JP2009190387A5 - - Google Patents

Download PDF

Info

Publication number
JP2009190387A5
JP2009190387A5 JP2008100486A JP2008100486A JP2009190387A5 JP 2009190387 A5 JP2009190387 A5 JP 2009190387A5 JP 2008100486 A JP2008100486 A JP 2008100486A JP 2008100486 A JP2008100486 A JP 2008100486A JP 2009190387 A5 JP2009190387 A5 JP 2009190387A5
Authority
JP
Japan
Prior art keywords
metal foil
clad laminate
resin
laminate according
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008100486A
Other languages
English (en)
Japanese (ja)
Other versions
JP5056553B2 (ja
JP2009190387A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008100486A priority Critical patent/JP5056553B2/ja
Priority claimed from JP2008100486A external-priority patent/JP5056553B2/ja
Publication of JP2009190387A publication Critical patent/JP2009190387A/ja
Publication of JP2009190387A5 publication Critical patent/JP2009190387A5/ja
Application granted granted Critical
Publication of JP5056553B2 publication Critical patent/JP5056553B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008100486A 2007-04-11 2008-04-08 金属箔張り積層板およびプリント配線板 Expired - Fee Related JP5056553B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008100486A JP5056553B2 (ja) 2007-04-11 2008-04-08 金属箔張り積層板およびプリント配線板

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2007103784 2007-04-11
JP2007103784 2007-04-11
JP2008006101 2008-01-15
JP2008006101 2008-01-15
JP2008100486A JP5056553B2 (ja) 2007-04-11 2008-04-08 金属箔張り積層板およびプリント配線板

Publications (3)

Publication Number Publication Date
JP2009190387A JP2009190387A (ja) 2009-08-27
JP2009190387A5 true JP2009190387A5 (zh) 2011-03-31
JP5056553B2 JP5056553B2 (ja) 2012-10-24

Family

ID=39863914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008100486A Expired - Fee Related JP5056553B2 (ja) 2007-04-11 2008-04-08 金属箔張り積層板およびプリント配線板

Country Status (3)

Country Link
JP (1) JP5056553B2 (zh)
TW (1) TW200908821A (zh)
WO (1) WO2008126817A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568587B (zh) * 2011-04-14 2017-02-01 住友電木股份有限公司 積層板，電路基板，半導體封裝及積層板之製造方法
JPWO2014087882A1 (ja) * 2012-12-05 2017-01-05 住友ベークライト株式会社 樹脂層付き金属層、積層体、回路基板および半導体装置
JP6269506B2 (ja) * 2012-12-18 2018-01-31 日立化成株式会社 積層体、積層板、プリント配線板、積層体の製造方法、及び積層板の製造方法
JP6735505B2 (ja) * 2016-09-06 2020-08-05 パナソニックＩｐマネジメント株式会社 プリント配線板、プリント回路板、プリプレグ
CN114845874B (zh) * 2019-12-17 2024-08-23 三菱瓦斯化学株式会社 树脂片和印刷电路板
CN116080157B (zh) * 2022-11-16 2023-08-04 广东威世新材料有限公司 一种印制电路用覆铜箔环氧玻纤布层压板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60190347A (ja) * 1984-03-10 1985-09-27 松下電工株式会社 電気用積層板
TW224561B (zh) * 1991-06-04 1994-06-01 Akocho Co
JPH0818402B2 (ja) * 1993-06-03 1996-02-28 日本ピラー工業株式会社 積層板および積層板用混合フィルム
JP4455806B2 (ja) * 2001-05-24 2010-04-21 日立化成工業株式会社 プリプレグ及び積層板
JP5241992B2 (ja) * 2004-03-05 2013-07-17 日立化成株式会社 プリプレグ、並びにこれを用いて得られる金属箔張積層板及び印刷回路板
JP4517749B2 (ja) * 2004-04-12 2010-08-04 日立化成工業株式会社 プリプレグ並びにこれを用いた金属張積層板及び印刷回路板
JP4590982B2 (ja) * 2004-04-21 2010-12-01 日立化成工業株式会社 樹脂付き金属箔

Similar Documents

Publication Publication Date Title
JP2012515671A5 (zh)
JP2009190387A5 (zh)
JP2007129124A5 (zh)
JP2011501707A5 (zh)
JP2009090647A5 (zh)
JP2008544873A5 (zh)
TW200709751A (en) Polyimide copper foil laminate and method of producing the same
JP2007176169A5 (zh)
ATE521220T1 (de) Leitfähige integral-metall-gummi-komponente
JP2019530988A5 (zh)
DE602007006361D1 (de) Mehrschichtiges Sportbrett mit aufgedruckter graphischer Schicht
JP2014022665A5 (zh)
GB201018205D0 (en) Improvements to laminated boards and mouldings
EP1764214A3 (en) Laminated polyester film, flame-retardant polyester film thereof copper-clad laminated plate and circuit substrate
JP2010023444A5 (zh)
TWI456595B (zh) 異向性導電膜及其製造方法
WO2008126817A1 (ja) 金属箔張り積層板およびプリント配線板
TW200635781A (en) Method for bonding members and composite film, and uses thereof
MY155884A (en) Two-layered laminate having metal foil cladded on its one surface, method for production of the laminate, single-sided printed wiring board, and method for production of the wiring board
WO2008126642A1 (ja) 金属箔張積層板及びプリント配線板
JP2019199062A5 (zh)
WO2009017051A1 (ja) 多層回路基板用複合体
CN103108502B (zh) 软板中层压覆盖膜的方法
WO2005103179A3 (en) Fabric coated foam
TW200932070A (en) Stiffener and flexible printed circuit board with the same