TW200428637A - SOI wafer and production method thereof - Google Patents
SOI wafer and production method thereof Download PDFInfo
- Publication number
- TW200428637A TW200428637A TW093101671A TW93101671A TW200428637A TW 200428637 A TW200428637 A TW 200428637A TW 093101671 A TW093101671 A TW 093101671A TW 93101671 A TW93101671 A TW 93101671A TW 200428637 A TW200428637 A TW 200428637A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- region
- silicon
- oxide film
- soi
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 45
- 239000013078 crystal Substances 0.000 claims abstract description 154
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 143
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 139
- 239000010703 silicon Substances 0.000 claims abstract description 139
- 239000010408 film Substances 0.000 claims abstract description 86
- 238000000151 deposition Methods 0.000 claims abstract description 69
- 238000000034 method Methods 0.000 claims abstract description 69
- 230000002950 deficient Effects 0.000 claims abstract description 8
- 239000010409 thin film Substances 0.000 claims abstract description 7
- 230000007547 defect Effects 0.000 claims description 100
- 238000005468 ion implantation Methods 0.000 claims description 28
- 150000002500 ions Chemical class 0.000 claims description 10
- 238000009395 breeding Methods 0.000 claims 1
- 230000001488 breeding effect Effects 0.000 claims 1
- 238000011534 incubation Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 54
- 238000009413 insulation Methods 0.000 abstract description 24
- 239000011229 interlayer Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 282
- 238000010438 heat treatment Methods 0.000 description 27
- 230000008021 deposition Effects 0.000 description 25
- 238000002474 experimental method Methods 0.000 description 15
- 230000015556 catabolic process Effects 0.000 description 14
- 239000004576 sand Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 11
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 10
- 238000009826 distribution Methods 0.000 description 10
- 239000001301 oxygen Substances 0.000 description 10
- 229910052760 oxygen Inorganic materials 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 229910002804 graphite Inorganic materials 0.000 description 5
- 239000010439 graphite Substances 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 239000010453 quartz Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 230000006378 damage Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 235000014347 soups Nutrition 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000011835 investigation Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000008033 biological extinction Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- -1 hydrogen ions Chemical class 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 235000012149 noodles Nutrition 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 238000013441 quality evaluation Methods 0.000 description 2
- 238000012552 review Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910001423 beryllium ion Inorganic materials 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000009643 growth defect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000007648 laser printing Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
- C30B15/203—Controlling or regulating the relationship of pull rate (v) to axial thermal gradient (G)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Element Separation (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003015072A JP4380162B2 (ja) | 2003-01-23 | 2003-01-23 | Ｓｏｉウエーハ及びその製造方法 |
| JP2003015396A JP2004265904A (ja) | 2003-01-23 | 2003-01-23 | Ｓｏｉウエーハ及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200428637A true TW200428637A (en) | 2004-12-16 |
| TWI305953B TWI305953B (cg-RX-API-DMAC7.html) | 2009-02-01 |
Family
ID=32775181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093101671A TW200428637A (en) | 2003-01-23 | 2004-01-20 | SOI wafer and production method thereof |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7407866B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP1589580B1 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20050088493A (cg-RX-API-DMAC7.html) |
| TW (1) | TW200428637A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2004066390A1 (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI463564B (zh) * | 2008-10-30 | 2014-12-01 | Soitec Silicon On Insulator | 製造半導體薄膜之堆疊的方法 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7813634B2 (en) | 2005-02-28 | 2010-10-12 | Tessera MEMS Technologies, Inc. | Autofocus camera |
