TW200512856A - Component mounting apparatus and component mounting method - Google Patents

Component mounting apparatus and component mounting method

Info

Publication number
TW200512856A
TW200512856A TW093125526A TW93125526A TW200512856A TW 200512856 A TW200512856 A TW 200512856A TW 093125526 A TW093125526 A TW 093125526A TW 93125526 A TW93125526 A TW 93125526A TW 200512856 A TW200512856 A TW 200512856A
Authority
TW
Taiwan
Prior art keywords
holding
component
component mounting
board
fed
Prior art date
Application number
TW093125526A
Other languages
English (en)
Inventor
Akira Kabeshita
Kurayasu Hamasaki
Noriyuki Tani
Shozo Minamitani
Yoichi Makino
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of TW200512856A publication Critical patent/TW200512856A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
TW093125526A 2003-08-27 2004-08-26 Component mounting apparatus and component mounting method TW200512856A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003302782A JP4390503B2 (ja) 2003-08-27 2003-08-27 部品実装装置及び部品実装方法

Publications (1)

Publication Number Publication Date
TW200512856A true TW200512856A (en) 2005-04-01

Family

ID=34269188

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093125526A TW200512856A (en) 2003-08-27 2004-08-26 Component mounting apparatus and component mounting method

Country Status (7)

Country Link
US (2) US7437818B2 (zh)
EP (1) EP1661159B1 (zh)
JP (1) JP4390503B2 (zh)
CN (1) CN100394538C (zh)
DE (1) DE602004007275T2 (zh)
TW (1) TW200512856A (zh)
WO (1) WO2005022607A1 (zh)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1029206C2 (nl) * 2005-06-07 2006-12-08 Assembleon Nv Componenttoevoerinrichting alsmede werkwijze.
JP4595740B2 (ja) * 2005-08-16 2010-12-08 パナソニック株式会社 チップ反転装置およびチップ反転方法ならびにチップ搭載装置
US7860600B2 (en) 2006-02-09 2010-12-28 Panasonic Corporation Method of determining pickup order of components
JP4544173B2 (ja) * 2006-02-13 2010-09-15 パナソニック株式会社 電子部品移載装置
CN101496463B (zh) * 2006-07-31 2011-06-22 松下电器产业株式会社 组件安装条件确定方法
JP4938380B2 (ja) * 2006-07-31 2012-05-23 株式会社日立ハイテクインスツルメンツ 部品実装装置
KR20090125151A (ko) * 2007-04-03 2009-12-03 파나소닉 주식회사 부품 실장 방법
JP4824641B2 (ja) * 2007-07-06 2011-11-30 ヤマハ発動機株式会社 部品移載装置
WO2009025016A1 (ja) * 2007-08-17 2009-02-26 Fujitsu Limited 部品実装装置及び方法
KR100960598B1 (ko) * 2008-01-29 2010-06-07 주식회사 탑 엔지니어링 본딩 장비의 웨이퍼 지지 장치
JP5027039B2 (ja) * 2008-03-31 2012-09-19 株式会社日立ハイテクインスツルメンツ 電子部品の装着方法
DE102009016372A1 (de) * 2009-04-07 2010-10-21 Dürr Assembly Products GmbH Vorrichtung und Verfahren zum automatischen Verbinden zweier Werkstücke
JP5384219B2 (ja) * 2009-06-19 2014-01-08 東京エレクトロン株式会社 検査装置におけるプリアライメント方法及びプリアライメント用プログラム
JP2013033888A (ja) * 2011-08-03 2013-02-14 Murata Mfg Co Ltd 実装装置及び実装ユニット
KR101923531B1 (ko) * 2011-12-23 2018-11-30 삼성전자주식회사 반도체 칩 본딩 장치
KR101897825B1 (ko) * 2012-01-02 2018-09-12 세메스 주식회사 다이 본딩 장치
JP5957523B2 (ja) * 2012-05-18 2016-07-27 富士機械製造株式会社 対基板作業システム
JP2014017313A (ja) * 2012-07-06 2014-01-30 Panasonic Corp 部品実装装置
DE102012014558B4 (de) * 2012-07-24 2014-02-20 Datacon Technology Gmbh Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung
US9305812B2 (en) * 2013-03-11 2016-04-05 Texas Instruments Incorporated Die eject assembly for die bonder
TWI514489B (zh) 2013-05-23 2015-12-21 Shinkawa Kk 電子零件安裝裝置以及電子零件的製造方法
US10375870B2 (en) * 2014-02-19 2019-08-06 Fuji Corporation Board work system, and method for managing mounting order of components in board work system
KR102238649B1 (ko) * 2014-09-16 2021-04-09 삼성전자주식회사 반도체 칩 본딩 장치
CN106783713A (zh) * 2015-11-20 2017-05-31 环维电子(上海)有限公司 Sip模组的制造、拾取方法和设备及emi电磁屏蔽层制造方法
CN105742214B (zh) * 2016-03-23 2019-04-09 广东恒鑫智能装备股份有限公司 一种芯片粘贴装置
JP6618412B2 (ja) * 2016-04-01 2019-12-11 株式会社ディスコ 拡張装置
JP6606667B2 (ja) * 2016-09-30 2019-11-20 パナソニックＩｐマネジメント株式会社 部品実装装置
US10219063B1 (en) 2018-04-10 2019-02-26 Acouva, Inc. In-ear wireless device with bone conduction mic communication
CN110842554B (zh) * 2019-12-20 2024-06-07 沈阳益川科技有限公司 一种汽车点烟器自动组装机
CN112366176A (zh) * 2020-11-23 2021-02-12 中芯长电半导体（江阴）有限公司 晶粒拾取装置及方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5694638A (en) 1979-12-27 1981-07-31 Hitachi Ltd Method and device for bonding of pellet
JPS6444100A (en) * 1987-08-12 1989-02-16 Hitachi Ltd Device for mounting electronic component
JP2568623B2 (ja) * 1988-04-12 1997-01-08 松下電器産業株式会社 電子部品の実装方法
DE59202991D1 (de) * 1991-01-28 1995-08-31 Siemens Ag Vorrichtung zum Bestücken von Leiterplatten.
JPH07135228A (ja) 1993-11-11 1995-05-23 Toyota Motor Corp 基板に対する電子部品実装用ダイボンディング装置
JPH08162797A (ja) * 1994-12-08 1996-06-21 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP3301880B2 (ja) * 1995-01-17 2002-07-15 松下電器産業株式会社 部品装着方法及び装置
US6176007B1 (en) * 1995-11-27 2001-01-23 Matsushita Electric Industrial Co., Ltd. Equipment and method for mounting electronic components
JPH09283986A (ja) * 1996-04-18 1997-10-31 Matsushita Electric Ind Co Ltd 部品供給方法及びその装置
JPH1065392A (ja) * 1996-08-19 1998-03-06 Matsushita Electric Ind Co Ltd 電子部品供給装置及び電子部品実装方法
KR100236487B1 (ko) 1997-10-22 2000-01-15 윤종용 정전기 방전 불량을 방지하기 위한 분할형 칩 흡착수단을구비하는 칩 접착 장치
EP0994641B1 (en) * 1998-10-13 2004-10-27 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting electronic component
JP2001135995A (ja) * 1999-11-05 2001-05-18 Matsushita Electric Ind Co Ltd 部品実装装置及び方法
JP4128319B2 (ja) 1999-12-24 2008-07-30 株式会社新川 マルチチップボンディング方法及び装置
JP4480840B2 (ja) 2000-03-23 2010-06-16 パナソニック株式会社 部品実装装置、及び部品実装方法
JP4021614B2 (ja) * 2000-12-11 2007-12-12 株式会社東芝 半導体素子のピックアップ用治具、半導体素子のピックアップ装置、半導体素子のピックアップ方法、半導体装置の製造方法及び半導体装置の製造装置
JP2003007731A (ja) 2001-06-27 2003-01-10 Rohm Co Ltd 半導体チップのマウント方法及びその装置
JP2003059955A (ja) * 2001-08-08 2003-02-28 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
JP3879469B2 (ja) 2001-10-05 2007-02-14 松下電器産業株式会社 電子部品実装装置
JP3636127B2 (ja) 2001-10-12 2005-04-06 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
US6874225B2 (en) * 2001-12-18 2005-04-05 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus

Also Published As

Publication number Publication date
WO2005022607A1 (en) 2005-03-10
EP1661159A1 (en) 2006-05-31
US7437818B2 (en) 2008-10-21
US20070101572A1 (en) 2007-05-10
JP2005072444A (ja) 2005-03-17
CN1823399A (zh) 2006-08-23
CN100394538C (zh) 2008-06-11
DE602004007275T2 (de) 2008-03-13
US8001678B2 (en) 2011-08-23
DE602004007275D1 (de) 2007-08-09
JP4390503B2 (ja) 2009-12-24
EP1661159B1 (en) 2007-06-27
US20090007420A1 (en) 2009-01-08

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