TW200510500A - Adhesive agent and method for producing it - Google Patents

Adhesive agent and method for producing it

Info

Publication number
TW200510500A
TW200510500A TW093114557A TW93114557A TW200510500A TW 200510500 A TW200510500 A TW 200510500A TW 093114557 A TW093114557 A TW 093114557A TW 93114557 A TW93114557 A TW 93114557A TW 200510500 A TW200510500 A TW 200510500A
Authority
TW
Taiwan
Prior art keywords
inorganic filler
binder component
silane coupling
coupling agent
adhesive agent
Prior art date
Application number
TW093114557A
Other languages
English (en)
Inventor
Misao Konishi
Original Assignee
Sony Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Publication of TW200510500A publication Critical patent/TW200510500A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Paints Or Removers (AREA)
TW093114557A 2003-09-02 2004-05-21 Adhesive agent and method for producing it TW200510500A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003310376A JP4896366B2 (ja) 2003-09-02 2003-09-02 接着剤及びその製造方法

Publications (1)

Publication Number Publication Date
TW200510500A true TW200510500A (en) 2005-03-16

Family

ID=34269645

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093114557A TW200510500A (en) 2003-09-02 2004-05-21 Adhesive agent and method for producing it

Country Status (5)

Country Link
JP (1) JP4896366B2 (zh)
KR (1) KR20060126903A (zh)
CN (1) CN100389162C (zh)
TW (1) TW200510500A (zh)
WO (1) WO2005023954A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007091959A (ja) 2005-09-30 2007-04-12 Sumitomo Electric Ind Ltd 異方導電性接着剤
JP4760571B2 (ja) * 2006-06-28 2011-08-31 エプソンイメージングデバイス株式会社 液晶装置、照明装置及び電子機器
JP5016266B2 (ja) 2006-06-30 2012-09-05 三井化学株式会社 光学プラスチックレンズ用プライマー
KR100827535B1 (ko) 2006-12-11 2008-05-06 제일모직주식회사 실란 변성 에폭시 수지를 사용하는 이방 도전성 접착제조성물 및 이를 이용한 접착필름
JP2009275064A (ja) * 2008-05-12 2009-11-26 Sumitomo Bakelite Co Ltd 樹脂組成物
CN101402836B (zh) * 2008-11-12 2011-12-07 哈尔滨工业大学 有机活性胶状物及胶焊非金属与金属材料的方法
JP5263050B2 (ja) * 2009-07-21 2013-08-14 日立化成株式会社 接着剤組成物及びそれを用いた半導体装置の製造方法、半導体装置
JP5520752B2 (ja) 2010-09-01 2014-06-11 株式会社日立製作所 粘着シート，粘着シートを用いた光学部材，有機発光素子および照明装置並びにそれらの製造方法
JP5643623B2 (ja) 2010-12-02 2014-12-17 デクセリアルズ株式会社 異方性導電材料及びその製造方法
JP2013006893A (ja) * 2011-06-22 2013-01-10 Hitachi Chemical Co Ltd 高熱伝導樹脂組成物、高熱伝導性硬化物、接着フィルム、封止用フィルム、及びこれらを用いた半導体装置
TWI816636B (zh) * 2015-10-15 2023-10-01 德商漢高股份有限及兩合公司 鎳及含鎳合金做為黏著劑調配物中之導電填料之用途
CN106916413B (zh) * 2015-12-24 2019-10-11 比亚迪股份有限公司 一种环氧树脂组合物及其制备方法、纤维树脂复合材料、铝/纤维/树脂复合材料
JP7172990B2 (ja) * 2017-03-29 2022-11-16 昭和電工マテリアルズ株式会社 接着剤組成物及び構造体
CN109841779A (zh) * 2017-11-24 2019-06-04 深圳市比亚迪锂电池有限公司 一种电池隔膜及其制备方法和电池
CN109825201A (zh) * 2018-12-26 2019-05-31 张家港康得新光电材料有限公司 一种贴合结构及其制备方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3418432B2 (ja) * 1993-08-27 2003-06-23 旭硝子株式会社 封止用または接着用樹脂組成物
JP3190044B2 (ja) * 1995-04-04 2001-07-16 日立化成工業株式会社 接着剤、接着フィルム及び接着剤付き金属箔
JP3411748B2 (ja) * 1996-05-09 2003-06-03 日立化成工業株式会社 接着剤付き金属箔、接着シート及び多層配線板
JP3787889B2 (ja) * 1996-05-09 2006-06-21 日立化成工業株式会社 多層配線板及びその製造方法
JP3792327B2 (ja) * 1996-12-24 2006-07-05 日立化成工業株式会社 熱伝導性接着剤組成物及び該組成物を用いた熱伝導性接着フィルム
JP3978623B2 (ja) * 1997-06-10 2007-09-19 日立化成工業株式会社 多層配線板
JPH11228929A (ja) * 1997-06-23 1999-08-24 Ind Technol Res Inst 撓み性プリント回路基板用接着剤、その製法および該接着剤を使用する撓み性プリント回路基板の支持体
JP3498537B2 (ja) * 1997-06-25 2004-02-16 日立化成工業株式会社 絶縁層用接着フィルム
JP3347651B2 (ja) * 1997-09-17 2002-11-20 株式会社巴川製紙所 電子部品用接着テープ
JP3410642B2 (ja) * 1997-09-26 2003-05-26 株式会社巴川製紙所 電子部品用耐熱性接着剤組成物
JPH11260838A (ja) * 1998-03-09 1999-09-24 Hitachi Chem Co Ltd 両面接着フィルムを用いて作製した半導体装置
JPH11284114A (ja) * 1998-03-27 1999-10-15 Hitachi Chem Co Ltd 半導体装置
JP3528639B2 (ja) * 1998-11-24 2004-05-17 日立化成工業株式会社 接着剤、接着部材、接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置
JP4014352B2 (ja) * 1999-04-01 2007-11-28 三井化学株式会社 液晶シール剤組成物
JP3904798B2 (ja) * 1999-04-01 2007-04-11 三井化学株式会社 異方導電性ペースト
JP2001040317A (ja) * 1999-08-04 2001-02-13 Toray Ind Inc カバーレイフィルム及び接着剤シートならびにフレキシブル印刷回路基板
JP3527147B2 (ja) * 1999-09-14 2004-05-17 株式会社巴川製紙所 絶縁性接着剤組成物および回路積層材
JP4487473B2 (ja) * 2002-07-08 2010-06-23 日立化成工業株式会社 接着剤組成物、これを用いた接着フィルム、及びこの接着フィルムを用いた半導体装置

Also Published As

Publication number Publication date
JP4896366B2 (ja) 2012-03-14
CN100389162C (zh) 2008-05-21
WO2005023954A1 (ja) 2005-03-17
CN1845977A (zh) 2006-10-11
JP2005075983A (ja) 2005-03-24
KR20060126903A (ko) 2006-12-11

Similar Documents

Publication Publication Date Title
TW200510500A (en) Adhesive agent and method for producing it
TW200702953A (en) Binder resin for toner, toner and method of manufacturing binder resin for toner
UA93695C2 (ru) Композиция связующего для минеральной ваты, связующее для минеральной ваты, способ получения минеральной ваты, изделие и применение композиции
TWI319415B (en) Colloidal silica composition
AU2001229474A1 (en) Catalyst and adsorption composition
PL1846480T3 (pl) Kompozycja powłokowa zdolna do utwardzania
EP1167455A3 (en) Room temperature rapid-curable silicone composition
TW200730479A (en) Selective placement of carbon manotubes through functionalization
UA94071C2 (ru) Композиция связующего для минеральной ваты, связующее для минеральной ваты, способ получения минеральной ваты, изделие и применение
WO2006007368A3 (en) Biofunctional coatings
ATE540960T1 (de) Organosilane und damit gebundenes substrat
AU2002364957A8 (en) Coating process and composition for same
WO2006056206A3 (en) Anti-graffiti coatings
DE69916736D1 (de) Feuchtigkeitshärtbare Verbindungen, die Isocyanat- und Alkoxysilangruppen enthalten
HK1167267A1 (en) Modified hydrocarbylphenol-aldehyde resins for use as tackifiers and rubber compositions containing them
TW200641076A (en) Coating composition containing a low VOC-producing silane
WO2006061091A3 (de) Alpha-aminomethyl-alkoxysilane mit hoher reaktivität und verbesserter stabilität
TW200617095A (en) Polyacetal resin composition
MX2009001221A (es) Composicion adhesiva para dentadura.
TW200502306A (en) Polyacetal composition
WO2007060113A3 (de) VERFAHREN ZUR HERSTELLUNG VON β-KETOCARBONYL-FUNKTIONELLEN ORGANOSILICIUMVERBINDUNGEN
WO2008030437A3 (en) Aqueous compositions of sagging control agents
TW200613308A (en) Cyclobutanetetracarboxylate compound and preparation method thereof
WO2003014236A3 (de) Bindemittelkomponente für oberflächenbeschichtungsmittel mit verbesserten hafteigenschaften
TW200611930A (en) Metal surface treating agent for promoting adhesion of rubber and same metal