TW200420181A - Light emitting device and a method for manufacturing the same - Google Patents
Light emitting device and a method for manufacturing the sameInfo
- Publication number
- TW200420181A TW200420181A TW092136440A TW92136440A TW200420181A TW 200420181 A TW200420181 A TW 200420181A TW 092136440 A TW092136440 A TW 092136440A TW 92136440 A TW92136440 A TW 92136440A TW 200420181 A TW200420181 A TW 200420181A
- Authority
- TW
- Taiwan
- Prior art keywords
- sealing
- substrates
- manufacturing
- light emitting
- same
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 5
- 239000003566 sealing material Substances 0.000 abstract 4
- 238000007789 sealing Methods 0.000 abstract 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 abstract 2
- 239000002274 desiccant Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3031—Two-side emission, e.g. transparent OLEDs [TOLED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/878—Arrangements for extracting light from the devices comprising reflective means
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Geometry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002378668 | 2002-12-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200420181A true TW200420181A (en) | 2004-10-01 |
TWI352553B TWI352553B (en) | 2011-11-11 |
Family
ID=32677442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092136440A TWI352553B (en) | 2002-12-26 | 2003-12-22 | Light emitting device and a method for manufacturi |
Country Status (6)
Country | Link |
---|---|
US (5) | US7109655B2 (zh) |
JP (1) | JP4610343B2 (zh) |
CN (1) | CN100531484C (zh) |
AU (1) | AU2003296080A1 (zh) |
TW (1) | TWI352553B (zh) |
WO (1) | WO2004060022A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI405496B (zh) * | 2004-12-13 | 2013-08-11 | Sanyo Electric Co | 有機電場發光元件之封裝方法,及發光面板以及顯示面板之製造方法 |
TWI422072B (zh) * | 2009-12-30 | 2014-01-01 | Au Optronics Corp | 上蓋結構及發光元件之封裝結構及發光元件之封裝方法 |
Families Citing this family (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4240276B2 (ja) | 2002-07-05 | 2009-03-18 | 株式会社半導体エネルギー研究所 | 発光装置 |
TWI352553B (en) | 2002-12-26 | 2011-11-11 | Semiconductor Energy Lab | Light emitting device and a method for manufacturi |
KR100552971B1 (ko) * | 2003-10-09 | 2006-02-15 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 장치 |
TWI238675B (en) * | 2004-01-19 | 2005-08-21 | Hitachi Displays Ltd | Organic light-emitting display and its manufacture method |
US7764012B2 (en) * | 2004-04-16 | 2010-07-27 | Semiconductor Energy Laboratory Co., Ltd | Light emitting device comprising reduced frame portion, manufacturing method with improve productivity thereof, and electronic apparatus |
JP2006085957A (ja) * | 2004-09-15 | 2006-03-30 | Tohoku Pioneer Corp | 自発光パネルの製造方法 |
US7791270B2 (en) | 2004-09-17 | 2010-09-07 | Semiconductor Energy Laboratory Co., Ltd | Light-emitting device with reduced deterioration of periphery |
KR100700013B1 (ko) * | 2004-11-26 | 2007-03-26 | 삼성에스디아이 주식회사 | 유기전계발광소자 및 그의 제조 방법 |
JP4631683B2 (ja) * | 2005-01-17 | 2011-02-16 | セイコーエプソン株式会社 | 発光装置、及び電子機器 |
US7572655B2 (en) * | 2005-03-23 | 2009-08-11 | E. I. Du Pont De Nemours And Company | Electronic devices having a layer overlying an edge of a different layer and a process for forming the same |
WO2006104020A1 (en) * | 2005-03-25 | 2006-10-05 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting element, light emitting device and electric appliance using the same |
US8269227B2 (en) * | 2005-06-09 | 2012-09-18 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and electronic device |
US8729795B2 (en) | 2005-06-30 | 2014-05-20 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and electronic device |
US20070007533A1 (en) * | 2005-07-08 | 2007-01-11 | Yi-Tyng Wu | Pixel array strcuture |
JP2007073397A (ja) * | 2005-09-08 | 2007-03-22 | Sony Corp | 表示装置の製造方法および表示装置 |
KR100784557B1 (ko) * | 2006-09-22 | 2007-12-11 | 엘지전자 주식회사 | 전계발광패널 |
KR100770104B1 (ko) * | 2006-09-28 | 2007-10-24 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 장치 및 그 제조 방법과 이를 위한이송 장치 |
JP2008170756A (ja) | 2007-01-12 | 2008-07-24 | Sony Corp | 表示装置 |
JP2008235089A (ja) * | 2007-03-22 | 2008-10-02 | Fuji Electric Holdings Co Ltd | 有機elディスプレイパネルおよびその製造方法 |
US8716850B2 (en) * | 2007-05-18 | 2014-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
US8258696B2 (en) | 2007-06-28 | 2012-09-04 | Samsung Mobile Display Co., Ltd. | Light emitting display and method of manufacturing the same |
US8330339B2 (en) | 2007-06-28 | 2012-12-11 | Samsung Display Co., Ltd. | Light emitting display and method of manufacturing the same |
KR100879864B1 (ko) * | 2007-06-28 | 2009-01-22 | 삼성모바일디스플레이주식회사 | 발광 표시 장치 및 그의 제조 방법 |
KR20090015734A (ko) * | 2007-08-09 | 2009-02-12 | 엘지이노텍 주식회사 | 광원 장치 |
JP2010093068A (ja) * | 2008-10-08 | 2010-04-22 | Hitachi Displays Ltd | 有機el表示装置およびその製造方法 |
KR101319096B1 (ko) * | 2009-02-24 | 2013-10-17 | 엘지디스플레이 주식회사 | 탑 에미션 인버티드형 유기발광 다이오드 표시장치 및 그의제조방법 |
US20110058770A1 (en) * | 2009-09-10 | 2011-03-10 | E. I. Du Pont De Nemours And Company | Sub-surface engraving of oled substrates for improved optical outcoupling |
JP2011119233A (ja) | 2009-11-04 | 2011-06-16 | Canon Inc | 有機el素子とそれを用いた表示装置 |
JP5737550B2 (ja) * | 2009-12-03 | 2015-06-17 | ソニー株式会社 | 表示装置、表示装置の製造方法および電子機器 |
KR101065318B1 (ko) * | 2009-12-03 | 2011-09-16 | 삼성모바일디스플레이주식회사 | 플렉서블 디스플레이 장치의 제조 방법 |
US20130034713A1 (en) * | 2009-12-17 | 2013-02-07 | Busman Stanley C | Display panel assembly and methods of making same |
KR101097337B1 (ko) * | 2010-03-05 | 2011-12-21 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 |
KR101641860B1 (ko) * | 2010-05-12 | 2016-07-29 | 엘지이노텍 주식회사 | 발광소자 어레이, 조명장치 및 백라이트 장치 |
KR101722026B1 (ko) * | 2010-10-22 | 2017-04-12 | 삼성디스플레이 주식회사 | 평판 표시 패널, 평판 표시 패널용 원장기판, 및 평판 표시 패널 제조 방법 |
US8654537B2 (en) | 2010-12-01 | 2014-02-18 | Apple Inc. | Printed circuit board with integral radio-frequency shields |
CN107087343B (zh) * | 2011-05-27 | 2019-04-19 | 夏普株式会社 | 发光装置以及照明装置 |
KR101421168B1 (ko) * | 2011-09-20 | 2014-07-21 | 엘지디스플레이 주식회사 | 유기전계발광 표시소자 및 그 제조방법 |
TWI466352B (zh) * | 2011-09-30 | 2014-12-21 | Au Optronics Corp | 有機電激發光元件陣列及有機電激發光元件 |
JP5959274B2 (ja) * | 2012-03-30 | 2016-08-02 | 古河電気工業株式会社 | 有機エレクトロルミネッセンス素子封止用樹脂組成物、これを用いた有機エレクトロルミネッセンス素子およびディスプレイ装置 |
CN102760841B (zh) * | 2012-07-11 | 2014-11-26 | 深圳市华星光电技术有限公司 | 有机发光二极管器件及相应的显示装置 |
KR101420332B1 (ko) * | 2012-11-14 | 2014-07-16 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치 |
JP5903668B2 (ja) * | 2013-02-21 | 2016-04-13 | パナソニックIpマネジメント株式会社 | 部品実装装置および部品実装方法 |
JP2014160788A (ja) | 2013-02-21 | 2014-09-04 | Panasonic Corp | 部品実装装置および部品実装方法 |
JP6182985B2 (ja) * | 2013-06-05 | 2017-08-23 | セイコーエプソン株式会社 | 電気光学装置、電気光学装置の製造方法、電子機器 |
KR20150071538A (ko) * | 2013-12-18 | 2015-06-26 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조방법 |
KR102178796B1 (ko) * | 2014-01-22 | 2020-11-16 | 삼성디스플레이 주식회사 | 표시 장치 |
JP6439114B2 (ja) * | 2014-03-07 | 2018-12-19 | 株式会社Joled | 表示装置および電子機器 |
KR102223676B1 (ko) * | 2014-06-24 | 2021-03-08 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
US10008611B2 (en) * | 2014-06-26 | 2018-06-26 | Joled Inc. | Thin film transistor and organic EL display device |
TWI755773B (zh) * | 2014-06-30 | 2022-02-21 | 日商半導體能源研究所股份有限公司 | 發光裝置,模組,及電子裝置 |
CN105304508B (zh) * | 2014-07-30 | 2019-10-18 | 日月光半导体制造股份有限公司 | 电子封装模块的制造方法及其结构 |
KR102360783B1 (ko) * | 2014-09-16 | 2022-02-10 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
KR102342804B1 (ko) * | 2014-12-30 | 2021-12-22 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 |
KR102350366B1 (ko) * | 2014-12-31 | 2022-01-11 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 |
CN104505470B (zh) * | 2015-01-04 | 2017-12-08 | 京东方科技集团股份有限公司 | 显示面板及其制作方法以及显示装置 |
US9590005B1 (en) * | 2016-01-25 | 2017-03-07 | Omnivision Technologies, Inc. | High dynamic range image sensor with reduced sensitivity to high intensity light |
KR102627284B1 (ko) * | 2016-05-12 | 2024-01-22 | 엘지디스플레이 주식회사 | 캐소드 전극과 보조 캐소드 전극의 접속구조 형성 방법과 그를 이용한 유기발광 다이오드 표시장치 |
CN108123053A (zh) * | 2016-11-29 | 2018-06-05 | 京东方科技集团股份有限公司 | 发光器件和显示装置 |
CN206774584U (zh) * | 2017-06-06 | 2017-12-19 | 京东方科技集团股份有限公司 | 薄膜封装结构和显示装置 |
CN108428804A (zh) * | 2018-04-19 | 2018-08-21 | 武汉华星光电技术有限公司 | Oled显示面板及其封装方法 |
CN112424969A (zh) | 2018-05-18 | 2021-02-26 | 株式会社半导体能源研究所 | 发光元件、发光装置、电子设备及照明装置 |
CN109524576B (zh) * | 2018-12-13 | 2020-12-29 | 合肥鑫晟光电科技有限公司 | 一种oled显示基板及其制备方法、显示装置 |
WO2021001983A1 (ja) * | 2019-07-04 | 2021-01-07 | 三菱電機株式会社 | 液晶表示装置及び液晶表示装置の製造方法 |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US44035A (en) * | 1864-08-30 | Weeding-hoe | ||
JPS6454420A (en) | 1987-08-25 | 1989-03-01 | Matsushita Electric Ind Co Ltd | Liquid crystal display element |
JPH055890A (ja) | 1991-06-27 | 1993-01-14 | Sanyo Electric Co Ltd | 液晶表示パネルおよびその製造方法 |
DE69524429T2 (de) * | 1994-09-08 | 2002-05-23 | Idemitsu Kosan Co. Ltd., Tokio/Tokyo | Verfahren zur abdichtung eines organischen elektrolumineszenten elements und organisches elektrolumineszentes element |
US6420031B1 (en) * | 1997-11-03 | 2002-07-16 | The Trustees Of Princeton University | Highly transparent non-metallic cathodes |
JP4059968B2 (ja) | 1997-12-18 | 2008-03-12 | Tdk株式会社 | 有機el素子の製造方法 |
JPH11264991A (ja) * | 1998-01-13 | 1999-09-28 | Matsushita Electric Ind Co Ltd | 液晶表示素子の製造方法 |
US6396208B1 (en) * | 1998-01-27 | 2002-05-28 | Nec Corporation | Organic electroluminescent device and its manufacturing process |
JP2000068050A (ja) | 1998-08-24 | 2000-03-03 | Casio Comput Co Ltd | 電界発光素子及びその製造方法 |
TW401631B (en) | 1998-10-23 | 2000-08-11 | Highlight Optoelectronics Inc | Organic light emitting display and its packaging method |
US6608283B2 (en) * | 2000-02-08 | 2003-08-19 | Emagin Corporation | Apparatus and method for solder-sealing an active matrix organic light emitting diode |
JP2001338755A (ja) | 2000-03-21 | 2001-12-07 | Seiko Epson Corp | 有機el素子およびその製造方法 |
TW452952B (en) | 2000-03-30 | 2001-09-01 | Delta Optoelectronics Inc | Packaging method of electro-luminescent device |
WO2001091520A1 (fr) | 2000-05-23 | 2001-11-29 | Nagase & Co., Ltd. | Ecran electroluminescent organique et procede de fabrication de celui-ci |
JP2001345175A (ja) | 2000-06-01 | 2001-12-14 | Stanley Electric Co Ltd | 有機el表示装置 |
JP2002025764A (ja) | 2000-07-05 | 2002-01-25 | Toyota Motor Corp | 有機el素子の封止方法 |
JP3903204B2 (ja) | 2001-01-24 | 2007-04-11 | ソニー株式会社 | 表示装置の製造方法 |
JP3608613B2 (ja) * | 2001-03-28 | 2005-01-12 | 株式会社日立製作所 | 表示装置 |
JP2002299067A (ja) * | 2001-04-03 | 2002-10-11 | Matsushita Electric Ind Co Ltd | El素子及びこれを用いた照光装置 |
JP2002352951A (ja) | 2001-05-24 | 2002-12-06 | Tohoku Pioneer Corp | 有機el表示パネル及びその製造方法 |
JP4894987B2 (ja) * | 2001-06-29 | 2012-03-14 | 三洋電機株式会社 | 表示用パネルの製造方法 |
JP4614588B2 (ja) * | 2001-06-29 | 2011-01-19 | 三洋電機株式会社 | エレクトロルミネッセンス表示装置の製造方法 |
TW502552B (en) | 2001-07-09 | 2002-09-11 | Ind Tech Res Inst | UV-cut film of organic electroluminescent display |
US6664730B2 (en) * | 2001-07-09 | 2003-12-16 | Universal Display Corporation | Electrode structure of el device |
TW511304B (en) | 2001-12-11 | 2002-11-21 | Ind Tech Res Inst | Organic electroluminescent device with fluorine-containing inorganic layer |
TW515062B (en) | 2001-12-28 | 2002-12-21 | Delta Optoelectronics Inc | Package structure with multiple glue layers |
JP4069640B2 (ja) | 2002-02-12 | 2008-04-02 | セイコーエプソン株式会社 | 電気光学装置、及び電子機器 |
US6791660B1 (en) * | 2002-02-12 | 2004-09-14 | Seiko Epson Corporation | Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances |
KR100477745B1 (ko) * | 2002-05-23 | 2005-03-18 | 삼성에스디아이 주식회사 | 유기 전계발광 소자의 봉지방법 및 이를 이용하는 유기전계발광 패널 |
JP4240276B2 (ja) * | 2002-07-05 | 2009-03-18 | 株式会社半導体エネルギー研究所 | 発光装置 |
KR101032337B1 (ko) | 2002-12-13 | 2011-05-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광장치 및 그의 제조방법 |
TWI352553B (en) * | 2002-12-26 | 2011-11-11 | Semiconductor Energy Lab | Light emitting device and a method for manufacturi |
-
2003
- 2003-12-22 TW TW092136440A patent/TWI352553B/zh not_active IP Right Cessation
- 2003-12-22 US US10/744,296 patent/US7109655B2/en not_active Expired - Lifetime
- 2003-12-24 JP JP2004562904A patent/JP4610343B2/ja not_active Expired - Fee Related
- 2003-12-24 CN CNB2003801076332A patent/CN100531484C/zh not_active Expired - Fee Related
- 2003-12-24 AU AU2003296080A patent/AU2003296080A1/en not_active Abandoned
- 2003-12-24 WO PCT/JP2003/016539 patent/WO2004060022A1/ja active Application Filing
-
2006
- 2006-09-06 US US11/516,135 patent/US7948175B2/en not_active Expired - Lifetime
-
2011
- 2011-05-20 US US13/112,238 patent/US8330363B2/en not_active Expired - Fee Related
-
