TW200520262A - Light emitting device - Google Patents

Light emitting device

Info

Publication number
TW200520262A
TW200520262A TW093128272A TW93128272A TW200520262A TW 200520262 A TW200520262 A TW 200520262A TW 093128272 A TW093128272 A TW 093128272A TW 93128272 A TW93128272 A TW 93128272A TW 200520262 A TW200520262 A TW 200520262A
Authority
TW
Taiwan
Prior art keywords
light
emitting device
light emitting
phosphors
emitting element
Prior art date
Application number
TW093128272A
Other languages
English (en)
Other versions
TWI307173B (zh
Inventor
Suguru Takashima
Masatoshi Kameshima
Hiroto Tamaki
Junji Takeichi
Yoshinori Murazaki
Shinpei Kinoshita
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Publication of TW200520262A publication Critical patent/TW200520262A/zh
Application granted granted Critical
Publication of TWI307173B publication Critical patent/TWI307173B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/56—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing sulfur
    • C09K11/562—Chalcogenides
    • C09K11/565—Chalcogenides with zinc cadmium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7729—Chalcogenides
    • C09K11/7731—Chalcogenides with alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7734—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7736—Vanadates; Chromates; Molybdates; Tungstates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7737—Phosphates
    • C09K11/7738—Phosphates with alkaline earth metals
    • C09K11/7739—Phosphates with alkaline earth metals with halogens
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/774—Borates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
    • C09K11/7784—Chalcogenides
    • C09K11/7787—Oxides
    • C09K11/7789—Oxysulfides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
    • C09K11/7797—Borates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
TW093128272A 2003-09-18 2004-09-17 Light emitting device TW200520262A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003326535 2003-09-18
JP2003328367 2003-09-19
JP2004133626 2004-04-28

Publications (2)

Publication Number Publication Date
TW200520262A true TW200520262A (en) 2005-06-16
TWI307173B TWI307173B (zh) 2009-03-01

Family

ID=34381775

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093128272A TW200520262A (en) 2003-09-18 2004-09-17 Light emitting device

Country Status (8)

Country Link
US (1) US7723740B2 (zh)
EP (1) EP1670070B1 (zh)
JP (1) JP5151002B2 (zh)
KR (1) KR101065522B1 (zh)
CN (1) CN100428508C (zh)
MY (1) MY143898A (zh)
TW (1) TW200520262A (zh)
WO (1) WO2005029596A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425650B (zh) * 2004-11-18 2014-02-01 Koninkl Philips Electronics Nv 具改善調光性能之光源
TWI485347B (zh) * 2008-05-19 2015-05-21 Toshiba Kk A linear white light source and a backlight and a liquid crystal display device using the same

