KR950703017A - 열가소성 폴리이미드중합체 및 열가소성 폴리이미드필름 및 폴리이미드 적층체 및 그 적층체의 제조방법 - Google Patents
열가소성 폴리이미드중합체 및 열가소성 폴리이미드필름 및 폴리이미드 적층체 및 그 적층체의 제조방법 Download PDFInfo
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- B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
본 발명은 플렉시블프린트배선판을 제작함에 있어, 내열성이 우수하고, 또한 가공성 및 접착성이 우수한 카바레이용 접착제나 카바레이필름, 또 FCCL이나 양면 접착시이트의 접착제층으로서 사용할 수 있는 적합한 열가소성 폴리이미드중합체 및 열가소성 폴리이미드필름 및 폴리이미드적층체 및 그 적층체의 제조방법을 제공함을 목적으로 한다. 그리고, 일반식(1)
(식중에서, Ar1, Ar2, Ar4, Ar6은 2가의 유기기, Ar3, Ar5는 4가의 유기기를 나타낸다. 또 1, m, n는 0 또는 1이상의 양의 정수이며, 또한 1, m의 합이 1이상이고, t는 1이상의 양의 정수를 나타낸다.)로 나타내는 열가소성폴리이미드중합체를 얻고, 이러한 열가소성 폴리이미드증합체로 이루어진 열가소성폴리이미드필름을 제작하였다. 이러한 열가소성폴리이미드필름은 100-250℃의 사이에서 명확한 글래스전이점을 가지며, 저온에서 접착성을 나타내었다. 또 비열가소성폴리이미드필름의 양면 또는 한면에, 상기 열가소성폴리이미드중합체를 적층하여 폴리이미드적층체를 제작하고, 또한 그 열가소성 폴리이미드중합체층의 면과 동박을 포개어 글래스전이점에 가까운 온도에서 라미네이트시키고, 피일강도가 우수한 플렉시블동피복적층판을 제작하였다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 관한 카바레이용접착제가 피접착형성된 카바레이필름을 플렉시블프린트기판에 접착하는 방법을 설명하기 위한 도면이며, 동 도면(a), (b) 및 (c)는 각 공정을 나타내는 단면설명도이다.
제2도는 본 발명에 관한 열가소성 폴리이미드중합체로 구성되는 카바레이필름을 플렉시블프린트기판에 접착하는 방법을 설명하기 위한 도면이며, 동 도면(a), (b) 및 (c)는 각 공정을 나타내는 단면설명도이다.
Claims (13)
1. 일반식(1)
(식중에서, Ar1, Ar2, Ar4, Ar6은 2가의 유기기, Ar3, Ar5는 4가의 유기기를 나타낸다. 또 1, m, n는 0 또는 1이상의 정수이며, 또한 1, m의 합이 1이상이고, t는 1이상의 양의 정수를 나타낸다.)로 나타내는 것을 특징으로 하는 열가소성 폴리이미드중합체.
제1항에 있어서, 상기 일반식(1)중 Ar1은,
으로 나타내는 2가의 유기기의 군으로부터 선택되는 적어도 1종인 것을 특징으로 하는 열가소성 폴리이미드중합체.
제1항 또는 제2항에 있어서, 상기 일반식(1)중 Ar2는,
으로 나타내는 2가의 방향족기의 군으로부터 선택되는 적어도 1종인 것을 특징으로 하는 열가소성 폴리이미드중합체.
제1항 내지 제3항중 어느 한 항에 있어서, 상기 일반식(1)중 Ar3은,
으로 나타내는 4가의 방향족기의 군으로부터 선택되는 적어도 1종인 것을 특징으로 하는 열가소성 폴리이미드중합체.
제1항 내지 제4항중 어느 한 항에 있어서, 상기 일반식(1)중 Ar4는
으로 나타내는 2가의 유기기이 군으로부터 선택되는 적어도 1종인 것을 특징으로 하는 열가소성 폴리이미드중합체.
제1항 내지 제4항중 어느 한 항에 있어서, 상기 일반식(1)중 Ar5는
으로 나타내는 4가의 방향족기의 군으로부터 선택되는 적어도 1종인 것을 특징으로 하는 열가소성 폴리이미드중합체.
제1항 내지 제6항중 어느 한 항에 있어서, 상기 일반식(1)중 Ar6은
으로 나타내는 2가의 방향족기의 군으로부터 선택되는 적어도 1종인 것을 특징으로 하는 열가소성 폴리이미드중합체.
제1항 내지 제7항중 어느 한 항에 기재하는 열가소성 폴리이미드중합체를 필름현상으로 형성하여 되는 것을 특징으로 하는 열가소성폴리이미드필름.
박리용 필름상에, 제1항 내지 제7항중 어느 한항에 기재하는 열가소성폴리이미드중합체를 필름현상으로 적층하여 되는 것을 특징으로 하는 폴리이미드적층체.
비열가소성 폴이미드필름의 양면 또는 한면에, 제1항 내지 제7항중 어느 한 항에 기재하는 열가소성 폴리이미드중합체를 필름현상으로 적층하여 되는 것을 특징으로 하는 폴리이미드적층체.
비열가소성 폴리이미드중합체로 이루어지는 베이스필름층과, 제1항 내지 제7항중 어느 한항에 기재하는 열가소성폴리이미드중합체로 이루어지는 접작제층과, 전기적 양도체로 이루어지는 도체층으로 구성되는 것을 특징으로 하는 폴리이미드적층체.
비열가소성 폴리이미드중합체로 이루어지는 베이스필름층과, 제1항 내지 제7항중 어느 한항에 기재하는 열가소성폴리이미드중합체의 전구체용액을 도포하고, 건조, 이미드화 시킨 후, 얻어진 열가소성 폴리이미드층에 도체층을 포개고, 가열가압하여 피착적층하는 것을 특징으로 하는 폴리이미드적층체의 제조방법.
비열가소성 폴리이미드중합체로 이루어지는 베이스필름과, 제1항 내지 제7항중 어느 한 항에 기재하는 열가소성 폴리이미드중합체로 이루어지는 필름과, 도체층을 차례로 포갠 후 가열가압하여 피착적층하는 것을 특징으로 하는 폴리이미드적층체의 제조방법.
※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21227393A JPH0748555A (ja) | 1993-08-03 | 1993-08-03 | カバーレイ用接着剤及びカバーレイフィルム |
JP93-212273 | 1993-08-03 | ||
JP93-218175 | 1993-08-09 | ||
JP21817593A JPH0758428A (ja) | 1993-08-09 | 1993-08-09 | フレキシブルプリント基板及びその製造方法 |
JP24067793A JPH0770524A (ja) | 1993-08-31 | 1993-08-31 | ポリイミド両面接着シート |
JP93-240677 | 1993-08-31 | ||
PCT/JP1994/001286 WO1995004100A1 (fr) | 1993-08-03 | 1994-08-03 | Polymere polyimidique thermoplastique, feuille polyimidique thermoplastique, stratifie polyimidique, et procede de production du stratifie |
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KR950703017A true KR950703017A (ko) | 1995-08-23 |
KR100326655B1 KR100326655B1 (ko) | 2002-06-29 |
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KR1019950700673A KR100326655B1 (ko) | 1993-08-03 | 1994-08-03 | 카바레이필름또는fpc제작용베이스필름에사용되는폴리이미드적층체및그적층체의제조방법 |
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US (1) | US5621068A (ko) |
EP (1) | EP0663417B1 (ko) |
KR (1) | KR100326655B1 (ko) |
CN (1) | CN1088074C (ko) |
DE (1) | DE69423726T2 (ko) |
WO (1) | WO1995004100A1 (ko) |
Families Citing this family (25)
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EP0775716B1 (en) * | 1995-01-11 | 1999-07-28 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Novel heat-fusible copolymer, and powder, film, laminated heat insulator, electronic module, and capacitor produced from said copolymer, and process for producing the same |
JPH09116273A (ja) * | 1995-08-11 | 1997-05-02 | Shinko Electric Ind Co Ltd | 多層回路基板及びその製造方法 |
DE19609590A1 (de) * | 1996-03-12 | 1997-09-18 | Kontron Elektronik | Verfahren und Vorrichtung zur Beschichtung von Substraten, vorzugsweise Leiterplatten |
US6207739B1 (en) * | 1997-11-20 | 2001-03-27 | Kanegafuchi Kagaku Kogyo Kabushiki | Polyamide acid composition containing metal, polyimide film, flexible printed wiring board and method for producing them |
US6555170B2 (en) | 1998-01-30 | 2003-04-29 | Duratech Industries, Inc. | Pre-plate treating system |
US6174561B1 (en) | 1998-01-30 | 2001-01-16 | James M. Taylor | Composition and method for priming substrate materials |
JP4743732B2 (ja) * | 1999-04-09 | 2011-08-10 | 株式会社カネカ | 線材被覆用接着性積層フィルム |
CN1117133C (zh) * | 1999-09-21 | 2003-08-06 | 中国科学院化学研究所 | 一种可溶性聚酰亚胺涂层胶及其制备方法和用途 |
WO2001076866A1 (fr) * | 2000-04-12 | 2001-10-18 | Kaneka Corporation | Carte imprimee laminee et multicouche et fabrication correspondante |
CN101143500B (zh) * | 2000-06-21 | 2012-02-29 | 大日本印刷株式会社 | 层压体及其用途 |
JP4562110B2 (ja) * | 2001-02-16 | 2010-10-13 | 大日本印刷株式会社 | ウエットエッチングが適用される用途に限定される積層体、それを用いた電子回路部品、及びその製造方法 |
JPWO2002067641A1 (ja) * | 2001-02-21 | 2004-06-24 | 鐘淵化学工業株式会社 | 配線基板およびその製造方法、並びに該配線基板に用いられるポリイミドフィルムおよび該製造方法に用いられるエッチング液 |
JP2003023250A (ja) | 2001-07-06 | 2003-01-24 | Denso Corp | 多層基板のおよびその製造方法 |
JP4080799B2 (ja) * | 2002-06-28 | 2008-04-23 | 三井金属鉱業株式会社 | 金属材表面への誘電体フィラー含有ポリイミド被膜の形成方法並びにプリント配線板用のキャパシタ層形成用の銅張積層板の製造方法及びその製造方法で得られた銅張積層板 |
TWI298988B (en) | 2002-07-19 | 2008-07-11 | Ube Industries | Copper-clad laminate |
AU2003289243A1 (en) * | 2003-01-09 | 2004-08-10 | Kaneka Corporation | Bonding sheet and one-side metal-clad laminate |
US20080118730A1 (en) * | 2006-11-22 | 2008-05-22 | Ta-Hua Yu | Biaxially oriented film, laminates made therefrom, and method |
US20100301005A1 (en) * | 2009-05-29 | 2010-12-02 | Nilsson Peter L J | Method of Manufacturing an Electrical Circuit on a Substrate |
CN103426626A (zh) * | 2012-05-18 | 2013-12-04 | 佳邦科技股份有限公司 | 薄膜元件的制备方法及其共模滤波器的制备方法 |
CN102729561A (zh) * | 2012-07-19 | 2012-10-17 | 宜兴市高拓高分子材料有限公司 | 一种用于制造无胶系柔性线路板的聚酰亚胺薄膜及其制备方法 |
KR101565324B1 (ko) * | 2015-08-03 | 2015-11-03 | (주)아이피아이테크 | 고온 열융착이 가능한 내열성 폴리이미드 코팅막 형성 방법 |
TWI762725B (zh) * | 2017-09-29 | 2022-05-01 | 日商日鐵化學材料股份有限公司 | 覆金屬層疊板及電路基板 |
CN110857332B (zh) * | 2018-08-22 | 2022-10-21 | 臻鼎科技股份有限公司 | 高分子树脂、高分子树脂组合物及覆铜板 |
CN111417270A (zh) * | 2020-03-30 | 2020-07-14 | 成都多吉昌新材料股份有限公司 | Fpc粘接方法、覆盖膜形成方法以及超薄fpc |
CN113990765B (zh) * | 2021-12-28 | 2023-04-18 | 深圳市思坦科技有限公司 | 柔性发光器件的制备方法、柔性发光器件及发光装置 |
Family Cites Families (13)
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JPS435911B1 (ko) * | 1964-03-03 | 1968-03-04 | ||
FR1540930A (fr) * | 1966-11-09 | 1968-10-04 | Inst Francais Du Petrole | Nouveaux polymères thermostables : poly (ester-imides) dérivés de bis (amino arylesters) d'hydroquinone |
JPS512798A (en) * | 1974-06-28 | 1976-01-10 | Hitachi Ltd | Kayoseihoriimidono seizoho |
JPH0781119B2 (ja) * | 1986-10-16 | 1995-08-30 | 日立化成工業株式会社 | ポリイミド成形品の製造法 |
JPH0788495B2 (ja) * | 1987-01-30 | 1995-09-27 | 日立化成工業株式会社 | フイルム状接合部材 |
JPH04212206A (ja) * | 1990-03-27 | 1992-08-03 | Hitachi Ltd | 絶縁塗料、ハンダ付け可能な絶縁電線、該絶縁電線の製造方法および該絶縁電線を用いたフライバックトランス |
US5096998A (en) * | 1990-10-31 | 1992-03-17 | E. I. Du Pont De Nemours And Company | Reactive-oligoimide adhesives, laminates, and methods of making the laminates |
JP2983616B2 (ja) * | 1990-11-26 | 1999-11-29 | 鐘淵化学工業株式会社 | 耐熱積層材用化合物及び該化合物を用いた積層材の製造方法 |
JP3022933B2 (ja) * | 1991-06-12 | 2000-03-21 | 鐘淵化学工業株式会社 | 熱硬化型オリゴマー及びその製造方法 |
US5347652A (en) * | 1991-06-26 | 1994-09-13 | International Business Machines Corporation | Method and apparatus for saving and retrieving functional results |
JPH05105850A (ja) * | 1991-10-16 | 1993-04-27 | Sumitomo Bakelite Co Ltd | エレクトロニクス用接着テープ |
JPH05339374A (ja) * | 1992-06-10 | 1993-12-21 | Kanegafuchi Chem Ind Co Ltd | 硬化性イミドオリゴマー |
CA2111294A1 (en) * | 1992-12-16 | 1994-06-17 | Hiroyuki Furutani | Thermoplastic polyimide, polyamide acid, and thermally fusible laminated film for covering conductive wires |
-
1994
- 1994-08-03 US US08/381,890 patent/US5621068A/en not_active Expired - Lifetime
- 1994-08-03 EP EP19940923069 patent/EP0663417B1/en not_active Expired - Lifetime
- 1994-08-03 WO PCT/JP1994/001286 patent/WO1995004100A1/ja active IP Right Grant
- 1994-08-03 KR KR1019950700673A patent/KR100326655B1/ko not_active IP Right Cessation
- 1994-08-03 DE DE69423726T patent/DE69423726T2/de not_active Expired - Fee Related
- 1994-08-03 CN CN94190568A patent/CN1088074C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5621068A (en) | 1997-04-15 |
WO1995004100A1 (fr) | 1995-02-09 |
CN1113083A (zh) | 1995-12-06 |
EP0663417A1 (en) | 1995-07-19 |
EP0663417B1 (en) | 2000-03-29 |
DE69423726T2 (de) | 2000-09-07 |
DE69423726D1 (de) | 2000-05-04 |
CN1088074C (zh) | 2002-07-24 |
EP0663417A4 (en) | 1996-01-10 |
KR100326655B1 (ko) | 2002-06-29 |
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