TW200420181A - Light emitting device and a method for manufacturing the same - Google Patents

Light emitting device and a method for manufacturing the same

Info

Publication number
TW200420181A
TW200420181A TW092136440A TW92136440A TW200420181A TW 200420181 A TW200420181 A TW 200420181A TW 092136440 A TW092136440 A TW 092136440A TW 92136440 A TW92136440 A TW 92136440A TW 200420181 A TW200420181 A TW 200420181A
Authority
TW
Taiwan
Prior art keywords
sealing
substrates
manufacturing
light emitting
same
Prior art date
Application number
TW092136440A
Other languages
English (en)
Other versions
TWI352553B (en
Inventor
Tomoyuki Kurihara
Original Assignee
Semiconductor Energy Lab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Lab filed Critical Semiconductor Energy Lab
Publication of TW200420181A publication Critical patent/TW200420181A/zh
Application granted granted Critical
Publication of TWI352553B publication Critical patent/TWI352553B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/846Passivation; Containers; Encapsulations comprising getter material or desiccants
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • H10K50/8445Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/121Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/302Details of OLEDs of OLED structures
    • H10K2102/3023Direction of light emission
    • H10K2102/3026Top emission
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/302Details of OLEDs of OLED structures
    • H10K2102/3023Direction of light emission
    • H10K2102/3031Two-side emission, e.g. transparent OLEDs [TOLED]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/85Arrangements for extracting light from the devices
    • H10K50/856Arrangements for extracting light from the devices comprising reflective means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/38Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/875Arrangements for extracting light from the devices
    • H10K59/878Arrangements for extracting light from the devices comprising reflective means

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Geometry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
TW092136440A 2002-12-26 2003-12-22 Light emitting device and a method for manufacturi TWI352553B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002378668 2002-12-26

Publications (2)

Publication Number Publication Date
TW200420181A true TW200420181A (en) 2004-10-01
TWI352553B TWI352553B (en) 2011-11-11

Family

ID=32677442

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092136440A TWI352553B (en) 2002-12-26 2003-12-22 Light emitting device and a method for manufacturi

Country Status (6)

Country Link
US (5) US7109655B2 (zh)
JP (1) JP4610343B2 (zh)
CN (1) CN100531484C (zh)
AU (1) AU2003296080A1 (zh)
TW (1) TWI352553B (zh)
WO (1) WO2004060022A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI405496B (zh) * 2004-12-13 2013-08-11 Sanyo Electric Co 有機電場發光元件之封裝方法,及發光面板以及顯示面板之製造方法
TWI422072B (zh) * 2009-12-30 2014-01-01 Au Optronics Corp 上蓋結構及發光元件之封裝結構及發光元件之封裝方法

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4240276B2 (ja) 2002-07-05 2009-03-18 株式会社半導体エネルギー研究所 発光装置
TWI352553B (en) 2002-12-26 2011-11-11 Semiconductor Energy Lab Light emitting device and a method for manufacturi
KR100552971B1 (ko) * 2003-10-09 2006-02-15 삼성에스디아이 주식회사 유기 전계 발광 표시 장치
TWI238675B (en) * 2004-01-19 2005-08-21 Hitachi Displays Ltd Organic light-emitting display and its manufacture method
US7764012B2 (en) * 2004-04-16 2010-07-27 Semiconductor Energy Laboratory Co., Ltd Light emitting device comprising reduced frame portion, manufacturing method with improve productivity thereof, and electronic apparatus
JP2006085957A (ja) * 2004-09-15 2006-03-30 Tohoku Pioneer Corp 自発光パネルの製造方法
US7791270B2 (en) 2004-09-17 2010-09-07 Semiconductor Energy Laboratory Co., Ltd Light-emitting device with reduced deterioration of periphery
KR100700013B1 (ko) * 2004-11-26 2007-03-26 삼성에스디아이 주식회사 유기전계발광소자 및 그의 제조 방법
JP4631683B2 (ja) * 2005-01-17 2011-02-16 セイコーエプソン株式会社 発光装置、及び電子機器
US7572655B2 (en) * 2005-03-23 2009-08-11 E. I. Du Pont De Nemours And Company Electronic devices having a layer overlying an edge of a different layer and a process for forming the same
WO2006104020A1 (en) * 2005-03-25 2006-10-05 Semiconductor Energy Laboratory Co., Ltd. Light emitting element, light emitting device and electric appliance using the same
US8269227B2 (en) * 2005-06-09 2012-09-18 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and electronic device
US8729795B2 (en) 2005-06-30 2014-05-20 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and electronic device
US20070007533A1 (en) * 2005-07-08 2007-01-11 Yi-Tyng Wu Pixel array strcuture
JP2007073397A (ja) * 2005-09-08 2007-03-22 Sony Corp 表示装置の製造方法および表示装置
KR100784557B1 (ko) * 2006-09-22 2007-12-11 엘지전자 주식회사 전계발광패널
KR100770104B1 (ko) * 2006-09-28 2007-10-24 삼성에스디아이 주식회사 유기 전계 발광 표시 장치 및 그 제조 방법과 이를 위한이송 장치
JP2008170756A (ja) 2007-01-12 2008-07-24 Sony Corp 表示装置
JP2008235089A (ja) * 2007-03-22 2008-10-02 Fuji Electric Holdings Co Ltd 有機elディスプレイパネルおよびその製造方法
US8716850B2 (en) * 2007-05-18 2014-05-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8258696B2 (en) 2007-06-28 2012-09-04 Samsung Mobile Display Co., Ltd. Light emitting display and method of manufacturing the same
US8330339B2 (en) 2007-06-28 2012-12-11 Samsung Display Co., Ltd. Light emitting display and method of manufacturing the same
KR100879864B1 (ko) * 2007-06-28 2009-01-22 삼성모바일디스플레이주식회사 발광 표시 장치 및 그의 제조 방법
KR20090015734A (ko) * 2007-08-09 2009-02-12 엘지이노텍 주식회사 광원 장치
JP2010093068A (ja) * 2008-10-08 2010-04-22 Hitachi Displays Ltd 有機el表示装置およびその製造方法
KR101319096B1 (ko) * 2009-02-24 2013-10-17 엘지디스플레이 주식회사 탑 에미션 인버티드형 유기발광 다이오드 표시장치 및 그의제조방법
US20110058770A1 (en) * 2009-09-10 2011-03-10 E. I. Du Pont De Nemours And Company Sub-surface engraving of oled substrates for improved optical outcoupling
JP2011119233A (ja) 2009-11-04 2011-06-16 Canon Inc 有機el素子とそれを用いた表示装置
JP5737550B2 (ja) * 2009-12-03 2015-06-17 ソニー株式会社 表示装置、表示装置の製造方法および電子機器
KR101065318B1 (ko) * 2009-12-03 2011-09-16 삼성모바일디스플레이주식회사 플렉서블 디스플레이 장치의 제조 방법
US20130034713A1 (en) * 2009-12-17 2013-02-07 Busman Stanley C Display panel assembly and methods of making same
KR101097337B1 (ko) * 2010-03-05 2011-12-21 삼성모바일디스플레이주식회사 유기 발광 표시 장치
KR101641860B1 (ko) * 2010-05-12 2016-07-29 엘지이노텍 주식회사 발광소자 어레이, 조명장치 및 백라이트 장치
KR101722026B1 (ko) * 2010-10-22 2017-04-12 삼성디스플레이 주식회사 평판 표시 패널, 평판 표시 패널용 원장기판, 및 평판 표시 패널 제조 방법
US8654537B2 (en) 2010-12-01 2014-02-18 Apple Inc. Printed circuit board with integral radio-frequency shields
CN107087343B (zh) * 2011-05-27 2019-04-19 夏普株式会社 发光装置以及照明装置
KR101421168B1 (ko) * 2011-09-20 2014-07-21 엘지디스플레이 주식회사 유기전계발광 표시소자 및 그 제조방법
TWI466352B (zh) * 2011-09-30 2014-12-21 Au Optronics Corp 有機電激發光元件陣列及有機電激發光元件
JP5959274B2 (ja) * 2012-03-30 2016-08-02 古河電気工業株式会社 有機エレクトロルミネッセンス素子封止用樹脂組成物、これを用いた有機エレクトロルミネッセンス素子およびディスプレイ装置
CN102760841B (zh) * 2012-07-11 2014-11-26 深圳市华星光电技术有限公司 有机发光二极管器件及相应的显示装置
KR101420332B1 (ko) * 2012-11-14 2014-07-16 삼성디스플레이 주식회사 유기 발광 디스플레이 장치
JP5903668B2 (ja) * 2013-02-21 2016-04-13 パナソニックIpマネジメント株式会社 部品実装装置および部品実装方法
JP2014160788A (ja) 2013-02-21 2014-09-04 Panasonic Corp 部品実装装置および部品実装方法
JP6182985B2 (ja) * 2013-06-05 2017-08-23 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、電子機器
KR20150071538A (ko) * 2013-12-18 2015-06-26 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조방법
KR102178796B1 (ko) * 2014-01-22 2020-11-16 삼성디스플레이 주식회사 표시 장치
JP6439114B2 (ja) * 2014-03-07 2018-12-19 株式会社Joled 表示装置および電子機器
KR102223676B1 (ko) * 2014-06-24 2021-03-08 삼성디스플레이 주식회사 디스플레이 장치
US10008611B2 (en) * 2014-06-26 2018-06-26 Joled Inc. Thin film transistor and organic EL display device
TWI755773B (zh) * 2014-06-30 2022-02-21 日商半導體能源研究所股份有限公司 發光裝置,模組,及電子裝置
CN105304508B (zh) * 2014-07-30 2019-10-18 日月光半导体制造股份有限公司 电子封装模块的制造方法及其结构
KR102360783B1 (ko) * 2014-09-16 2022-02-10 삼성디스플레이 주식회사 디스플레이 장치
KR102342804B1 (ko) * 2014-12-30 2021-12-22 엘지디스플레이 주식회사 유기 발광 표시 장치
KR102350366B1 (ko) * 2014-12-31 2022-01-11 엘지디스플레이 주식회사 유기 발광 표시 장치
CN104505470B (zh) * 2015-01-04 2017-12-08 京东方科技集团股份有限公司 显示面板及其制作方法以及显示装置
US9590005B1 (en) * 2016-01-25 2017-03-07 Omnivision Technologies, Inc. High dynamic range image sensor with reduced sensitivity to high intensity light
KR102627284B1 (ko) * 2016-05-12 2024-01-22 엘지디스플레이 주식회사 캐소드 전극과 보조 캐소드 전극의 접속구조 형성 방법과 그를 이용한 유기발광 다이오드 표시장치
CN108123053A (zh) * 2016-11-29 2018-06-05 京东方科技集团股份有限公司 发光器件和显示装置
CN206774584U (zh) * 2017-06-06 2017-12-19 京东方科技集团股份有限公司 薄膜封装结构和显示装置
CN108428804A (zh) * 2018-04-19 2018-08-21 武汉华星光电技术有限公司 Oled显示面板及其封装方法
CN112424969A (zh) 2018-05-18 2021-02-26 株式会社半导体能源研究所 发光元件、发光装置、电子设备及照明装置
CN109524576B (zh) * 2018-12-13 2020-12-29 合肥鑫晟光电科技有限公司 一种oled显示基板及其制备方法、显示装置
WO2021001983A1 (ja) * 2019-07-04 2021-01-07 三菱電機株式会社 液晶表示装置及び液晶表示装置の製造方法