2012
- 2012-12-07 US US13/707,925 patent/US9577218B2/en active Active
-
2017
- 2017-02-14 US US15/432,309 patent/US10103355B2/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI405496B (zh) * | 2004-12-13 | 2013-08-11 | Sanyo Electric Co | 有機電場發光元件之封裝方法,及發光面板以及顯示面板之製造方法 |
TWI422072B (zh) * | 2009-12-30 | 2014-01-01 | Au Optronics Corp | 上蓋結構及發光元件之封裝結構及發光元件之封裝方法 |
US8641469B2 (en) | 2009-12-30 | 2014-02-04 | Au Optronics Corp. | Packaging method of light emitting device |
Also Published As
Publication number | Publication date |
---|---|
CN100531484C (zh) | 2009-08-19 |
WO2004060022A1 (ja) | 2004-07-15 |
US7948175B2 (en) | 2011-05-24 |
US20070052347A1 (en) | 2007-03-08 |
US10103355B2 (en) | 2018-10-16 |
JPWO2004060022A1 (ja) | 2006-05-11 |
AU2003296080A1 (en) | 2004-07-22 |
JP4610343B2 (ja) | 2011-01-12 |
CN1732715A (zh) | 2006-02-08 |
US9577218B2 (en) | 2017-02-21 |
US8330363B2 (en) | 2012-12-11 |
US20170155091A1 (en) | 2017-06-01 |
US7109655B2 (en) | 2006-09-19 |
US20130092919A1 (en) | 2013-04-18 |
US20050040762A1 (en) | 2005-02-24 |
TWI352553B (en) | 2011-11-11 |
US20110221335A1 (en) | 2011-09-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200420181A (en) | Light emitting device and a method for manufacturing the same | |
US8016632B2 (en) | Light emitting display device and method of fabricating the same | |
AU1904000A (en) | Encapsulation for organic led device | |
WO2016086538A1 (zh) | Oled封装结构及oled封装方法 | |
TWI366416B (en) | Hermetically sealed light emitting display device and method of sealing | |
TW200730022A (en) | Organic light emitting display and method of fabricating the same | |
TW200740279A (en) | Organic light emitting display and method of fabricating the same | |
TW200718269A (en) | Organic light emitting display and method of fabricating the same | |
TW200613862A (en) | Substrate surface sealing method and ultraviolet-ray irradiation device for liquid crystal display cell substrate | |
TW200731518A (en) | Semiconductor device and manufacturing method of the same | |
TW200628006A (en) | Hermetically sealed package and method of fabrication of a hermetically sealed package | |
EP1564777A4 (en) | PLASMA DISPLAY PANEL AND METHOD FOR THE PRODUCTION THEREOF | |
EP1965452A3 (en) | Seal for light emitting display device and method | |
TW200739989A (en) | Organic light emitting display device and method of fabricating the same | |
WO2016101403A1 (zh) | Oled封装结构及封装方法 | |
TW200731840A (en) | Method of encapsulating a display element | |
TW200739190A (en) | Electro-optical device, manufacturing method thereof, and electronic apparatus | |
KR100689199B1 (ko) | 유기발광소자의 봉지방법 및 장치 | |
WO2016086533A1 (zh) | Oled封装方法及oled封装结构 | |
TW200702794A (en) | Seal structure, seal method, liquid crystal device, manufacturing method thereof, and projector | |
WO2016123857A1 (zh) | Oled封装方法及oled封装结构 | |
KR100643891B1 (ko) | 봉지 캡을 구비한 유기 발광 소자 패널 | |
TW200501802A (en) | Planar luminescent device including auxiliary electrode | |
WO2003030272A3 (en) | Method for encapsulation of electronic devices | |
CN104282730B (zh) | Oled显示面板、oled显示装置及其制作方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |