半導体製造装置、これらに用いられるサセプタ、プログラム、およびコンピュータ可読記憶媒体
JP2015002292A (ja) * 2013-06-17 2015-01-05 東京エレクトロン株式会社 化合物半導体膜成膜用基板の移載装置および移載方法、ならびに化合物半導体膜の成膜システムおよび成膜方法
JP6539929B2 (ja) 2015-12-21 2019-07-10 昭和電工株式会社 ウェハ支持機構、化学気相成長装置およびエピタキシャルウェハの製造方法
PL3422396T3 (pl) * 2017-06-28 2021-12-13 Meyer Burger (Germany) Gmbh Urządzenie do transportu substratu, urządzenie do obróbki z płytą mieszczącą dostosowaną do nośnika substratu takiego urządzenia oraz sposób przetwarzania substratu za pomocą takiego urządzenia do transportu substratu oraz układ do obróbki
JP7257920B2 (ja) * 2019-09-02 2023-04-14 大陽日酸株式会社 気相成長装置の基板搬送機構及び基板搬送方法
TW202326906A (zh) * 2021-11-02 2023-07-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 半導體基板處理設備

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5421893A (en) * 1993-02-26 1995-06-06 Applied Materials, Inc. Susceptor drive and wafer displacement mechanism
JPH10242067A (ja) * 1997-03-03 1998-09-11 Tokyo Electron Ltd 熱処理用基板支持具
JPH11163102A (ja) * 1997-11-27 1999-06-18 Kokusai Electric Co Ltd 半導体製造装置用サセプタ
JP2000174094A (ja) * 1998-12-08 2000-06-23 Hitachi Ltd 半導体製造装置

Also Published As

Publication number Publication date
JP2005223142A (ja) 2005-08-18
WO2005076343A1 (ja) 2005-08-18

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