MX2019013544A - Estructura de pcb con una capa de silicona como adhesivo. - Google Patents

Estructura de pcb con una capa de silicona como adhesivo.

Info

Publication number
MX2019013544A
MX2019013544A MX2019013544A MX2019013544A MX2019013544A MX 2019013544 A MX2019013544 A MX 2019013544A MX 2019013544 A MX2019013544 A MX 2019013544A MX 2019013544 A MX2019013544 A MX 2019013544A MX 2019013544 A MX2019013544 A MX 2019013544A
Authority
MX
Mexico
Prior art keywords
silicone
cured
layer
modified
adhesive
Prior art date
Application number
MX2019013544A
Other languages
English (en)
Inventor
Szu-Nan Yang
Original Assignee
Prologium Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/530,613 external-priority patent/US11089693B2/en
Application filed by Prologium Tech Co Ltd filed Critical Prologium Tech Co Ltd
Publication of MX2019013544A publication Critical patent/MX2019013544A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/66—Selection of materials
    • H01M4/661—Metal or alloys, e.g. alloy coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H01M10/4257—Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H01M2010/4271—Battery management systems including electronic circuits, e.g. control of current or voltage to keep battery in healthy state, cell balancing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Una placa de circuito impreso flexible incluye un sustrato que está hecho de un material no metálico; una primera capa curada de silicona modificada que se proporciona sobre y en contacto con el sustrato y que incluye un primer material de silicona que se cura; una capa de metal que está hecha de al menos un metal; una segunda capa curada de silicona modificada que se proporciona sobre y en contacto con la capa de metal y que incluye un segundo material de silicona que se cura; y una capa adhesiva de silicona dispuesta entre y en contacto con la primera capa curada de silicona modificada y la segunda capa curada de silicona modificada y que incluye un material adhesivo de silicona que se cura mediante polimerización térmica después de la laminación de la misma entre la primera capa curada de silicona modificada y el segunda capa curada de silicona modificada. La laminación del sustrato recubierto con silicona modificada curada y la capa de metal recubierta con silicona modificada curada con la capa adhesiva de silicona mejora la adhesión y reduce la delaminación.
MX2019013544A 2019-08-02 2019-11-13 Estructura de pcb con una capa de silicona como adhesivo. MX2019013544A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16/530,613 US11089693B2 (en) 2011-12-16 2019-08-02 PCB structure with a silicone layer as adhesive

Publications (1)

Publication Number Publication Date
MX2019013544A true MX2019013544A (es) 2021-07-27

Family

ID=68295956

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2019013544A MX2019013544A (es) 2019-08-02 2019-11-13 Estructura de pcb con una capa de silicona como adhesivo.

Country Status (7)

Country Link
EP (1) EP3772240A1 (es)
JP (1) JP2021027307A (es)
KR (1) KR102234313B1 (es)
CN (1) CN112312647B (es)
BR (1) BR102019022506B1 (es)
MX (1) MX2019013544A (es)
RU (1) RU2730586C1 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR102019016452A2 (pt) * 2018-08-08 2020-02-11 Prologium Technology Co., Ltd. Grupo de elementos de fornecimento de eletricidade composto horizontal
KR20220112563A (ko) 2021-02-04 2022-08-11 삼성전자주식회사 전자 장치 및 그 제어 방법
KR102598317B1 (ko) * 2021-09-29 2023-11-06 조인셋 주식회사 3층 연성적층판, 그 제조방법 및 이를 적용한 전기접촉단자

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821893A (ja) * 1981-07-31 1983-02-08 住友ベークライト株式会社 フレキシブルプリント配線用基板の製造方法
DE3413434A1 (de) * 1984-04-10 1985-10-17 Dielektra GmbH, 5000 Köln Verfahren zum kontinuierlichen herstellen von kupferkaschiertem basismaterial fuer leiterplatten
JPS61185994A (ja) * 1985-02-13 1986-08-19 信越化学工業株式会社 耐熱性フレキシブルプリント配線用基板およびその製造方法
JP5481024B2 (ja) * 2007-08-07 2014-04-23 株式会社朝日ラバー 積層基板
EP2196503B1 (en) * 2008-12-12 2015-02-18 Nitto Denko Corporation Thermosetting silicone resin composition, silicone resin, silicone resin sheet and use thereof
US10826030B2 (en) * 2012-12-13 2020-11-03 Prologium Holding Inc. Package structure of electronic modules with silicone sealing frame and the manufacturing method thereof
TWI472831B (zh) * 2011-12-16 2015-02-11 Prologium Technology Co Ltd 電子模組之側封裝結構
TWI437931B (zh) * 2011-12-16 2014-05-11 Prologium Technology Co Ltd 電路板結構
CN103188868B (zh) * 2011-12-28 2016-07-13 辉能科技股份有限公司 电路板结构
EP2822705B1 (en) * 2012-03-06 2016-09-07 Semblant Limited Coated electrical assembly
TWI490115B (zh) * 2014-03-07 2015-07-01 Azotek Co Ltd 金屬基板及其製作方法
TWI676315B (zh) * 2017-10-20 2019-11-01 輝能科技股份有限公司 複合式電池芯

Also Published As

Publication number Publication date
RU2730586C1 (ru) 2020-08-24
CN112312647A (zh) 2021-02-02
KR102234313B1 (ko) 2021-03-31
BR102019022506B1 (pt) 2022-03-03
KR20210016257A (ko) 2021-02-15
CN112312647B (zh) 2022-05-06
BR102019022506A2 (pt) 2021-02-09
EP3772240A1 (en) 2021-02-03
JP2021027307A (ja) 2021-02-22

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