TW200510231A - Transportation device, electronic component-handling device, and transportation method in electronic component-handling device - Google Patents

Transportation device, electronic component-handling device, and transportation method in electronic component-handling device

Info

Publication number
TW200510231A
TW200510231A TW093115790A TW93115790A TW200510231A TW 200510231 A TW200510231 A TW 200510231A TW 093115790 A TW093115790 A TW 093115790A TW 93115790 A TW93115790 A TW 93115790A TW 200510231 A TW200510231 A TW 200510231A
Authority
TW
Taiwan
Prior art keywords
electronic component
handling device
transportation
tray
kst
Prior art date
Application number
TW093115790A
Other languages
English (en)
Other versions
TWI250963B (en
Inventor
Kenichi Shimada
Tadashi Kainuma
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200510231A publication Critical patent/TW200510231A/zh
Application granted granted Critical
Publication of TWI250963B publication Critical patent/TWI250963B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Specific Conveyance Elements (AREA)
TW093115790A 2003-06-06 2004-06-02 Transportation device, electronic component-handling device, and transportation method in electronic component-handling device TWI250963B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/007219 WO2004108366A1 (ja) 2003-06-06 2003-06-06 搬送装置、電子部品ハンドリング装置および電子部品ハンドリング装置における搬送方法

Publications (2)

Publication Number Publication Date
TW200510231A true TW200510231A (en) 2005-03-16
TWI250963B TWI250963B (en) 2006-03-11

Family

ID=33495942

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093115790A TWI250963B (en) 2003-06-06 2004-06-02 Transportation device, electronic component-handling device, and transportation method in electronic component-handling device

Country Status (7)

Country Link
US (1) US7471077B2 (zh)
JP (1) JP4500770B2 (zh)
KR (1) KR100747078B1 (zh)
CN (1) CN100511625C (zh)
AU (1) AU2003242260A1 (zh)
TW (1) TWI250963B (zh)
WO (2) WO2004108366A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398638B (zh) * 2008-02-21 2013-06-11 Advantest Corp A method of removing the electronic component, and a control program for carrying out the method
TWI809589B (zh) * 2020-12-22 2023-07-21 韓商泰克元股份有限公司 電子元件輸送裝置及用於處理電子元件的分類機

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US6223071B1 (en) 1998-05-01 2001-04-24 Dusa Pharmaceuticals Inc. Illuminator for photodynamic therapy and diagnosis which produces substantially uniform intensity visible light
AU2003242260A1 (en) * 2003-06-06 2005-01-04 Advantest Corporation Transport device, electronic component handling device, and transporting method for electronic component handling device
KR20050038134A (ko) * 2003-10-21 2005-04-27 삼성전자주식회사 기판 스토킹 시스템
US7479779B2 (en) * 2004-06-08 2009-01-20 Advantest Corporation Image sensor test system
KR100942527B1 (ko) * 2006-10-04 2010-02-12 가부시키가이샤 아드반테스트 전자부품 시험장치
TWI344189B (en) * 2006-11-22 2011-06-21 Mirae Corp Method for transferring test trays in a handler
JP2008227148A (ja) * 2007-03-13 2008-09-25 Micronics Japan Co Ltd 半導体ウエハの試験方法およびその装置
KR200445512Y1 (ko) * 2007-08-17 2009-08-06 (주)테크윙 테스트핸들러용 셋플레이트
JP2010013260A (ja) * 2008-07-04 2010-01-21 Murata Mach Ltd 搬送システム、走行車
WO2010021038A1 (ja) * 2008-08-20 2010-02-25 株式会社アドバンテスト 電子部品ハンドリング装置および電子部品試験システム
JP5635270B2 (ja) * 2009-02-13 2014-12-03 株式会社日立国際電気 基板処理装置及び基板処理システム及び基板処理装置の表示方法及び基板処理装置のパラメータ設定方法及び記録媒体
US7960992B2 (en) * 2009-02-25 2011-06-14 Kingston Technology Corp. Conveyor-based memory-module tester with elevators distributing moving test motherboards among parallel conveyors for testing
CN103025492B (zh) * 2010-12-08 2015-07-22 松下电器产业株式会社 机器人的控制装置以及控制方法、机器人
KR101690711B1 (ko) * 2011-08-19 2016-12-29 한화테크윈 주식회사 트레이 피더 및 이를 이용한 부품 공급 방법
KR102120713B1 (ko) * 2014-03-18 2020-06-11 (주)테크윙 반도체소자 테스트용 핸들러
JP6500233B2 (ja) * 2015-10-27 2019-04-17 パナソニックＩｐマネジメント株式会社 トレイ供給装置およびトレイ供給方法
KR102010276B1 (ko) * 2017-10-16 2019-08-13 (주)테크윙 반도체소자 테스트용 핸들러
KR102483395B1 (ko) * 2017-11-27 2023-01-02 (주)테크윙 전자부품 테스트용 핸들러 및 그 작동 방법
US11348816B2 (en) * 2018-07-31 2022-05-31 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for die container warehousing
US11488848B2 (en) * 2018-07-31 2022-11-01 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated semiconductor die vessel processing workstations
US11294341B2 (en) * 2019-04-16 2022-04-05 Distech Controls Inc. Controlled appliance and method for interacting with a remote control device via the BLE standard
US11308793B2 (en) 2019-04-16 2022-04-19 Distech Controls Inc. Remote control device and method for interacting with a controlled appliance via the BLE standard

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JPH0721732B2 (ja) * 1985-05-16 1995-03-08 富士通株式会社 移動体制御装置
JPH01310882A (ja) * 1988-06-08 1989-12-14 Hitachi Ltd 把持装置
JPH05318363A (ja) * 1992-05-21 1993-12-03 Sanyo Electric Co Ltd ロボットの制御方式
JP3239277B2 (ja) * 1992-07-15 2001-12-17 富士通株式会社 知能ロボット
JPH0682853A (ja) 1992-09-03 1994-03-25 Hitachi Ltd 光周波数変換方式
JPH06155356A (ja) * 1992-11-19 1994-06-03 Daiyu Kk 部材のつかみ装置
JP2595207Y2 (ja) * 1993-04-28 1999-05-24 株式会社アドバンテスト Ｉｃ試験装置用トレイ搬送装置
DE69529501T2 (de) * 1994-04-18 2003-12-11 Micron Technology, Inc. Verfahren und vorrichtung zum automatischen positionieren elektronischer würfel in bauteilverpackungen
US6066822A (en) * 1995-07-28 2000-05-23 Advantest Corporation Semiconductor device testing apparatus and semiconductor device testing system having a plurality of semiconductor device testing apparatus
JPH102931A (ja) * 1996-06-17 1998-01-06 Tescon:Kk バーンインボード検査装置
JPH10163700A (ja) * 1996-12-02 1998-06-19 Yokogawa Precision Kk ハンドラ
JPH10279015A (ja) * 1997-04-10 1998-10-20 Murata Mach Ltd 物品取出装置の制御装置
JP3591679B2 (ja) * 1997-04-17 2004-11-24 株式会社アドバンテスト Ｉｃ用トレイ取出装置及びｉｃ用トレイ収納装置
JPH112657A (ja) * 1997-06-13 1999-01-06 Advantest Corp 複合ｉｃ試験装置
JP4417470B2 (ja) * 1998-05-11 2010-02-17 株式会社アドバンテスト トレイ移送アーム、電子部品ハンドリング装置および電子部品試験装置
JP4018254B2 (ja) * 1998-08-20 2007-12-05 株式会社アドバンテスト 電子部品の試験方法
JP2000133995A (ja) * 1998-10-27 2000-05-12 Matsushita Electric Ind Co Ltd 部品装着方法とその装置
TW533316B (en) * 1998-12-08 2003-05-21 Advantest Corp Testing device for electronic device
JP4054473B2 (ja) * 1999-02-22 2008-02-27 株式会社アドバンテスト 電子部品試験装置および電子部品の試験方法
JP4327335B2 (ja) * 2000-06-23 2009-09-09 株式会社アドバンテスト コンタクトアームおよびこれを用いた電子部品試験装置
JP2003059953A (ja) * 2001-08-08 2003-02-28 Mitsubishi Electric Corp ダイボンディング装置及び方法及び該装置及び方法により製造された半導体素子
JP2003066104A (ja) * 2001-08-22 2003-03-05 Advantest Corp インサートおよびこれを備えた電子部品ハンドリング装置
JP2003159686A (ja) * 2001-09-07 2003-06-03 Mitsubishi Electric Corp 把持装置及び搬送装置
JP2003117879A (ja) * 2001-10-15 2003-04-23 Ckd Corp ウェハ搬送ロボット及びウェハ搬送方法
DE10297654B4 (de) * 2002-03-06 2010-08-05 Advantest Corp. Halteeinsatz und Handhabungsvorrichtung mit einem solchen Halteeinsatz für elektronische Bauelemente
JP4148946B2 (ja) * 2002-07-30 2008-09-10 株式会社アドバンテスト 電子部品試験装置
AU2003242260A1 (en) * 2003-06-06 2005-01-04 Advantest Corporation Transport device, electronic component handling device, and transporting method for electronic component handling device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398638B (zh) * 2008-02-21 2013-06-11 Advantest Corp A method of removing the electronic component, and a control program for carrying out the method
TWI809589B (zh) * 2020-12-22 2023-07-21 韓商泰克元股份有限公司 電子元件輸送裝置及用於處理電子元件的分類機

Also Published As

Publication number Publication date
WO2004109305A1 (ja) 2004-12-16
AU2003242260A1 (en) 2005-01-04
CN1820204A (zh) 2006-08-16
KR100747078B1 (ko) 2007-08-07
TWI250963B (en) 2006-03-11
KR20060019572A (ko) 2006-03-03
WO2004108366A1 (ja) 2004-12-16
US7471077B2 (en) 2008-12-30
JPWO2004109305A1 (ja) 2006-07-20
JP4500770B2 (ja) 2010-07-14
US20060119347A1 (en) 2006-06-08
CN100511625C (zh) 2009-07-08

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