TW200416102A - Polishing pad and method for manufacturing semiconductor device - Google Patents

Polishing pad and method for manufacturing semiconductor device Download PDF

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Publication number
TW200416102A
TW200416102A TW092133347A TW92133347A TW200416102A TW 200416102 A TW200416102 A TW 200416102A TW 092133347 A TW092133347 A TW 092133347A TW 92133347 A TW92133347 A TW 92133347A TW 200416102 A TW200416102 A TW 200416102A
Authority
TW
Taiwan
Prior art keywords
light
polishing
field
polishing pad
grinding
Prior art date
Application number
TW092133347A
Other languages
English (en)
Chinese (zh)
Other versions
TWI325800B (https=
Inventor
Masahiko Nakamori
Tetsuo Shimomura
Takatoshi Yamada
Kazuyuki Ogawa
Atsushi Kazuno
Masahiro Watanabe
Original Assignee
Toyo Boseki
Toyo Tire & Rubber Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003000331A external-priority patent/JP3582790B2/ja
Application filed by Toyo Boseki, Toyo Tire & Rubber Co filed Critical Toyo Boseki
Publication of TW200416102A publication Critical patent/TW200416102A/zh
Application granted granted Critical
Publication of TWI325800B publication Critical patent/TWI325800B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW092133347A 2002-11-27 2003-11-27 Polishing pad and method for manufacturing semiconductor device TW200416102A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2002343199 2002-11-27
JP2003000331A JP3582790B2 (ja) 2002-11-27 2003-01-06 研磨パッド及び半導体デバイスの製造方法
JP2003029477 2003-02-06
JP2003064653 2003-03-11

Publications (2)

Publication Number Publication Date
TW200416102A true TW200416102A (en) 2004-09-01
TWI325800B TWI325800B (https=) 2010-06-11

Family

ID=32398174

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092133347A TW200416102A (en) 2002-11-27 2003-11-27 Polishing pad and method for manufacturing semiconductor device

Country Status (5)

Country Link
US (1) US8845852B2 (https=)
KR (1) KR101047933B1 (https=)
AU (1) AU2003302299A1 (https=)
TW (1) TW200416102A (https=)
WO (1) WO2004049417A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474893B (zh) * 2010-04-15 2015-03-01 東洋橡膠工業股份有限公司 Polishing pad
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
TWI580521B (zh) * 2007-06-08 2017-05-01 應用材料股份有限公司 具有窗口之薄硏磨墊及鑄造程序
TWI583490B (zh) * 2014-03-28 2017-05-21 羅門哈斯電子材料Ｃｍｐ控股公司 具終點偵測窗之化學機械硏磨墊、製作化學機械研磨墊的方法及研磨基材之方法

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TWD111897S1 (zh) * 2004-10-05 2006-07-11 股份有限公司 研磨用墊片
USD559648S1 (en) * 2004-10-05 2008-01-15 Jsr Corporation Polishing pad
USD559066S1 (en) 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
KR100953928B1 (ko) 2004-12-10 2010-04-23 도요 고무 고교 가부시키가이샤 연마 패드 및 연마 패드의 제조 방법
JP4775881B2 (ja) * 2004-12-10 2011-09-21 東洋ゴム工業株式会社 研磨パッド
SG160368A1 (en) * 2005-03-08 2010-04-29 Toyo Tire & Rubber Co Polishing pad and process for producing the same
WO2006123559A1 (ja) 2005-05-17 2006-11-23 Toyo Tire & Rubber Co., Ltd. 研磨パッド
JP4884725B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP5031236B2 (ja) * 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
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JP2007307639A (ja) * 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
CN102152233B (zh) * 2006-08-28 2013-10-30 东洋橡胶工业株式会社 抛光垫
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US7967661B2 (en) * 2008-06-19 2011-06-28 Micron Technology, Inc. Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture
KR101587226B1 (ko) 2008-07-31 2016-01-20 신에쯔 한도타이 가부시키가이샤 웨이퍼의 연마 방법 및 양면 연마 장치
JP5528169B2 (ja) * 2010-03-26 2014-06-25 東洋ゴム工業株式会社 研磨パッドおよびその製造方法、ならびに半導体デバイスの製造方法
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8657653B2 (en) 2010-09-30 2014-02-25 Nexplanar Corporation Homogeneous polishing pad for eddy current end-point detection
US8628384B2 (en) * 2010-09-30 2014-01-14 Nexplanar Corporation Polishing pad for eddy current end-point detection
KR101532990B1 (ko) 2011-09-22 2015-07-01 도요 고무 고교 가부시키가이샤 연마 패드
US9597769B2 (en) 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
KR20240015167A (ko) 2014-10-17 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
JP6406238B2 (ja) * 2015-12-18 2018-10-17 株式会社Sumco ウェーハ研磨方法および研磨装置
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10213894B2 (en) 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
WO2018021428A1 (ja) * 2016-07-29 2018-02-01 株式会社クラレ 研磨パッドおよびそれを用いた研磨方法
DE102016116012A1 (de) 2016-08-29 2018-03-01 Lapmaster Wolters Gmbh Verfahren zum Messen der Dicke von flachen Werkstücken
US10875149B2 (en) * 2017-03-30 2020-12-29 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for timed dispensing various slurry components
US10207388B2 (en) 2017-04-19 2019-02-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
US10465097B2 (en) 2017-11-16 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic UV cured polyurethane optical endpoint detection windows with high UV transparency for CMP polishing pads
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
JP7105334B2 (ja) * 2020-03-17 2022-07-22 エスケーシー ソルミックス カンパニー，リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
KR102421208B1 (ko) 2020-09-10 2022-07-14 에스케이씨솔믹스 주식회사 연마 패드 및 이를 이용한 반도체 소자의 제조 방법
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
KR20240103803A (ko) * 2022-12-27 2024-07-04 세메스 주식회사 기판 처리 장치 및 방법
CN116749076A (zh) * 2023-05-15 2023-09-15 湖北鼎汇微电子材料有限公司 检测窗口、抛光垫及抛光系统
CN118404490B (zh) * 2024-07-01 2024-09-13 浙江求是半导体设备有限公司 一种抛光设备

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI580521B (zh) * 2007-06-08 2017-05-01 應用材料股份有限公司 具有窗口之薄硏磨墊及鑄造程序
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
TWI490083B (zh) * 2010-01-13 2015-07-01 Nexplanar Corp 具有局部區域透明之化學機械拋光墊
TWI474893B (zh) * 2010-04-15 2015-03-01 東洋橡膠工業股份有限公司 Polishing pad
US9126304B2 (en) 2010-04-15 2015-09-08 Toyo Tire & Rubber Co., Ltd. Polishing pad
TWI583490B (zh) * 2014-03-28 2017-05-21 羅門哈斯電子材料Ｃｍｐ控股公司 具終點偵測窗之化學機械硏磨墊、製作化學機械研磨墊的方法及研磨基材之方法

Also Published As

Publication number Publication date
WO2004049417A1 (ja) 2004-06-10
AU2003302299A1 (en) 2004-06-18
US20060037699A1 (en) 2006-02-23
KR101047933B1 (ko) 2011-07-11
AU2003302299A8 (en) 2004-06-18
KR20050085168A (ko) 2005-08-29
TWI325800B (https=) 2010-06-11
US8845852B2 (en) 2014-09-30

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