KR20040086124A - 결함검사장치, 결함검사방법 및 홀 패턴 검사방법 - Google Patents

결함검사장치, 결함검사방법 및 홀 패턴 검사방법 Download PDF

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Publication number
KR20040086124A
KR20040086124A KR1020030079988A KR20030079988A KR20040086124A KR 20040086124 A KR20040086124 A KR 20040086124A KR 1020030079988 A KR1020030079988 A KR 1020030079988A KR 20030079988 A KR20030079988 A KR 20030079988A KR 20040086124 A KR20040086124 A KR 20040086124A
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KR
South Korea
Prior art keywords
substrate
light
image
defect
optical system
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Ceased
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KR1020030079988A
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English (en)
Korean (ko)
Inventor
마리 수기하라
다께오 오모리
가즈히꼬 후까자와
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가부시키가이샤 니콘
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Publication of KR20040086124A publication Critical patent/KR20040086124A/ko
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95692—Patterns showing hole parts, e.g. honeycomb filtering structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020030079988A 2003-03-26 2003-11-13 결함검사장치, 결함검사방법 및 홀 패턴 검사방법 Ceased KR20040086124A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003085185A JP4529366B2 (ja) 2003-03-26 2003-03-26 欠陥検査装置、欠陥検査方法及びホールパターンの検査方法
JPJP-P-2003-00085185 2003-03-26

Related Child Applications (1)

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KR1020120008327A Division KR101203027B1 (ko) 2003-03-26 2012-01-27 결함검사장치, 결함검사방법 및 홀 패턴 검사방법

Publications (1)

Publication Number Publication Date
KR20040086124A true KR20040086124A (ko) 2004-10-08

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ID=33400167

Family Applications (2)

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KR1020030079988A Ceased KR20040086124A (ko) 2003-03-26 2003-11-13 결함검사장치, 결함검사방법 및 홀 패턴 검사방법
KR1020120008327A Expired - Lifetime KR101203027B1 (ko) 2003-03-26 2012-01-27 결함검사장치, 결함검사방법 및 홀 패턴 검사방법

Family Applications After (1)

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KR1020120008327A Expired - Lifetime KR101203027B1 (ko) 2003-03-26 2012-01-27 결함검사장치, 결함검사방법 및 홀 패턴 검사방법

Country Status (5)

Country Link
US (1) US20040239918A1 (enExample)
JP (1) JP4529366B2 (enExample)
KR (2) KR20040086124A (enExample)
CN (1) CN100549618C (enExample)
TW (1) TW200423279A (enExample)

Cited By (4)

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KR100644050B1 (ko) * 2005-11-02 2006-11-10 동부일렉트로닉스 주식회사 반도체 소자의 감광막 패턴 결함 검사 방법 및 이를 적용한반도체 소자의 콘택홀 형성 방법
KR100802980B1 (ko) * 2006-06-28 2008-02-14 (주)미래컴퍼니 액정기판 검사장치 및 검사방법
KR101376450B1 (ko) * 2011-06-01 2014-03-19 다이닛뽕스크린 세이조오 가부시키가이샤 화상취득장치, 패턴검사장치 및 화상취득방법
US9100563B2 (en) 2010-03-15 2015-08-04 Samsung Electronics Co., Ltd. Apparatus, method and computer-readable medium imaging through at least one aperture of each pixel of display panel

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KR100456467B1 (ko) * 2001-12-10 2004-11-10 재단법인 포항산업과학연구원 협죽도과 식물 추출액 및 이를 이용한 녹조 현상 원인녹조류 방제방법
KR100478146B1 (ko) * 2002-08-30 2005-03-22 재단법인 포항산업과학연구원 협죽도과 식물의 잎 추출물을 함유하는 고려잔디갈색퍼짐병 방제용 조성물 및 이를 이용하여 갈색퍼짐병을방제하는 방법
JP4609089B2 (ja) * 2005-01-31 2011-01-12 凸版印刷株式会社 周期性パターンムラ検査装置および周期性パターン撮像方法
JP4696607B2 (ja) * 2005-03-14 2011-06-08 株式会社ニコン 表面検査装置
JP2007003376A (ja) * 2005-06-24 2007-01-11 Toppan Printing Co Ltd 周期性パターンムラ検査装置および周期性パターン撮像方法
JP4736629B2 (ja) * 2005-08-26 2011-07-27 株式会社ニコン 表面欠陥検査装置
JP2007064948A (ja) * 2005-09-02 2007-03-15 Nikon Corp 表面欠陥検査装置および表面欠陥検査方法
DK1946079T3 (en) * 2005-10-11 2018-03-12 Bt Imaging Pty Ltd PROCEDURE AND SYSTEM FOR INSPECTING INDIRECT BANDWOOD SEMICONDUCTOR STRUCTURE
JP4699891B2 (ja) 2005-12-14 2011-06-15 シャープ株式会社 半導体装置及び半導体装置の外観検査方法
JPWO2007069457A1 (ja) * 2005-12-14 2009-05-21 株式会社ニコン 表面検査装置および表面検査方法
KR100965418B1 (ko) 2005-12-28 2010-06-24 엘아이지에이디피 주식회사 기판 결함 검출 장치
JP4548385B2 (ja) * 2006-05-10 2010-09-22 株式会社ニコン 表面検査装置
JP4771871B2 (ja) * 2006-06-15 2011-09-14 Ｈｏｙａ株式会社 パターン欠陥検査方法、パターン欠陥検査用テストパターン基板、及びパターン欠陥検査装置、並びにフォトマスクの製造方法、及び表示デバイス用基板の製造方法
US7923645B1 (en) 2007-06-20 2011-04-12 Amkor Technology, Inc. Metal etch stop fabrication method and structure
US7951697B1 (en) 2007-06-20 2011-05-31 Amkor Technology, Inc. Embedded die metal etch stop fabrication method and structure
US7990546B2 (en) * 2007-07-16 2011-08-02 Applied Materials Israel, Ltd. High throughput across-wafer-variation mapping
JP2009031212A (ja) * 2007-07-30 2009-02-12 Nikon Corp 表面検査装置および表面検査方法
US7958626B1 (en) 2007-10-25 2011-06-14 Amkor Technology, Inc. Embedded passive component network substrate fabrication method
CN101990636A (zh) * 2008-04-09 2011-03-23 株式会社尼康 表面检查方法和表面检查装置
JP2009300216A (ja) * 2008-06-12 2009-12-24 Nikon Corp 観察装置
US8724882B2 (en) * 2008-07-29 2014-05-13 Applied Materials Israel, Ltd. Mapping variations of a surface
EP2450944A4 (en) * 2009-07-01 2017-12-27 Nikon Corporation Exposure condition setting method and surface inspection apparatus
US9140546B2 (en) 2010-07-30 2015-09-22 Kla-Tencor Corporation Apparatus and method for three dimensional inspection of wafer saw marks
JP5601984B2 (ja) * 2010-11-16 2014-10-08 東洋鋼鈑株式会社 多孔板表面検査方法及び多孔板表面検査装置
US8791501B1 (en) 2010-12-03 2014-07-29 Amkor Technology, Inc. Integrated passive device structure and method
WO2012081587A1 (ja) 2010-12-14 2012-06-21 株式会社ニコン 検査方法、検査装置、露光管理方法、露光システムおよび半導体デバイス
JP6036680B2 (ja) * 2011-02-25 2016-11-30 株式会社ニコン 検査装置および半導体装置の製造方法
JPWO2013081072A1 (ja) * 2011-11-29 2015-04-27 株式会社ニコン 測定装置、測定方法および半導体デバイス製造方法
KR101376831B1 (ko) * 2012-03-27 2014-03-20 삼성전기주식회사 표면결함 검사방법
TWI557406B (zh) * 2014-04-04 2016-11-11 Nuflare Technology Inc An imaging device, a defect inspection device, and a defect inspection method
US9606069B2 (en) * 2014-06-25 2017-03-28 Kla-Tencor Corporation Method, apparatus and system for generating multiple spatially separated inspection regions on a substrate
US10712289B2 (en) * 2014-07-29 2020-07-14 Kla-Tencor Corp. Inspection for multiple process steps in a single inspection process
JP2016070730A (ja) * 2014-09-29 2016-05-09 株式会社Ｓｃｒｅｅｎホールディングス 画像取得装置および画像取得方法
CN106168466B (zh) 2015-05-21 2019-06-28 财团法人工业技术研究院 全域式影像检测系统及其检测方法
CN105021130B (zh) * 2015-08-04 2018-08-24 浙江大学台州研究院 一种石英晶片尺寸的测量方法
JP6630527B2 (ja) * 2015-09-30 2020-01-15 日東電工株式会社 貫通孔を有する粘着フィルムの検査方法
JP6688184B2 (ja) * 2016-07-20 2020-04-28 東レエンジニアリング株式会社 ワイドギャップ半導体基板の欠陥検査装置
US10429318B2 (en) 2017-12-19 2019-10-01 Industrial Technology Research Institute Detection system for a multilayer film and method thereof using dual image capture devices for capturing forward scattered light and back scattered light
US20190355110A1 (en) * 2018-05-15 2019-11-21 Camtek Ltd. Cross talk reduction
KR102486442B1 (ko) 2019-06-07 2023-01-09 주식회사 엘지화학 편광판의 액정얼룩 검사장치 및 편광판의 액정얼룩 검사방법
KR20200129033A (ko) * 2020-03-03 2020-11-17 주식회사 코엠에스 반도체 기판 보호필름 박리 여부 감시 장치 및 방법
CN114061491A (zh) * 2021-11-30 2022-02-18 北京理工大学珠海学院 一种用激光观测微孔缺陷的方法
CN114324369B (zh) * 2022-03-11 2022-06-07 北京新研创能科技有限公司 双极板表面划痕检测系统及方法

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100644050B1 (ko) * 2005-11-02 2006-11-10 동부일렉트로닉스 주식회사 반도체 소자의 감광막 패턴 결함 검사 방법 및 이를 적용한반도체 소자의 콘택홀 형성 방법
KR100802980B1 (ko) * 2006-06-28 2008-02-14 (주)미래컴퍼니 액정기판 검사장치 및 검사방법
US9100563B2 (en) 2010-03-15 2015-08-04 Samsung Electronics Co., Ltd. Apparatus, method and computer-readable medium imaging through at least one aperture of each pixel of display panel
KR101376450B1 (ko) * 2011-06-01 2014-03-19 다이닛뽕스크린 세이조오 가부시키가이샤 화상취득장치, 패턴검사장치 및 화상취득방법

Also Published As

Publication number Publication date
JP2004294194A (ja) 2004-10-21
KR101203027B1 (ko) 2012-11-21
CN100549618C (zh) 2009-10-14
TW200423279A (en) 2004-11-01
TWI327348B (enExample) 2010-07-11
KR20120023160A (ko) 2012-03-12
JP4529366B2 (ja) 2010-08-25
CN1532518A (zh) 2004-09-29
US20040239918A1 (en) 2004-12-02

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