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US44035A (en) * 1864-08-30 Weeding-hoe
JPS6454420A (en) 1987-08-25 1989-03-01 Matsushita Electric Ind Co Ltd Liquid crystal display element
JPH055890A (ja) 1991-06-27 1993-01-14 Sanyo Electric Co Ltd 液晶表示パネルおよびその製造方法
DE69524429T2 (de) * 1994-09-08 2002-05-23 Idemitsu Kosan Co. Ltd., Tokio/Tokyo Verfahren zur abdichtung eines organischen elektrolumineszenten elements und organisches elektrolumineszentes element
US6420031B1 (en) * 1997-11-03 2002-07-16 The Trustees Of Princeton University Highly transparent non-metallic cathodes
JP4059968B2 (ja) 1997-12-18 2008-03-12 Tdk株式会社 有機el素子の製造方法
JPH11264991A (ja) * 1998-01-13 1999-09-28 Matsushita Electric Ind Co Ltd 液晶表示素子の製造方法
US6396208B1 (en) * 1998-01-27 2002-05-28 Nec Corporation Organic electroluminescent device and its manufacturing process
JP2000068050A (ja) 1998-08-24 2000-03-03 Casio Comput Co Ltd 電界発光素子及びその製造方法
TW401631B (en) 1998-10-23 2000-08-11 Highlight Optoelectronics Inc Organic light emitting display and its packaging method
US6608283B2 (en) * 2000-02-08 2003-08-19 Emagin Corporation Apparatus and method for solder-sealing an active matrix organic light emitting diode
JP2001338755A (ja) 2000-03-21 2001-12-07 Seiko Epson Corp 有機el素子およびその製造方法
TW452952B (en) 2000-03-30 2001-09-01 Delta Optoelectronics Inc Packaging method of electro-luminescent device
WO2001091520A1 (fr) 2000-05-23 2001-11-29 Nagase & Co., Ltd. Ecran electroluminescent organique et procede de fabrication de celui-ci
JP2001345175A (ja) 2000-06-01 2001-12-14 Stanley Electric Co Ltd 有機el表示装置
JP2002025764A (ja) 2000-07-05 2002-01-25 Toyota Motor Corp 有機el素子の封止方法
JP3903204B2 (ja) 2001-01-24 2007-04-11 ソニー株式会社 表示装置の製造方法
JP3608613B2 (ja) * 2001-03-28 2005-01-12 株式会社日立製作所 表示装置
JP2002299067A (ja) * 2001-04-03 2002-10-11 Matsushita Electric Ind Co Ltd El素子及びこれを用いた照光装置
JP2002352951A (ja) 2001-05-24 2002-12-06 Tohoku Pioneer Corp 有機el表示パネル及びその製造方法
JP4894987B2 (ja) * 2001-06-29 2012-03-14 三洋電機株式会社 表示用パネルの製造方法
JP4614588B2 (ja) * 2001-06-29 2011-01-19 三洋電機株式会社 エレクトロルミネッセンス表示装置の製造方法
TW502552B (en) 2001-07-09 2002-09-11 Ind Tech Res Inst UV-cut film of organic electroluminescent display
US6664730B2 (en) * 2001-07-09 2003-12-16 Universal Display Corporation Electrode structure of el device
TW511304B (en) 2001-12-11 2002-11-21 Ind Tech Res Inst Organic electroluminescent device with fluorine-containing inorganic layer
TW515062B (en) 2001-12-28 2002-12-21 Delta Optoelectronics Inc Package structure with multiple glue layers
JP4069640B2 (ja) 2002-02-12 2008-04-02 セイコーエプソン株式会社 電気光学装置、及び電子機器
US6791660B1 (en) * 2002-02-12 2004-09-14 Seiko Epson Corporation Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances
KR100477745B1 (ko) * 2002-05-23 2005-03-18 삼성에스디아이 주식회사 유기 전계발광 소자의 봉지방법 및 이를 이용하는 유기전계발광 패널
JP4240276B2 (ja) * 2002-07-05 2009-03-18 株式会社半導体エネルギー研究所 発光装置
KR101032337B1 (ko) 2002-12-13 2011-05-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광장치 및 그의 제조방법
TWI352553B (en) * 2002-12-26 2011-11-11 Semiconductor Energy Lab Light emitting device and a method for manufacturi

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI405496B (zh) * 2004-12-13 2013-08-11 Sanyo Electric Co 有機電場發光元件之封裝方法,及發光面板以及顯示面板之製造方法
TWI422072B (zh) * 2009-12-30 2014-01-01 Au Optronics Corp 上蓋結構及發光元件之封裝結構及發光元件之封裝方法
US8641469B2 (en) 2009-12-30 2014-02-04 Au Optronics Corp. Packaging method of light emitting device

Also Published As

Publication number Publication date
CN100531484C (zh) 2009-08-19
WO2004060022A1 (ja) 2004-07-15
US7948175B2 (en) 2011-05-24
US20070052347A1 (en) 2007-03-08
US10103355B2 (en) 2018-10-16
JPWO2004060022A1 (ja) 2006-05-11
AU2003296080A1 (en) 2004-07-22
JP4610343B2 (ja) 2011-01-12
CN1732715A (zh) 2006-02-08
US9577218B2 (en) 2017-02-21
US8330363B2 (en) 2012-12-11
US20170155091A1 (en) 2017-06-01
US7109655B2 (en) 2006-09-19
US20130092919A1 (en) 2013-04-18
US20050040762A1 (en) 2005-02-24
TWI352553B (en) 2011-11-11
US20110221335A1 (en) 2011-09-15

Similar Documents

Publication Publication Date Title
TW200420181A (en) Light emitting device and a method for manufacturing the same
US8016632B2 (en) Light emitting display device and method of fabricating the same
AU1904000A (en) Encapsulation for organic led device
WO2016086538A1 (zh) Oled封装结构及oled封装方法
TWI366416B (en) Hermetically sealed light emitting display device and method of sealing
TW200730022A (en) Organic light emitting display and method of fabricating the same
TW200740279A (en) Organic light emitting display and method of fabricating the same
TW200718269A (en) Organic light emitting display and method of fabricating the same
TW200613862A (en) Substrate surface sealing method and ultraviolet-ray irradiation device for liquid crystal display cell substrate
TW200731518A (en) Semiconductor device and manufacturing method of the same
TW200628006A (en) Hermetically sealed package and method of fabrication of a hermetically sealed package
EP1564777A4 (en) PLASMA DISPLAY PANEL AND METHOD FOR THE PRODUCTION THEREOF
EP1965452A3 (en) Seal for light emitting display device and method
TW200739989A (en) Organic light emitting display device and method of fabricating the same
WO2016101403A1 (zh) Oled封装结构及封装方法
TW200731840A (en) Method of encapsulating a display element
TW200739190A (en) Electro-optical device, manufacturing method thereof, and electronic apparatus
KR100689199B1 (ko) 유기발광소자의 봉지방법 및 장치
WO2016086533A1 (zh) Oled封装方法及oled封装结构
TW200702794A (en) Seal structure, seal method, liquid crystal device, manufacturing method thereof, and projector
WO2016123857A1 (zh) Oled封装方法及oled封装结构
KR100643891B1 (ko) 봉지 캡을 구비한 유기 발광 소자 패널
TW200501802A (en) Planar luminescent device including auxiliary electrode
WO2003030272A3 (en) Method for encapsulation of electronic devices
CN104282730B (zh) Oled显示面板、oled显示装置及其制作方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees