TW200423279A - Defect inspection apparatus, defect inspection method and inspection method of window pattern - Google Patents
Defect inspection apparatus, defect inspection method and inspection method of window pattern Download PDFInfo
- Publication number
- TW200423279A TW200423279A TW093108291A TW93108291A TW200423279A TW 200423279 A TW200423279 A TW 200423279A TW 093108291 A TW093108291 A TW 093108291A TW 93108291 A TW93108291 A TW 93108291A TW 200423279 A TW200423279 A TW 200423279A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- light
- image
- defect
- optical system
- Prior art date
Links
- 230000007547 defect Effects 0.000 title claims abstract description 68
- 238000007689 inspection Methods 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims description 40
- 239000000758 substrate Substances 0.000 claims abstract description 109
- 230000003287 optical effect Effects 0.000 claims abstract description 43
- 238000005286 illumination Methods 0.000 claims abstract description 39
- 235000013372 meat Nutrition 0.000 claims 1
- 239000002689 soil Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 66
- 230000010287 polarization Effects 0.000 abstract description 15
- 239000002344 surface layer Substances 0.000 abstract description 8
- 238000002310 reflectometry Methods 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 description 23
- 238000010586 diagram Methods 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95692—Patterns showing hole parts, e.g. honeycomb filtering structures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003085185A JP4529366B2 (ja) | 2003-03-26 | 2003-03-26 | 欠陥検査装置、欠陥検査方法及びホールパターンの検査方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200423279A true TW200423279A (en) | 2004-11-01 |
| TWI327348B TWI327348B (enExample) | 2010-07-11 |
Family
ID=33400167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093108291A TW200423279A (en) | 2003-03-26 | 2004-03-26 | Defect inspection apparatus, defect inspection method and inspection method of window pattern |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20040239918A1 (enExample) |
| JP (1) | JP4529366B2 (enExample) |
| KR (2) | KR20040086124A (enExample) |
| CN (1) | CN100549618C (enExample) |
| TW (1) | TW200423279A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI579660B (zh) * | 2014-09-29 | 2017-04-21 | 斯克林集團公司 | 圖像獲取裝置及圖像獲取方法 |
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| KR100456467B1 (ko) * | 2001-12-10 | 2004-11-10 | 재단법인 포항산업과학연구원 | 협죽도과 식물 추출액 및 이를 이용한 녹조 현상 원인녹조류 방제방법 |
| KR100478146B1 (ko) * | 2002-08-30 | 2005-03-22 | 재단법인 포항산업과학연구원 | 협죽도과 식물의 잎 추출물을 함유하는 고려잔디갈색퍼짐병 방제용 조성물 및 이를 이용하여 갈색퍼짐병을방제하는 방법 |
| JP4609089B2 (ja) * | 2005-01-31 | 2011-01-12 | 凸版印刷株式会社 | 周期性パターンムラ検査装置および周期性パターン撮像方法 |
| JP4696607B2 (ja) * | 2005-03-14 | 2011-06-08 | 株式会社ニコン | 表面検査装置 |
| JP2007003376A (ja) * | 2005-06-24 | 2007-01-11 | Toppan Printing Co Ltd | 周期性パターンムラ検査装置および周期性パターン撮像方法 |
| JP4736629B2 (ja) * | 2005-08-26 | 2011-07-27 | 株式会社ニコン | 表面欠陥検査装置 |
| JP2007064948A (ja) * | 2005-09-02 | 2007-03-15 | Nikon Corp | 表面欠陥検査装置および表面欠陥検査方法 |
| TR201802704T4 (tr) * | 2005-10-11 | 2018-03-21 | Bt Imaging Pty Ltd | Dolaylı bant aralığı yarı iletken yapısının denetlenmesi için metot ve sistem. |
| KR100644050B1 (ko) * | 2005-11-02 | 2006-11-10 | 동부일렉트로닉스 주식회사 | 반도체 소자의 감광막 패턴 결함 검사 방법 및 이를 적용한반도체 소자의 콘택홀 형성 방법 |
| JP4699891B2 (ja) | 2005-12-14 | 2011-06-15 | シャープ株式会社 | 半導体装置及び半導体装置の外観検査方法 |
| JPWO2007069457A1 (ja) * | 2005-12-14 | 2009-05-21 | 株式会社ニコン | 表面検査装置および表面検査方法 |
| KR100965418B1 (ko) | 2005-12-28 | 2010-06-24 | 엘아이지에이디피 주식회사 | 기판 결함 검출 장치 |
| JP4548385B2 (ja) * | 2006-05-10 | 2010-09-22 | 株式会社ニコン | 表面検査装置 |
| JP4771871B2 (ja) * | 2006-06-15 | 2011-09-14 | Ｈｏｙａ株式会社 | パターン欠陥検査方法、パターン欠陥検査用テストパターン基板、及びパターン欠陥検査装置、並びにフォトマスクの製造方法、及び表示デバイス用基板の製造方法 |
| KR100802980B1 (ko) * | 2006-06-28 | 2008-02-14 | (주)미래컴퍼니 | 액정기판 검사장치 및 검사방법 |
| US7923645B1 (en) | 2007-06-20 | 2011-04-12 | Amkor Technology, Inc. | Metal etch stop fabrication method and structure |
| US7951697B1 (en) | 2007-06-20 | 2011-05-31 | Amkor Technology, Inc. | Embedded die metal etch stop fabrication method and structure |
| US7990546B2 (en) * | 2007-07-16 | 2011-08-02 | Applied Materials Israel, Ltd. | High throughput across-wafer-variation mapping |
| JP2009031212A (ja) * | 2007-07-30 | 2009-02-12 | Nikon Corp | 表面検査装置および表面検査方法 |
| US7958626B1 (en) | 2007-10-25 | 2011-06-14 | Amkor Technology, Inc. | Embedded passive component network substrate fabrication method |
| JPWO2009125805A1 (ja) * | 2008-04-09 | 2011-08-04 | 株式会社ニコン | 表面検査方法および表面検査装置 |
| JP2009300216A (ja) * | 2008-06-12 | 2009-12-24 | Nikon Corp | 観察装置 |
| US8724882B2 (en) * | 2008-07-29 | 2014-05-13 | Applied Materials Israel, Ltd. | Mapping variations of a surface |
| JPWO2011001678A1 (ja) * | 2009-07-01 | 2012-12-10 | 株式会社ニコン | 露光条件設定方法および表面検査装置 |
| KR101640456B1 (ko) | 2010-03-15 | 2016-07-19 | 삼성전자주식회사 | 디스플레이 패널의 각 픽셀들의 개구부를 통해 촬영하는 촬영 장치 및 방법 |
| CN103038603A (zh) * | 2010-07-30 | 2013-04-10 | 克拉-坦科股份有限公司 | 用于晶片锯痕的三维检查的装置和方法 |
| JP5601984B2 (ja) * | 2010-11-16 | 2014-10-08 | 東洋鋼鈑株式会社 | 多孔板表面検査方法及び多孔板表面検査装置 |
| US8791501B1 (en) | 2010-12-03 | 2014-07-29 | Amkor Technology, Inc. | Integrated passive device structure and method |
| JP5924267B2 (ja) | 2010-12-14 | 2016-05-25 | 株式会社ニコン | 検査方法、検査装置、露光管理方法、露光システムおよび半導体デバイスの製造方法 |
| CN103384822A (zh) * | 2011-02-25 | 2013-11-06 | 株式会社尼康 | 检查装置及半导体装置的制造方法 |
| KR101376450B1 (ko) * | 2011-06-01 | 2014-03-19 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 화상취득장치, 패턴검사장치 및 화상취득방법 |
| TW201329651A (zh) * | 2011-11-29 | 2013-07-16 | 尼康股份有限公司 | 測定裝置、測定方法、及半導體元件製造方法 |
| KR101376831B1 (ko) * | 2012-03-27 | 2014-03-20 | 삼성전기주식회사 | 표면결함 검사방법 |
| TWI557406B (zh) * | 2014-04-04 | 2016-11-11 | Nuflare Technology Inc | An imaging device, a defect inspection device, and a defect inspection method |
| US9606069B2 (en) * | 2014-06-25 | 2017-03-28 | Kla-Tencor Corporation | Method, apparatus and system for generating multiple spatially separated inspection regions on a substrate |
| US10712289B2 (en) * | 2014-07-29 | 2020-07-14 | Kla-Tencor Corp. | Inspection for multiple process steps in a single inspection process |
| CN106168466B (zh) | 2015-05-21 | 2019-06-28 | 财团法人工业技术研究院 | 全域式影像检测系统及其检测方法 |
| CN105021130B (zh) * | 2015-08-04 | 2018-08-24 | 浙江大学台州研究院 | 一种石英晶片尺寸的测量方法 |
| JP6630527B2 (ja) * | 2015-09-30 | 2020-01-15 | 日東電工株式会社 | 貫通孔を有する粘着フィルムの検査方法 |
| JP6688184B2 (ja) * | 2016-07-20 | 2020-04-28 | 東レエンジニアリング株式会社 | ワイドギャップ半導体基板の欠陥検査装置 |
| US10429318B2 (en) | 2017-12-19 | 2019-10-01 | Industrial Technology Research Institute | Detection system for a multilayer film and method thereof using dual image capture devices for capturing forward scattered light and back scattered light |
| US20190355110A1 (en) * | 2018-05-15 | 2019-11-21 | Camtek Ltd. | Cross talk reduction |
| KR102486442B1 (ko) | 2019-06-07 | 2023-01-09 | 주식회사 엘지화학 | 편광판의 액정얼룩 검사장치 및 편광판의 액정얼룩 검사방법 |
| KR20200129033A (ko) * | 2020-03-03 | 2020-11-17 | 주식회사 코엠에스 | 반도체 기판 보호필름 박리 여부 감시 장치 및 방법 |
| CN114061491A (zh) * | 2021-11-30 | 2022-02-18 | 北京理工大学珠海学院 | 一种用激光观测微孔缺陷的方法 |
| CN114324369B (zh) * | 2022-03-11 | 2022-06-07 | 北京新研创能科技有限公司 | 双极板表面划痕检测系统及方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH0646182B2 (ja) * | 1986-06-27 | 1994-06-15 | 株式会社日立製作所 | マスク上の異物検査装置およびその方法 |
| JP3366682B2 (ja) * | 1993-03-25 | 2003-01-14 | グローリー工業株式会社 | ハードディスクの欠陥検出方法 |
| JP3712481B2 (ja) * | 1995-12-28 | 2005-11-02 | 富士通株式会社 | 半導体装置の製造方法 |
| US5777729A (en) * | 1996-05-07 | 1998-07-07 | Nikon Corporation | Wafer inspection method and apparatus using diffracted light |
| US5973777A (en) * | 1996-06-25 | 1999-10-26 | Hitachi, Ltd. | Method and apparatus for inspecting defects of surface shape |
| JPH10206337A (ja) * | 1997-01-17 | 1998-08-07 | Nikon Corp | 半導体ウエハの自動外観検査装置 |
| JPH10233374A (ja) * | 1997-02-19 | 1998-09-02 | Hitachi Ltd | 半導体装置の製造方法およびそのシステム |
| US6690469B1 (en) * | 1998-09-18 | 2004-02-10 | Hitachi, Ltd. | Method and apparatus for observing and inspecting defects |
| JP3676092B2 (ja) * | 1998-09-28 | 2005-07-27 | 株式会社リコー | 表面欠陥検査装置 |
| JP2000310512A (ja) * | 1999-04-28 | 2000-11-07 | Hitachi Ltd | 薄膜の膜厚計測方法及びその装置並びにそれを用いた薄膜デバイスの製造方法及びその装置 |
| JP3769996B2 (ja) * | 1999-09-20 | 2006-04-26 | 三菱電機株式会社 | 欠陥検査用半導体基板、半導体基板の検査方法および半導体基板検査用モニター装置 |
| JP4469047B2 (ja) * | 2000-01-27 | 2010-05-26 | 株式会社日立ハイテクノロジーズ | 表面検査装置 |
| US6646735B2 (en) * | 2000-09-13 | 2003-11-11 | Nikon Corporation | Surface inspection apparatus and surface inspection method |
| TWI285738B (en) * | 2000-09-26 | 2007-08-21 | Olympus Corp | Defect detecting apparatus and computer readable medium |
| JP4153652B2 (ja) * | 2000-10-05 | 2008-09-24 | 株式会社東芝 | パターン評価装置及びパターン評価方法 |
| US6768543B1 (en) * | 2001-11-01 | 2004-07-27 | Arun Ananth Aiyer | Wafer inspection apparatus with unique illumination methodology and method of operation |
-
2003
- 2003-03-26 JP JP2003085185A patent/JP4529366B2/ja not_active Expired - Lifetime
- 2003-11-13 KR KR1020030079988A patent/KR20040086124A/ko not_active Ceased
- 2003-12-23 CN CNB2003101230055A patent/CN100549618C/zh not_active Expired - Lifetime
-
2004
- 2004-03-22 US US10/805,240 patent/US20040239918A1/en not_active Abandoned
- 2004-03-26 TW TW093108291A patent/TW200423279A/zh not_active IP Right Cessation
-
2012
- 2012-01-27 KR KR1020120008327A patent/KR101203027B1/ko not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI579660B (zh) * | 2014-09-29 | 2017-04-21 | 斯克林集團公司 | 圖像獲取裝置及圖像獲取方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20040239918A1 (en) | 2004-12-02 |
| JP2004294194A (ja) | 2004-10-21 |
| KR20040086124A (ko) | 2004-10-08 |
| CN100549618C (zh) | 2009-10-14 |
| KR101203027B1 (ko) | 2012-11-21 |
| TWI327348B (enExample) | 2010-07-11 |
| JP4529366B2 (ja) | 2010-08-25 |
| KR20120023160A (ko) | 2012-03-12 |
| CN1532518A (zh) | 2004-09-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |