TW200520640A - Sheet for flexible printed circuit board and method for manufacture thereof - Google Patents
Sheet for flexible printed circuit board and method for manufacture thereofInfo
- Publication number
- TW200520640A TW200520640A TW093127398A TW93127398A TW200520640A TW 200520640 A TW200520640 A TW 200520640A TW 093127398 A TW093127398 A TW 093127398A TW 93127398 A TW93127398 A TW 93127398A TW 200520640 A TW200520640 A TW 200520640A
- Authority
- TW
- Taiwan
- Prior art keywords
- sheet
- adhesive layer
- circuit board
- printed circuit
- flexible printed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/043—Stacked PCBs with their backs attached to each other without electrical connection
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003317635 | 2003-09-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200520640A true TW200520640A (en) | 2005-06-16 |
Family
ID=34308492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093127398A TW200520640A (en) | 2003-09-10 | 2004-09-10 | Sheet for flexible printed circuit board and method for manufacture thereof |
Country Status (7)
Country | Link |
---|---|
US (1) | US7384683B2 (zh) |
EP (1) | EP1667501A4 (zh) |
JP (1) | JP4947976B2 (zh) |
KR (1) | KR20060126930A (zh) |
CN (1) | CN100505980C (zh) |
TW (1) | TW200520640A (zh) |
WO (1) | WO2005027597A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI406925B (zh) * | 2010-09-14 | 2013-09-01 | Zhen Ding Technology Co Ltd | 電路板基板及其製作方法 |
TWI568322B (zh) * | 2011-03-23 | 2017-01-21 | 大日本印刷股份有限公司 | 放熱基板及使用其之元件 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1768471B1 (en) * | 2004-06-23 | 2013-05-29 | Hitachi Chemical Co., Ltd. | Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board |
JP4968616B2 (ja) * | 2005-04-21 | 2012-07-04 | 住友電気工業株式会社 | 多層プリント配線板の製造方法 |
US20070015896A1 (en) * | 2005-07-13 | 2007-01-18 | Kiu-Seung Lee | Dihydroxy aramid polymers |
JP4936729B2 (ja) * | 2006-01-12 | 2012-05-23 | ユニチカ株式会社 | フレキシブルプリント配線板用基板及びその製造方法 |
KR100820170B1 (ko) | 2006-08-30 | 2008-04-10 | 한국전자통신연구원 | 플렉시블 기판의 적층 방법 |
KR101102180B1 (ko) * | 2009-01-23 | 2012-01-02 | 주식회사 두산 | 신규 연성 금속박 적층판 및 그 제조방법 |
JP5642147B2 (ja) * | 2012-12-27 | 2014-12-17 | 学校法人 関西大学 | 熱伝導性導電性接着剤組成物 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3717543A (en) * | 1971-01-13 | 1973-02-20 | Rexham Corp | Laminations of polyimide films to like films and/or to metal foils |
JPS55153393A (en) | 1979-05-18 | 1980-11-29 | Sumitomo Bakelite Co | Method of fabricating circuit board |
DE3506524A1 (de) * | 1985-02-25 | 1986-08-28 | Akzo Gmbh, 5600 Wuppertal | Flexible polyimid-mehrschichtlaminate |
US4626474A (en) * | 1985-06-21 | 1986-12-02 | Stauffer Chemical Company | Polyimide film/metal foil lamination |
JPH01173687A (ja) * | 1987-12-28 | 1989-07-10 | Sumitomo Bakelite Co Ltd | フレキシブルプリント回路用基板 |
JPH03209792A (ja) * | 1990-01-11 | 1991-09-12 | Nitsukan Kogyo Kk | 両面金属張りフレキシブル印刷配線基板およびその製造方法 |