| TW200428637A (en) * | 2003-01-23 | 2004-12-16 | Shinetsu Handotai Kk | SOI wafer and production method thereof |
| WO2005024918A1 (ja) * | 2003-09-08 | 2005-03-17 | Sumco Corporation | Ｓｏｉウェーハおよびその製造方法 |
| FR2881573B1 (fr) | 2005-01-31 | 2008-07-11 | Soitec Silicon On Insulator | Procede de transfert d'une couche mince formee dans un substrat presentant des amas de lacunes |
| US7838322B1 (en) * | 2005-02-28 | 2010-11-23 | Tessera MEMS Technologies, Inc. | Method of enhancing an etch system |
| EP2027312B1 (en) * | 2006-05-19 | 2015-02-18 | MEMC Electronic Materials, Inc. | Controlling agglomerated point defect and oxygen cluster formation induced by the lateral surface of a silicon single crystal during cz growth |
| JP2008016534A (ja) * | 2006-07-04 | 2008-01-24 | Sumco Corp | 貼り合わせウェーハの製造方法 |
| CN112735964B (zh) * | 2020-12-23 | 2023-12-22 | 武汉新芯集成电路制造有限公司 | 晶圆表面缺陷检测及表面修复方法 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5037503A (en) * | 1988-05-31 | 1991-08-06 | Osaka Titanium Co., Ltd. | Method for growing silicon single crystal |
| JPH0719738B2 (ja) * | 1990-09-06 | 1995-03-06 | 信越半導体株式会社 | 接合ウェーハ及びその製造方法 |
| JPH08337490A (ja) * | 1995-06-09 | 1996-12-24 | Shin Etsu Handotai Co Ltd | 結晶欠陥の少ないシリコン単結晶及びその製造方法 |
| JPH1140786A (ja) | 1997-07-18 | 1999-02-12 | Denso Corp | 半導体基板及びその製造方法 |
| JP3955375B2 (ja) * | 1998-01-19 | 2007-08-08 | 信越半導体株式会社 | シリコン単結晶の製造方法およびシリコン単結晶ウエーハ |
| JP3932369B2 (ja) | 1998-04-09 | 2007-06-20 | 信越半導体株式会社 | 剥離ウエーハを再利用する方法および再利用に供されるシリコンウエーハ |
| JP3943717B2 (ja) * | 1998-06-11 | 2007-07-11 | 信越半導体株式会社 | シリコン単結晶ウエーハ及びその製造方法 |
| JP3762144B2 (ja) * | 1998-06-18 | 2006-04-05 | キヤノン株式会社 | Ｓｏｉ基板の作製方法 |
| JP3358550B2 (ja) | 1998-07-07 | 2002-12-24 | 信越半導体株式会社 | Ｓｏｉウエーハの製造方法ならびにこの方法で製造されるｓｏｉウエーハ |
| JP3601340B2 (ja) * | 1999-02-01 | 2004-12-15 | 信越半導体株式会社 | エピタキシャルシリコンウエーハおよびその製造方法並びにエピタキシャルシリコンウエーハ用基板 |
| JP3911901B2 (ja) | 1999-04-09 | 2007-05-09 | 信越半導体株式会社 | Ｓｏｉウエーハおよびｓｏｉウエーハの製造方法 |
| JP2001044398A (ja) | 1999-07-30 | 2001-02-16 | Mitsubishi Materials Silicon Corp | 張り合わせ基板およびその製造方法 |
| JP3994602B2 (ja) | 1999-11-12 | 2007-10-24 | 信越半導体株式会社 | シリコン単結晶ウエーハおよびその製造方法並びにｓｏｉウエーハ |
| JP3901092B2 (ja) * | 2000-06-30 | 2007-04-04 | 信越半導体株式会社 | シリコン単結晶の製造方法 |
| JP3994665B2 (ja) * | 2000-12-28 | 2007-10-24 | 信越半導体株式会社 | シリコン単結晶ウエーハおよびシリコン単結晶の製造方法 |
| JP4092946B2 (ja) * | 2002-05-09 | 2008-05-28 | 信越半導体株式会社 | シリコン単結晶ウエーハ及びエピタキシャルウエーハ並びにシリコン単結晶の製造方法 |
| US7129123B2 (en) * | 2002-08-27 | 2006-10-31 | Shin-Etsu Handotai Co., Ltd. | SOI wafer and a method for producing an SOI wafer |
| JP4699675B2 (ja) * | 2002-10-08 | 2011-06-15 | 信越半導体株式会社 | アニールウェーハの製造方法 |
| US7258744B2 (en) * | 2002-12-27 | 2007-08-21 | Shin-Etsu Handotai Co., Ltd. | Graphite heater for producing single crystal, apparatus for producing single crystal, and method for producing single crystal |
| JP4207577B2 (ja) * | 2003-01-17 | 2009-01-14 | 信越半導体株式会社 | Ｐドープシリコン単結晶の製造方法 |
| TW200428637A (en) * | 2003-01-23 | 2004-12-16 | Shinetsu Handotai Kk | SOI wafer and production method thereof |
| JP2004259970A (ja) * | 2003-02-26 | 2004-09-16 | Shin Etsu Handotai Co Ltd | Ｓｏｉウエーハの製造方法及びｓｏｉウエーハ |
| JP4854917B2 (ja) * | 2003-03-18 | 2012-01-18 | 信越半導体株式会社 | Ｓｏｉウェーハ及びその製造方法 |
| JP2005015312A (ja) * | 2003-06-27 | 2005-01-20 | Shin Etsu Handotai Co Ltd | 単結晶の製造方法及び単結晶 |
| JP2005015313A (ja) * | 2003-06-27 | 2005-01-20 | Shin Etsu Handotai Co Ltd | 単結晶の製造方法及び単結晶 |
| JP4193610B2 (ja) * | 2003-06-27 | 2008-12-10 | 信越半導体株式会社 | 単結晶の製造方法 |
| KR20070094726A (ko) * | 2004-10-13 | 2007-09-21 | 신에쯔 한도타이 가부시키가이샤 | 단결정 제조장치 |
-
2004
- 2004-01-20 TW TW093101671A patent/TW200428637A/zh not_active IP Right Cessation
- 2004-01-22 US US10/542,376 patent/US7407866B2/en not_active Expired - Lifetime
- 2004-01-22 WO PCT/JP2004/000547 patent/WO2004066390A1/ja not_active Ceased
- 2004-01-22 KR KR1020057013008A patent/KR20050088493A/ko not_active Ceased
- 2004-01-22 EP EP04704346A patent/EP1589580B1/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI463564B (zh) * | 2008-10-30 | 2014-12-01 | Soitec Silicon On Insulator | 製造半導體薄膜之堆疊的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US7407866B2 (en) | 2008-08-05 |
| US20060113594A1 (en) | 2006-06-01 |
| KR20050088493A (ko) | 2005-09-06 |
| WO2004066390A1 (ja) | 2004-08-05 |
| EP1589580A4 (en) | 2010-01-20 |
| EP1589580B1 (en) | 2012-08-15 |
| EP1589580A1 (en) | 2005-10-26 |
| TWI305953B (cg-RX-API-DMAC7.html) | 2009-02-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |