JP6240962B2 - 蛍光体及びその製造方法並びにこれを用いた発光装置 - Google Patents
蛍光体及びその製造方法並びにこれを用いた発光装置 Download PDFInfo
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- JP6240962B2 JP6240962B2 JP2014168375A JP2014168375A JP6240962B2 JP 6240962 B2 JP6240962 B2 JP 6240962B2 JP 2014168375 A JP2014168375 A JP 2014168375A JP 2014168375 A JP2014168375 A JP 2014168375A JP 6240962 B2 JP6240962 B2 JP 6240962B2
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- phosphor
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/0883—Arsenides; Nitrides; Phosphides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
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Description
(1)一般式CaxEuySi5O3-aN6+bで表され、Ca2Si5O3N6で示される結晶と同一の結晶構造を有し、
1.4≦x<2.0
0.2≦y<0.6
0<a≦1.0
−0.5<b<1.0
ただし1.6≦x+y≦2.0の条件を満たす範囲の組成比の蛍光体である。
(2) 一般式CaxSrzEuySi5O3-aN6+bで表され、Ca2Si5O3N6で示される結晶と同一の結晶構造を有し、
1.4≦x<2.0
0.1≦y<0.6
0.05<z<0.4
0<a≦1.0
−0.5<b<1.0
ただし1.6≦x+y+z≦2.0の条件を満たす範囲の組成比の蛍光体である。
1.4≦x<2.0
0.2≦y<0.6
0<a≦1.0
−0.5<b<1.0
ただし1.6≦x+y≦2.0である。
また、別の一般式ではCaxSrzEuySi5O3-aN6+bで表され、その組成比は以下のようになる。
1.4≦x<2.0
0.1≦y<0.6
0.05<z<0.4
0<a≦1.0
−0.5<b<1.0
ただし1.6≦x+y+z≦2.0である。
(粒径)
(蛍光体の製造方法)
(発光装置)
(発光素子)
(蛍光体)
(封止部材)
(実施例1〜12、比較例1及び2)
(実施例1、2)
(実施例3〜5)
(比較例4、実施例13)
101…発光素子
102…蛍光体
103…封止部材
104…導電性ワイヤ
110…パッケージ
111…リード電極
112…底面
Claims (13)
- 一般式CaxEuySi5O3-aN6+bで表され、Ca2Si5O3N6で示される結晶と同一の結晶構造を有し、
1.4≦x<2.0
0.2≦y<0.6
0<a≦1.0
−0.5<b<1.0
1.6≦x+y≦2.0の条件を満たす範囲の組成比としてなることを特徴とする蛍光体。 - 請求項1に記載の蛍光体であって、
前記x、y、a、bの範囲について、1.5≦x≦1.7、0.25≦y≦0.4、0.3≦a≦1.0、−0.5<b≦0.6であることを特徴とする蛍光体。 - 一般式CaxSrzEuySi5O3-aN6+bで表され、Ca2Si5O3N6で示される結晶と同一の結晶構造を有し、
1.4≦x<2.0
0.1≦y<0.6
0.05<z<0.4
0<a≦1.0
−0.5<b<1.0
1.6≦x+y+z≦2.0の条件を満たす範囲の組成比としてなることを特徴とする蛍光体。 - 請求項3に記載の蛍光体であって、
前記x、y、z、a、bの範囲について、1.4≦x≦1.6、0.15≦y≦0.35、0.1≦z≦0.3、0.4≦a≦1.0、−0.5<b≦0.6であることを特徴とする蛍光体。 - 請求項1〜4のいずれか一に記載の蛍光体であって、
上記蛍光体は、近紫外から可視光の短波領域を吸収し、その際に発光する発光ピークが590nm以上610nm以下の範囲であることを特徴とする蛍光体。 - 請求項1〜5のいずれか一に記載の蛍光体であって、
上記蛍光体は、460nm以下の吸収率が65%以上であり、580nm以上の反射率が70%以上であることを特徴とする記載の蛍光体。 - 請求項1〜6のいずれか一に記載の蛍光体であって、
前記蛍光体のOと(O+N)の比が、0.21≦O/(O+N)≦0.33であることを特徴とする蛍光体。 - 請求項1〜7のいずれか一に記載の蛍光体であって、
前記蛍光体の平均粒径が10μm以上30μm以下で、短径を長径で割ったアスペクト比が0.7以下であることを特徴とする蛍光体。 - 請求項1〜8のいずれか一に記載の蛍光体であって、
前記蛍光体の励起スペクトルにおいて、250nm以上600nm以下の範囲における励起ピーク強度を100%としたとき、460nm以下の範囲における励起率が70%以上であることを特徴とする蛍光体。 - 請求項1〜9のいずれか一に記載の蛍光体の製造方法であって、
前記蛍光体の原料混合物を1200℃以上1800℃以下の温度範囲、窒素雰囲気中、窒素と水素、あるいは窒素とアンモニアとの混合雰囲気中で焼成することを特徴とする蛍光体の製造方法。 - 請求項1〜9のいずれか一に記載の蛍光体の製造方法であって、
前記蛍光体の原料混合物に、焼成温度以下の温度で液相を生成する無機化合物を添加することを特徴する蛍光体の製造方法。 - 請求項11に記載の蛍光体の製造方法であって、
前記無機化合物がLi,Na,K,Cs,Rb,Mg,Ca,Sr,Ba、NH3から選ばれる1種又は2種以上の元素のフッ化物、塩化物、あるいはリン酸塩の1種又は2種以上の混合物であることを特徴とする蛍光体の製造方法。 - 近紫外から可視光の短波長領域内にピーク波長を有する光を放つ励起光源と、
前記励起光源からの光の一部を吸収して蛍光を発する1種類又は2種類以上の蛍光体を有する発光装置であって、
前記蛍光体は、請求項1〜9のいずれか一に記載の蛍光体を含有することを特徴とする発光装置。
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US14/493,570 US20150084083A1 (en) | 2013-09-25 | 2014-09-23 | Phosphor, production method of the phosphor, and light emitting device using the phosphor |
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US10066160B2 (en) * | 2015-05-01 | 2018-09-04 | Intematix Corporation | Solid-state white light generating lighting arrangements including photoluminescence wavelength conversion components |
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CN104024376B (zh) * | 2012-07-25 | 2017-09-01 | 国立研究开发法人物质·材料研究机构 | 荧光体及其制备方法、使用荧光体的发光装置、图像显示装置、颜料及紫外线吸收剂 |
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