Families Citing this family (122)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4048954B2 (ja) * 2001-04-20 2008-02-20 日亜化学工業株式会社 発光デバイス
US7091656B2 (en) * 2001-04-20 2006-08-15 Nichia Corporation Light emitting device
JP4032682B2 (ja) * 2001-08-28 2008-01-16 三菱化学株式会社 蛍光体
US7189340B2 (en) * 2004-02-12 2007-03-13 Mitsubishi Chemical Corporation Phosphor, light emitting device using phosphor, and display and lighting system using light emitting device
TW200523340A (en) * 2003-09-24 2005-07-16 Patent Treuhand Ges Fur Elek Sche Gluhlampen Mbh Hochefeizienter leuchtstoff
TWI356503B (en) * 2003-09-24 2012-01-11 Osram Ag Green emitting led
TWI344220B (en) 2003-09-24 2011-06-21 Osram Gmbh White emitting led with definite color-temperature
US7094362B2 (en) * 2003-10-29 2006-08-22 General Electric Company Garnet phosphor materials having enhanced spectral characteristics
US7252787B2 (en) 2003-10-29 2007-08-07 General Electric Company Garnet phosphor materials having enhanced spectral characteristics
US7442326B2 (en) 2003-10-29 2008-10-28 Lumination Llc Red garnet phosphors for use in LEDs
KR100845493B1 (ko) * 2004-09-29 2008-07-10 쇼와 덴코 가부시키가이샤 산질화물계 형광체 및 이것의 제조방법
DE112005002277T5 (de) * 2004-09-29 2009-05-07 Showa Denko K.K. Fluoreszierendes Material auf Oxynitrid-Basis und Verfahren zur Herstellung hierfür
US7452483B2 (en) * 2004-09-30 2008-11-18 Global Tungsten & Powders Corp. Yellow-emitting phosphor blend for electroluminescent lamps
US7749405B2 (en) * 2004-09-30 2010-07-06 Global Tungsten & Powders Corp. White-emitting phosphor blend and electroluminescent lamp containing same
US8278816B2 (en) * 2004-09-30 2012-10-02 Global Tungsten & Powders Corp. High CRI electroluminescent lamp
US7713441B2 (en) * 2004-10-15 2010-05-11 Mitsubishi Chemical Corporation Fluorescent material, fluorescent device using the same, and image display device and lighting equipment
US7497973B2 (en) * 2005-02-02 2009-03-03 Lumination Llc Red line emitting phosphor materials for use in LED applications
US7648649B2 (en) * 2005-02-02 2010-01-19 Lumination Llc Red line emitting phosphors for use in led applications
US20070114562A1 (en) * 2005-11-22 2007-05-24 Gelcore, Llc Red and yellow phosphor-converted LEDs for signal applications
US7358542B2 (en) 2005-02-02 2008-04-15 Lumination Llc Red emitting phosphor materials for use in LED and LCD applications
TWI413274B (zh) * 2005-03-18 2013-10-21 Mitsubishi Chem Corp 發光裝置，白色發光裝置，照明裝置及影像顯示裝置
KR100799839B1 (ko) * 2005-03-30 2008-01-31 삼성전기주식회사 파장변환용 형광체 혼합물과 이를 이용한 백색 발광장치
CA2542987A1 (en) * 2005-04-12 2006-10-12 J & J Electronics, Inc. Networkable controllers for led lighting
JP2007049114A (ja) 2005-05-30 2007-02-22 Sharp Corp 発光装置とその製造方法
WO2006129228A2 (en) * 2005-06-02 2006-12-07 Philips Intellectual Property & Standards Gmbh Illumination system comprising color deficiency compensating luminescent material
DE102005035429A1 (de) * 2005-07-28 2007-02-01 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Beleuchtungssystem
US7329907B2 (en) 2005-08-12 2008-02-12 Avago Technologies, Ecbu Ip Pte Ltd Phosphor-converted LED devices having improved light distribution uniformity
US20070040182A1 (en) * 2005-08-16 2007-02-22 Julian Lee Light emitting diode packaging structure
US20070052342A1 (en) * 2005-09-01 2007-03-08 Sharp Kabushiki Kaisha Light-emitting device
JP4832995B2 (ja) * 2005-09-01 2011-12-07 シャープ株式会社 発光装置
EP1934652B1 (en) * 2005-10-04 2012-02-22 Philips Intellectual Property & Standards GmbH A laser projection system based on a luminescent screen
JP2007165811A (ja) 2005-12-16 2007-06-28 Nichia Chem Ind Ltd 発光装置
JP2007180377A (ja) * 2005-12-28 2007-07-12 Sharp Corp 発光装置
CN101473453B (zh) 2006-01-20 2014-08-27 科锐公司 通过在空间上隔开荧光片转换固态光发射器内的光谱内容
KR100735488B1 (ko) * 2006-02-03 2007-07-04 삼성전기주식회사 질화갈륨계 발광다이오드 소자의 제조방법
DE102006008300A1 (de) * 2006-02-22 2007-08-30 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff sowie Herstellverfahren für den Leuchtstoff
JP2007266579A (ja) * 2006-02-28 2007-10-11 Toshiba Lighting & Technology Corp 発光装置
JP5032043B2 (ja) 2006-03-27 2012-09-26 豊田合成株式会社 フェラスメタルアルカリ土類金属ケイ酸塩混合結晶蛍光体およびこれを用いた発光装置
JP4473284B2 (ja) * 2006-03-31 2010-06-02 Ｄｏｗａエレクトロニクス株式会社 発光装置およびその製造方法
JP4637781B2 (ja) * 2006-03-31 2011-02-23 昭和電工株式会社 ＧａＮ系半導体発光素子の製造方法
US8469760B2 (en) * 2006-03-31 2013-06-25 Dowa Electronics Materials Co., Ltd. Light emitting device and method for producing same
JP2007300069A (ja) * 2006-04-04 2007-11-15 Toyoda Gosei Co Ltd 発光素子、この発光素子を用いた発光装置及びこの発光素子の製造方法
JP5091421B2 (ja) * 2006-04-07 2012-12-05 株式会社東芝 半導体発光装置
EP2009486A4 (en) * 2006-04-19 2009-12-09 Mitsubishi Chem Corp COLOR IMAGE DISPLAY DEVICE
EP2007848B1 (en) * 2006-04-19 2009-08-26 Basf Se Inorganic optical brightener
US8129905B2 (en) * 2006-05-26 2012-03-06 Panasonic Corporation Phosphor and light emitting device using the phosphor
JP5367218B2 (ja) 2006-11-24 2013-12-11 シャープ株式会社 蛍光体の製造方法および発光装置の製造方法
KR100834140B1 (ko) * 2006-12-21 2008-06-02 서울반도체 주식회사 발광 다이오드 패키지 제조방법
TW200834968A (en) * 2007-02-13 2008-08-16 Harvatek Corp Method of making light-emitting diode structure with high heat dissipation effect and structure made thereby
JP5325208B2 (ja) * 2007-05-08 2013-10-23 クリー インコーポレイテッド 照明デバイスおよび照明方法
TWI349694B (en) * 2007-05-14 2011-10-01 Univ Nat Chiao Tung A novel phosphor for white light-emitting diodes and fabrication of the same
WO2009012301A2 (en) * 2007-07-16 2009-01-22 Lumination Llc Red line emitting complex fluoride phosphors activated with mn4+
JPWO2009011205A1 (ja) * 2007-07-19 2010-09-16 シャープ株式会社 発光装置
TWI416756B (zh) * 2007-08-30 2013-11-21 Nichia Corp 發光裝置
JP2009056248A (ja) * 2007-09-03 2009-03-19 Fujifilm Corp 光源装置、および光源装置の駆動制御方法、並びに内視鏡
WO2009072029A2 (en) * 2007-12-03 2009-06-11 Philips Intellectual Property & Standards Gmbh Ceramic material for leds with reduced scattering and method of making the same
JP4594407B2 (ja) 2008-03-19 2010-12-08 国立大学法人 新潟大学 近紫外線励起発光素子用蛍光体
EP2262816A4 (en) * 2008-03-21 2012-02-29 Nanogram Corp SUBMICRONIC PHOSPHORUS PARTICLES BASED ON METAL SILICON NITRIDE OR METAL SILICON OXYNITRIDES AND METHODS OF SYNTHESIZING THESE PHOSPHORES
DE102008021662A1 (de) 2008-04-30 2009-11-05 Ledon Lighting Jennersdorf Gmbh LED mit Mehrband-Leuchtstoffsystem
JPWO2009144922A1 (ja) * 2008-05-30 2011-10-06 株式会社東芝 白色ｌｅｄおよびそれを用いたバックライトならびに液晶表示装置
KR20100030470A (ko) 2008-09-10 2010-03-18 삼성전자주식회사 다양한 색 온도의 백색광을 제공할 수 있는 발광 장치 및 발광 시스템
US8125327B2 (en) * 2008-09-11 2012-02-28 Edward J. Ognibene Method for increasing vehicle brake/safety/hazard light visibility
JP5451280B2 (ja) * 2008-10-09 2014-03-26 キヤノン株式会社 ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置
JP5360370B2 (ja) * 2008-11-14 2013-12-04 独立行政法人物質・材料研究機構 発光装置
CN101806429B (zh) * 2009-02-13 2011-12-21 亿光电子工业股份有限公司 彩色发光装置
JP4873024B2 (ja) * 2009-02-23 2012-02-08 ウシオ電機株式会社 光源装置
JP5686724B2 (ja) * 2009-02-23 2015-03-18 株式会社東芝 固体シンチレータ、放射線検出器およびｘ線断層写真撮影装置
KR101004713B1 (ko) * 2009-04-22 2011-01-04 주식회사 에피밸리 디스플레이의 디밍 제어방법
JP5777520B2 (ja) * 2009-09-17 2015-09-09 株式会社東芝 白色発光ランプおよびそれを用いた白色ｌｅｄ照明装置
EP2480816A1 (en) 2009-09-25 2012-08-01 Cree, Inc. Lighting device with low glare and high light level uniformity
US9039933B2 (en) * 2010-03-01 2015-05-26 University Of Georgia Research Foundation, Inc. Eu2+-activated aluminates nanobelts, whiskers, and powders, methods of making the same, and uses thereof
CN102725872A (zh) 2010-03-10 2012-10-10 松下电器产业株式会社 Led包封树脂体，led装置和led装置的制造方法
CN102194970B (zh) * 2010-03-12 2014-06-25 四川新力光源股份有限公司 脉冲电流驱动的白光led照明装置
WO2011132394A1 (ja) * 2010-04-20 2011-10-27 パナソニック株式会社 発光ダイオード
CN102376860A (zh) 2010-08-05 2012-03-14 夏普株式会社 发光装置及其制造方法
KR20140003394A (ko) * 2010-09-21 2014-01-09 쿠오-쿠앙 창 발광 다이오드 패키지를 제조하기 위한 방법
CN102074607B (zh) * 2010-10-21 2012-12-12 罗维鸿 多晶硅太阳能电池及其绿色辐射转换层
WO2012073177A1 (en) * 2010-12-01 2012-06-07 Koninklijke Philips Electronics N.V. Red emitting luminescent materials
WO2012120433A1 (en) * 2011-03-10 2012-09-13 Koninklijke Philips Electronics N.V. Phosphor composition for leds
JP5992174B2 (ja) * 2011-03-31 2016-09-14 シャープ株式会社 窒化物半導体発光素子およびその製造方法
KR101212654B1 (ko) * 2011-05-20 2012-12-14 (주)라이타이저코리아 발광 다이오드 패키지 및 그의 제조 방법
CN107068838B (zh) * 2011-06-03 2021-11-30 西铁城电子株式会社 用于展示展示物的装置和用于展示展示物的系统
DE102011115879A1 (de) * 2011-10-12 2013-04-18 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Leuchtstoffe
KR101863548B1 (ko) 2011-11-23 2018-06-05 삼성전자주식회사 산질화물계 형광체 및 이를 포함하는 발광장치
TWI451164B (zh) * 2011-12-20 2014-09-01 Au Optronics Corp 液晶顯示器之濾光單元與液晶顯示器
JP5886070B2 (ja) * 2012-02-09 2016-03-16 デンカ株式会社 蛍光体及び発光装置
WO2013129854A1 (ko) * 2012-02-27 2013-09-06 경기대학교 산학협력단 실리콘 산질화물 형광체, 이의 제조 방법 및 이를 포함하는 광소자
CN104335367A (zh) * 2012-05-21 2015-02-04 株式会社Del 具有板上芯片封装型的封装基板的发光装置及其制造方法
KR102007373B1 (ko) * 2012-07-03 2019-08-06 삼성디스플레이 주식회사 나노 형광체 제조 방법, 발광 다이오드 및 발광 다이오드 제조 방법
JP2014022472A (ja) * 2012-07-13 2014-02-03 Sharp Corp 発光装置、照明装置および発光方法
KR101963221B1 (ko) * 2012-10-15 2019-03-28 엘지이노텍 주식회사 발광 소자 패키지
TWI448538B (zh) 2012-10-23 2014-08-11 Ind Tech Res Inst 螢光材料與紫外光發光裝置
US8933478B2 (en) 2013-02-19 2015-01-13 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
US8754435B1 (en) 2013-02-19 2014-06-17 Cooledge Lighting Inc. Engineered-phosphor LED package and related methods
JP6240962B2 (ja) * 2013-09-25 2017-12-06 国立研究開発法人物質・材料研究機構 蛍光体及びその製造方法並びにこれを用いた発光装置
US9837585B2 (en) * 2013-11-08 2017-12-05 Lumimicro Corp. Ltd. Light emitting device
JP2015131898A (ja) * 2014-01-10 2015-07-23 電気化学工業株式会社 蛍光体及び発光装置
KR102214067B1 (ko) * 2014-02-27 2021-02-09 엘지전자 주식회사 산 질화물 형광체, 그 제조 방법 및 이를 이용한 발광 소자 패키지
US9200198B1 (en) 2014-08-28 2015-12-01 Lightscape Materials, Inc. Inorganic phosphor and light emitting devices comprising same
US9315725B2 (en) 2014-08-28 2016-04-19 Lightscape Materials, Inc. Method of making EU2+ activated inorganic red phosphor
US9200199B1 (en) 2014-08-28 2015-12-01 Lightscape Materials, Inc. Inorganic red phosphor and lighting devices comprising same
JPWO2016092743A1 (ja) * 2014-12-12 2017-11-24 パナソニックＩｐマネジメント株式会社 発光装置
JP6428245B2 (ja) * 2014-12-19 2018-11-28 日亜化学工業株式会社 発光装置
JP6544082B2 (ja) * 2015-06-30 2019-07-17 日亜化学工業株式会社 発光装置
CN105838371A (zh) * 2016-04-27 2016-08-10 山东盈光新材料有限公司 一种led用氮氧化物荧光粉及制备方法
JP6740762B2 (ja) * 2016-07-13 2020-08-19 日亜化学工業株式会社 発光装置およびその製造方法
JP6772621B2 (ja) * 2016-07-27 2020-10-21 日亜化学工業株式会社 発光装置
US11394176B2 (en) * 2017-07-24 2022-07-19 Panasonic Intellectual Property Management Co., Ltd. Light emitting device
JP2019062173A (ja) * 2017-09-26 2019-04-18 パナソニックＩｐマネジメント株式会社 照明装置、及び、発光装置
US11387390B2 (en) 2017-11-27 2022-07-12 Nichia Corporation Method for producing wavelength converting member, and wavelength converting member
JP6923804B2 (ja) * 2017-12-08 2021-08-25 日亜化学工業株式会社 波長変換部材及びその製造方法
JP6912728B2 (ja) * 2018-03-06 2021-08-04 日亜化学工業株式会社 発光装置及び光源装置
CN110342939A (zh) * 2018-04-06 2019-10-18 日亚化学工业株式会社 陶瓷复合体的制造方法、陶瓷复合体和发光装置
JP2019191425A (ja) * 2018-04-26 2019-10-31 シャープ株式会社 制御装置、プログラム、電子機器および制御方法
WO2020001334A1 (zh) * 2018-06-25 2020-01-02 欧普照明股份有限公司 一种光源模组及包括该光源模组的照明装置
EP3614045B1 (en) * 2018-08-20 2021-11-03 Nichia Corporation Fluorescent module and illumination device
WO2020132559A1 (en) * 2018-12-21 2020-06-25 The Johns Hopkins University Melanin based bio-composites for 3d printing
CN109713111A (zh) * 2019-01-16 2019-05-03 浙江鸿大光电科技有限公司 一种直插式led灯珠及其封装工艺
FR3095731A1 (fr) 2019-04-30 2020-11-06 Stmicroelectronics (Grenoble 2) Sas Système et procédé de mesure de lumière ambiante
EP3855417A1 (en) 2020-01-24 2021-07-28 STMicroelectronics (Research & Development) Limited Method and device for ambient light measurement
US11592166B2 (en) 2020-05-12 2023-02-28 Feit Electric Company, Inc. Light emitting device having improved illumination and manufacturing flexibility
US11876042B2 (en) 2020-08-03 2024-01-16 Feit Electric Company, Inc. Omnidirectional flexible light emitting device

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6680569B2 (en) 1999-02-18 2004-01-20 Lumileds Lighting U.S. Llc Red-deficiency compensating phosphor light emitting device
US6351069B1 (en) * 1999-02-18 2002-02-26 Lumileds Lighting, U.S., Llc Red-deficiency-compensating phosphor LED
JP2001111114A (ja) 1999-10-06 2001-04-20 Sony Corp 白色ｌｅｄ
EP1104799A1 (en) 1999-11-30 2001-06-06 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Red emitting luminescent material
JP3763719B2 (ja) * 2000-02-02 2006-04-05 独立行政法人科学技術振興機構 オキシ窒化物ガラスを母体材料とした蛍光体
JP2001236034A (ja) 2000-02-22 2001-08-31 Sharp Corp 表示装置
JP2001332394A (ja) 2000-05-23 2001-11-30 Sharp Corp 光変調情報表示装置および照明制御装置
US6956555B2 (en) * 2000-05-02 2005-10-18 Sharp Kabushiki Kaisha Light modulation information display device and illumination control device
JP2002076434A (ja) * 2000-08-28 2002-03-15 Toyoda Gosei Co Ltd 発光装置
AT410266B (de) 2000-12-28 2003-03-25 Tridonic Optoelectronics Gmbh Lichtquelle mit einem lichtemittierenden element
DE10105800B4 (de) * 2001-02-07 2017-08-31 Osram Gmbh Hocheffizienter Leuchtstoff und dessen Verwendung
US6417019B1 (en) 2001-04-04 2002-07-09 Lumileds Lighting, U.S., Llc Phosphor converted light emitting diode
JP2002314143A (ja) * 2001-04-09 2002-10-25 Toshiba Corp 発光装置
JP4101468B2 (ja) * 2001-04-09 2008-06-18 豊田合成株式会社 発光装置の製造方法
US7091656B2 (en) * 2001-04-20 2006-08-15 Nichia Corporation Light emitting device
JP4048954B2 (ja) * 2001-04-20 2008-02-20 日亜化学工業株式会社 発光デバイス
JP5157029B2 (ja) 2001-05-31 2013-03-06 日亜化学工業株式会社 蛍光体を用いた発光装置
CN100386888C (zh) * 2001-10-01 2008-05-07 松下电器产业株式会社 发光元件及使用它的发光装置
JP2003147351A (ja) 2001-11-09 2003-05-21 Taiwan Lite On Electronics Inc 白色光光源の製作方法
US6924514B2 (en) * 2002-02-19 2005-08-02 Nichia Corporation Light-emitting device and process for producing thereof
EP1413618A1 (en) * 2002-09-24 2004-04-28 Osram Opto Semiconductors GmbH Luminescent material, especially for LED application
MY149573A (en) * 2002-10-16 2013-09-13 Nichia Corp Oxynitride phosphor and production process thereof, and light-emitting device using oxynitride phosphor
US7026755B2 (en) * 2003-08-07 2006-04-11 General Electric Company Deep red phosphor for general illumination applications

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425650B (zh) * 2004-11-18 2014-02-01 Koninkl Philips Electronics Nv 具改善調光性能之光源
TWI485347B (zh) * 2008-05-19 2015-05-21 Toshiba Kk A linear white light source and a backlight and a liquid crystal display device using the same

Also Published As

Publication number Publication date
EP1670070B1 (en) 2017-05-31
JP5151002B2 (ja) 2013-02-27
JP2005340748A (ja) 2005-12-08
CN100428508C (zh) 2008-10-22
KR101065522B1 (ko) 2011-09-19
KR20060079238A (ko) 2006-07-05
WO2005029596A1 (ja) 2005-03-31
CN1883057A (zh) 2006-12-20
EP1670070A1 (en) 2006-06-14
US20050156496A1 (en) 2005-07-21
TWI307173B (zh) 2009-03-01
EP1670070A4 (en) 2011-08-17
MY143898A (en) 2011-07-29
US7723740B2 (en) 2010-05-25

Similar Documents

Publication Publication Date Title
TW200520262A (en) Light emitting device
TW200624949A (en) Light emitting device, backlight unit for illumination and display device and display device
ATE539135T1 (de) Phosphorzusammensetzung und lichtemittierende vorrichtung damit
WO2006022793A3 (en) Novel phosphor systems for a white light emitting diode (led)
TW200607125A (en) Light emitting device as well as illumination, back light for display and display employing same
EP1354929A3 (en) A phoshor for white led and a white led
TW200637898A (en) Light-emitting component
TW200833998A (en) White light emitting diode module
DE60305958D1 (de) Lichtemittierendes bauelement mit einem eu(ii)-aktivierten leuchtstoff
TW200640031A (en) Multi-wavelength white light light-emitting diode
DE60224798D1 (de) Breitbandige terbium-granat-leuchtstoffe und damit ausgerüstete weisslichtquellen
CA2285507A1 (en) Phosphorous fluorescent light assembly excited by light emitting diodes
WO2004084261A3 (en) Illumination system comprising a radiation source and a fluorescent material
MY134305A (en) Light emitting device
WO2009037848A1 (ja) 照明用白色発光ランプとそれを用いた照明器具
TW200520271A (en) Light-emitting device using light-emitting diode chip
EP1503428A8 (en) Light-emitting device using fluorescent substance
TW200505049A (en) Phosphor based light sources having front illumination
TW200607126A (en) Light emitting element as well as illuminating device and image display device employing the element
TW200644286A (en) White light-emitting lamp, backlight using the same, display and illuminating device
EP1528604A3 (en) Semiconductor light emitting devices with enhanced luminous efficiency
TW200603677A (en) Blue-based organic electro-luminescence element and display device
TW200603443A (en) Light-emitting diode and method of manufacturing the same
TW200632070A (en) Phosphor and method for producing same, and light-emitting device using same and method for manufacturing such device
TW200638558A (en) White light emitting diode device