US5234522A (en) * | 1990-12-05 | 1993-08-10 | Hitachi Chemical Company, Inc. | Method of producing flexible printed-circuit board covered with coverlay |
US5103293A (en) * | 1990-12-07 | 1992-04-07 | International Business Machines Corporation | Electronic circuit packages with tear resistant organic cores |
JP3356568B2 (ja) * | 1994-11-30 | 2002-12-16 | 鐘淵化学工業株式会社 | 新規なフレキシブル銅張積層板 |
JPH1075053A (ja) * | 1996-09-02 | 1998-03-17 | Mitsui Petrochem Ind Ltd | フレキシブル金属箔積層板の製造方法 |
JP3184485B2 (ja) * | 1997-11-06 | 2001-07-09 | 三井金属鉱業株式会社 | 銅張積層板用樹脂組成物、樹脂付き銅箔、多層銅張り積層板および多層プリント配線板 |
JP3346265B2 (ja) * | 1998-02-27 | 2002-11-18 | 宇部興産株式会社 | 芳香族ポリイミドフィルムおよびその積層体 |
JP4389338B2 (ja) * | 2000-03-28 | 2009-12-24 | 宇部興産株式会社 | フレキシブル金属箔積層体の製造法 |
US6962726B2 (en) * | 2000-06-16 | 2005-11-08 | Unitika Ltd. | Method for preparing substrate for flexible print wiring board, and substrate for flexible print wiring board |
JP3994696B2 (ja) * | 2000-10-02 | 2007-10-24 | 宇部興産株式会社 | 線膨張係数を制御したポリイミドフィルム及び積層体 |
DE10109993A1 (de) * | 2001-03-01 | 2002-09-05 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung eines Moduls |
JP4292729B2 (ja) * | 2001-03-30 | 2009-07-08 | 日立電線株式会社 | 耐熱・耐屈曲フレキシブルフラットケーブル |
JP2003026773A (ja) | 2001-07-17 | 2003-01-29 | Nippon Kayaku Co Ltd | エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料 |
US6794031B2 (en) * | 2001-09-28 | 2004-09-21 | Ube Industries, Ltd. | Cover-lay film and printed circuit board having the same |
TWI298988B (en) * | 2002-07-19 | 2008-07-11 | Ube Industries | Copper-clad laminate |
TWI233771B (en) * | 2002-12-13 | 2005-06-01 | Victor Company Of Japan | Flexible rigid printed circuit board and method of fabricating the board |
US7220490B2 (en) * | 2003-12-30 | 2007-05-22 | E. I. Du Pont De Nemours And Company | Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto |
-
2004
- 2004-09-10 EP EP04773247A patent/EP1667501A4/en not_active Withdrawn
- 2004-09-10 KR KR1020067004908A patent/KR20060126930A/ko not_active Application Discontinuation
- 2004-09-10 US US10/571,084 patent/US7384683B2/en not_active Expired - Fee Related
- 2004-09-10 JP JP2005513978A patent/JP4947976B2/ja not_active Expired - Fee Related
- 2004-09-10 TW TW093127398A patent/TW200520640A/zh unknown
- 2004-09-10 WO PCT/JP2004/013603 patent/WO2005027597A1/ja active Application Filing
- 2004-09-10 CN CNB2004800256120A patent/CN100505980C/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI406925B (zh) * | 2010-09-14 | 2013-09-01 | Zhen Ding Technology Co Ltd | 電路板基板及其製作方法 |
TWI568322B (zh) * | 2011-03-23 | 2017-01-21 | 大日本印刷股份有限公司 | 放熱基板及使用其之元件 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2005027597A1 (ja) | 2006-11-24 |
US20070071984A1 (en) | 2007-03-29 |
CN1846465A (zh) | 2006-10-11 |
WO2005027597A1 (ja) | 2005-03-24 |
KR20060126930A (ko) | 2006-12-11 |
EP1667501A1 (en) | 2006-06-07 |
EP1667501A4 (en) | 2010-01-06 |
US7384683B2 (en) | 2008-06-10 |
JP4947976B2 (ja) | 2012-06-06 |
CN100505980C (zh) | 2009-06-24 |
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