KR101047933B1 - 연마 패드 및 반도체 장치의 제조 방법 - Google Patents

연마 패드 및 반도체 장치의 제조 방법 Download PDF

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Publication number
KR101047933B1
KR101047933B1 KR1020057009545A KR20057009545A KR101047933B1 KR 101047933 B1 KR101047933 B1 KR 101047933B1 KR 1020057009545 A KR1020057009545 A KR 1020057009545A KR 20057009545 A KR20057009545 A KR 20057009545A KR 101047933 B1 KR101047933 B1 KR 101047933B1
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KR
South Korea
Prior art keywords
polishing
polishing pad
region
light transmitting
fine foam
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020057009545A
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English (en)
Korean (ko)
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KR20050085168A (ko
Inventor
마사히코 나카모리
데쓰오 시모무라
다카토시 야마다
가즈유키 오가와
아쓰시 가즈노
마사히로 와타나베
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도요 고무 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from JP2003000331A external-priority patent/JP3582790B2/ja
Application filed by 도요 고무 고교 가부시키가이샤 filed Critical 도요 고무 고교 가부시키가이샤
Publication of KR20050085168A publication Critical patent/KR20050085168A/ko
Application granted granted Critical
Publication of KR101047933B1 publication Critical patent/KR101047933B1/ko
Assigned to 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 reassignment 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 권리의 전부이전등록 Assignors: 도요 고무 고교 가부시키가이샤
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020057009545A 2002-11-27 2003-11-27 연마 패드 및 반도체 장치의 제조 방법 Expired - Fee Related KR101047933B1 (ko)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2002343199 2002-11-27
JPJP-P-2002-00343199 2002-11-27
JPJP-P-2003-00000331 2003-01-06
JP2003000331A JP3582790B2 (ja) 2002-11-27 2003-01-06 研磨パッド及び半導体デバイスの製造方法
JP2003029477 2003-02-06
JPJP-P-2003-00029477 2003-02-06
JPJP-P-2003-00064653 2003-03-11
JP2003064653 2003-03-11
PCT/JP2003/015128 WO2004049417A1 (ja) 2002-11-27 2003-11-27 研磨パッド及び半導体デバイスの製造方法

Publications (2)

Publication Number Publication Date
KR20050085168A KR20050085168A (ko) 2005-08-29
KR101047933B1 true KR101047933B1 (ko) 2011-07-11

Family

ID=32398174

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057009545A Expired - Fee Related KR101047933B1 (ko) 2002-11-27 2003-11-27 연마 패드 및 반도체 장치의 제조 방법

Country Status (5)

Country Link
US (1) US8845852B2 (https=)
KR (1) KR101047933B1 (https=)
AU (1) AU2003302299A1 (https=)
TW (1) TW200416102A (https=)
WO (1) WO2004049417A1 (https=)

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CN102152233B (zh) * 2006-08-28 2013-10-30 东洋橡胶工业株式会社 抛光垫
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US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
JP6406238B2 (ja) * 2015-12-18 2018-10-17 株式会社Sumco ウェーハ研磨方法および研磨装置
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
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WO2018021428A1 (ja) * 2016-07-29 2018-02-01 株式会社クラレ 研磨パッドおよびそれを用いた研磨方法
DE102016116012A1 (de) 2016-08-29 2018-03-01 Lapmaster Wolters Gmbh Verfahren zum Messen der Dicke von flachen Werkstücken
US10875149B2 (en) * 2017-03-30 2020-12-29 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for timed dispensing various slurry components
US10207388B2 (en) 2017-04-19 2019-02-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
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JP7105334B2 (ja) * 2020-03-17 2022-07-22 エスケーシー ソルミックス カンパニー，リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
KR102421208B1 (ko) 2020-09-10 2022-07-14 에스케이씨솔믹스 주식회사 연마 패드 및 이를 이용한 반도체 소자의 제조 방법
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
KR20240103803A (ko) * 2022-12-27 2024-07-04 세메스 주식회사 기판 처리 장치 및 방법
CN116749076A (zh) * 2023-05-15 2023-09-15 湖北鼎汇微电子材料有限公司 检测窗口、抛光垫及抛光系统
CN118404490B (zh) * 2024-07-01 2024-09-13 浙江求是半导体设备有限公司 一种抛光设备

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Also Published As

Publication number Publication date
WO2004049417A1 (ja) 2004-06-10
AU2003302299A1 (en) 2004-06-18
US20060037699A1 (en) 2006-02-23
AU2003302299A8 (en) 2004-06-18
KR20050085168A (ko) 2005-08-29
TW200416102A (en) 2004-09-01
TWI325800B (https=) 2010-06-11
US8845852B2 (en) 2014-09-30

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