AU2003302299A1 - Polishing pad and method for manufacturing semiconductor device - Google Patents

Polishing pad and method for manufacturing semiconductor device

Info

Publication number
AU2003302299A1
AU2003302299A1 AU2003302299A AU2003302299A AU2003302299A1 AU 2003302299 A1 AU2003302299 A1 AU 2003302299A1 AU 2003302299 A AU2003302299 A AU 2003302299A AU 2003302299 A AU2003302299 A AU 2003302299A AU 2003302299 A1 AU2003302299 A1 AU 2003302299A1
Authority
AU
Australia
Prior art keywords
semiconductor device
polishing pad
manufacturing semiconductor
manufacturing
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003302299A
Other languages
English (en)
Other versions
AU2003302299A8 (en
Inventor
Atsushi Kazuno
Masahiko Nakamori
Kazuyuki Ogawa
Tetsuo Shimomura
Kimihiro Watanabe
Takatoshi Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Toyo Tire Corp
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003000331A external-priority patent/JP3582790B2/ja
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Publication of AU2003302299A1 publication Critical patent/AU2003302299A1/en
Publication of AU2003302299A8 publication Critical patent/AU2003302299A8/xx
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AU2003302299A 2002-11-27 2003-11-27 Polishing pad and method for manufacturing semiconductor device Abandoned AU2003302299A1 (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2002343199 2002-11-27
JP2002-343199 2002-11-27
JP2003-000331 2003-01-06
JP2003000331A JP3582790B2 (ja) 2002-11-27 2003-01-06 研磨パッド及び半導体デバイスの製造方法
JP2003-029477 2003-02-06
JP2003029477 2003-02-06
JP2003-064653 2003-03-11
JP2003064653 2003-03-11
PCT/JP2003/015128 WO2004049417A1 (ja) 2002-11-27 2003-11-27 研磨パッド及び半導体デバイスの製造方法

Publications (2)

Publication Number Publication Date
AU2003302299A1 true AU2003302299A1 (en) 2004-06-18
AU2003302299A8 AU2003302299A8 (en) 2004-06-18

Family

ID=32398174

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003302299A Abandoned AU2003302299A1 (en) 2002-11-27 2003-11-27 Polishing pad and method for manufacturing semiconductor device

Country Status (5)

Country Link
US (1) US8845852B2 (https=)
KR (1) KR101047933B1 (https=)
AU (1) AU2003302299A1 (https=)
TW (1) TW200416102A (https=)
WO (1) WO2004049417A1 (https=)

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US7967661B2 (en) * 2008-06-19 2011-06-28 Micron Technology, Inc. Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture
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US9017140B2 (en) * 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
JP5528169B2 (ja) * 2010-03-26 2014-06-25 東洋ゴム工業株式会社 研磨パッドおよびその製造方法、ならびに半導体デバイスの製造方法
JP5620141B2 (ja) 2010-04-15 2014-11-05 東洋ゴム工業株式会社 研磨パッド
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8657653B2 (en) 2010-09-30 2014-02-25 Nexplanar Corporation Homogeneous polishing pad for eddy current end-point detection
US8628384B2 (en) * 2010-09-30 2014-01-14 Nexplanar Corporation Polishing pad for eddy current end-point detection
KR101532990B1 (ko) 2011-09-22 2015-07-01 도요 고무 고교 가부시키가이샤 연마 패드
US9597769B2 (en) 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
KR20240015167A (ko) 2014-10-17 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
JP6406238B2 (ja) * 2015-12-18 2018-10-17 株式会社Sumco ウェーハ研磨方法および研磨装置
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10213894B2 (en) 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
WO2018021428A1 (ja) * 2016-07-29 2018-02-01 株式会社クラレ 研磨パッドおよびそれを用いた研磨方法
DE102016116012A1 (de) 2016-08-29 2018-03-01 Lapmaster Wolters Gmbh Verfahren zum Messen der Dicke von flachen Werkstücken
US10875149B2 (en) * 2017-03-30 2020-12-29 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for timed dispensing various slurry components
US10207388B2 (en) 2017-04-19 2019-02-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
US10465097B2 (en) 2017-11-16 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic UV cured polyurethane optical endpoint detection windows with high UV transparency for CMP polishing pads
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
JP7105334B2 (ja) * 2020-03-17 2022-07-22 エスケーシー ソルミックス カンパニー，リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
KR102421208B1 (ko) 2020-09-10 2022-07-14 에스케이씨솔믹스 주식회사 연마 패드 및 이를 이용한 반도체 소자의 제조 방법
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
KR20240103803A (ko) * 2022-12-27 2024-07-04 세메스 주식회사 기판 처리 장치 및 방법
CN116749076A (zh) * 2023-05-15 2023-09-15 湖北鼎汇微电子材料有限公司 检测窗口、抛光垫及抛光系统
CN118404490B (zh) * 2024-07-01 2024-09-13 浙江求是半导体设备有限公司 一种抛光设备

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Also Published As

Publication number Publication date
WO2004049417A1 (ja) 2004-06-10
US20060037699A1 (en) 2006-02-23
KR101047933B1 (ko) 2011-07-11
AU2003302299A8 (en) 2004-06-18
KR20050085168A (ko) 2005-08-29
TW200416102A (en) 2004-09-01
TWI325800B (https=) 2010-06-11
US8845852B2 (en) 2014-09-30

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Legal Events

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TH Corrigenda

Free format text: IN VOL 18, NO 28, PAGE(S) 7689 UNDER THE HEADING APPLICATIONS OPI - NAME INDEX UNDER THE NAME TOYO BOSEKI KABUSHIKI KAISHA, APPLICATION NO. 2003302299, UNDER INID (71) CORRECT THE NAME TO READ TOYO TIRE & RUBBER CO., LTD.; TOYO BOSEKI KABUSHIKI KAISHA

MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase