TW200300876A - Photoresist residue removing liquid composition - Google Patents

Photoresist residue removing liquid composition Download PDF

Info

Publication number
TW200300876A
TW200300876A TW091134679A TW91134679A TW200300876A TW 200300876 A TW200300876 A TW 200300876A TW 091134679 A TW091134679 A TW 091134679A TW 91134679 A TW91134679 A TW 91134679A TW 200300876 A TW200300876 A TW 200300876A
Authority
TW
Taiwan
Prior art keywords
acid
photoresist
photoresist residue
liquid composition
wire
Prior art date
Application number
TW091134679A
Other languages
English (en)
Chinese (zh)
Other versions
TWI311242B (https=
Inventor
Norio Ishikawa
Takuo Oowada
Original Assignee
Kanto Kagaku
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Kagaku filed Critical Kanto Kagaku
Publication of TW200300876A publication Critical patent/TW200300876A/zh
Application granted granted Critical
Publication of TWI311242B publication Critical patent/TWI311242B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
TW091134679A 2001-12-04 2002-11-28 Photoresist residue removing liquid composition TW200300876A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001370122A JP3787085B2 (ja) 2001-12-04 2001-12-04 フォトレジスト残渣除去液組成物

Publications (2)

Publication Number Publication Date
TW200300876A true TW200300876A (en) 2003-06-16
TWI311242B TWI311242B (https=) 2009-06-21

Family

ID=19179394

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091134679A TW200300876A (en) 2001-12-04 2002-11-28 Photoresist residue removing liquid composition

Country Status (7)

Country Link
US (1) US6864044B2 (https=)
EP (1) EP1318432B1 (https=)
JP (1) JP3787085B2 (https=)
KR (1) KR100927148B1 (https=)
CN (1) CN1246739C (https=)
DE (1) DE60239181D1 (https=)
TW (1) TW200300876A (https=)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004109788A1 (ja) * 2003-06-04 2004-12-16 Kao Corporation 剥離剤組成物およびこれを用いた剥離洗浄方法
US6946396B2 (en) 2003-10-30 2005-09-20 Nissan Chemical Indusries, Ltd. Maleic acid and ethylene urea containing formulation for removing residue from semiconductor substrate and method for cleaning wafer
US7842382B2 (en) * 2004-03-11 2010-11-30 Knauf Insulation Gmbh Binder compositions and associated methods
JP4390616B2 (ja) 2004-04-27 2009-12-24 Ｎｅｃエレクトロニクス株式会社 洗浄液及び半導体装置の製造方法
JP2005347587A (ja) * 2004-06-04 2005-12-15 Sony Corp ドライエッチング後の洗浄液組成物および半導体装置の製造方法
JP4456424B2 (ja) * 2004-06-29 2010-04-28 関東化学株式会社 フォトレジスト残渣及びポリマー残渣除去組成物
EP1814927A1 (en) * 2004-10-13 2007-08-08 Knauf Insulation GmbH Polyester binding compositions
CN101287788B (zh) * 2005-07-26 2012-09-19 可耐福保温材料有限公司 粘结剂和由其制备的材料
US8772214B2 (en) 2005-10-14 2014-07-08 Air Products And Chemicals, Inc. Aqueous cleaning composition for removing residues and method using same
KR100752446B1 (ko) * 2005-12-26 2007-08-24 리퀴드테크놀로지(주) 감광성 내식각막의 잔사제거용 조성물
US7858572B2 (en) 2005-12-26 2010-12-28 Liquid Technology Co., Ltd. Composition for removing polymer residue of photosensitive etching-resistant layer
WO2007125634A1 (ja) * 2006-03-31 2007-11-08 Sanyo Chemical Industries, Ltd. 銅配線用洗浄剤
US7772128B2 (en) * 2006-06-09 2010-08-10 Lam Research Corporation Semiconductor system with surface modification
US9058975B2 (en) * 2006-06-09 2015-06-16 Lam Research Corporation Cleaning solution formulations for substrates
US7947637B2 (en) * 2006-06-30 2011-05-24 Fujifilm Electronic Materials, U.S.A., Inc. Cleaning formulation for removing residues on surfaces
PT2108006T (pt) 2007-01-25 2020-12-21 Knauf Insulation Gmbh Ligantes e materiais feitos com os mesmos
WO2008089848A1 (en) * 2007-01-25 2008-07-31 Knauf Insulation Limited Mineral fibre insulation
SI2826903T1 (sl) 2007-01-25 2023-10-30 Knauf Insulation Postopek za izdelavo izolacijskega izdelka iz mineralnih vlaken
HUE068424T2 (hu) 2007-01-25 2024-12-28 Knauf Insulation Ásványi szálas lemez
BRPI0721232B1 (pt) 2007-01-25 2023-01-24 Knauf Insulation Limited Placa de madeira compósita
US20080199751A1 (en) * 2007-02-20 2008-08-21 Commonwealth Scientific And Industrial Research Organisation Bipolar plate for an air breathing fuel cell stack
WO2008127936A2 (en) 2007-04-13 2008-10-23 Knauf Insulation Gmbh Composite maillard-resole binders
CN101802031B (zh) * 2007-07-05 2012-10-17 可耐福保温材料有限公司 羟基单羧酸基梅拉德粘结剂
WO2009013987A1 (ja) 2007-07-26 2009-01-29 Mitsubishi Gas Chemical Company, Inc. 洗浄防食用組成物および半導体素子または表示素子の製造方法
GB0715100D0 (en) 2007-08-03 2007-09-12 Knauf Insulation Ltd Binders
US8900495B2 (en) 2009-08-07 2014-12-02 Knauf Insulation Molasses binder
CN103025777B (zh) 2010-05-07 2016-01-20 克瑙夫绝缘私人有限公司 碳水化合物粘合剂及用其制备的材料
PH12012502183A1 (en) 2010-05-07 2017-06-23 Knauf Insulation Carbohydrate polyamine binders and materials made therewith
US20130082205A1 (en) 2010-06-07 2013-04-04 Knauf Insulation Sprl Fiber products having temperature control additives
JP5682624B2 (ja) 2010-06-18 2015-03-11 三菱瓦斯化学株式会社 銅層及びモリブデン層を含む多層構造膜用エッチング液
JP2012058273A (ja) 2010-09-03 2012-03-22 Kanto Chem Co Inc フォトレジスト残渣およびポリマー残渣除去液組成物
JP5817139B2 (ja) 2011-02-18 2015-11-18 富士通株式会社 化合物半導体装置の製造方法及び洗浄剤
US20140186635A1 (en) 2011-05-07 2014-07-03 Knauf Insulation Liquid high solids binder composition
GB201206193D0 (en) 2012-04-05 2012-05-23 Knauf Insulation Ltd Binders and associated products
GB201214734D0 (en) 2012-08-17 2012-10-03 Knauf Insulation Ltd Wood board and process for its production
ES2921601T3 (es) 2012-12-05 2022-08-30 Knauf Insulation Sprl Aglutinante
PL3102587T3 (pl) 2014-02-07 2019-01-31 Knauf Insulation, Inc. Nieutwardzone wyroby o ulepszonym okresie trwałości
GB201408909D0 (en) 2014-05-20 2014-07-02 Knauf Insulation Ltd Binders
GB201412709D0 (en) 2014-07-17 2014-09-03 Knauf Insulation And Knauf Insulation Ltd Improved binder compositions and uses thereof
GB201517867D0 (en) 2015-10-09 2015-11-25 Knauf Insulation Ltd Wood particle boards
GB201610063D0 (en) 2016-06-09 2016-07-27 Knauf Insulation Ltd Binders
GB201701569D0 (en) 2017-01-31 2017-03-15 Knauf Insulation Ltd Improved binder compositions and uses thereof
US11365379B2 (en) 2018-01-25 2022-06-21 Merck Patent Gmbh Photoresist remover compositions
GB201804907D0 (en) 2018-03-27 2018-05-09 Knauf Insulation Ltd Composite products
GB201804908D0 (en) 2018-03-27 2018-05-09 Knauf Insulation Ltd Binder compositions and uses thereof

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1603558A (en) * 1968-12-18 1971-05-03 Cleaning heating surfaces with complexing agent soln
US3689292A (en) * 1970-12-07 1972-09-05 John M Preston Tin immersion plating bath and method
US4014715A (en) * 1975-12-08 1977-03-29 General Electric Company Solder cleaning and coating composition
US5279771A (en) 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
US5466297A (en) * 1991-08-08 1995-11-14 Nalco Chemical Company Process for removal of primarily iron oxide deposits
US5480585A (en) 1992-04-02 1996-01-02 Nagase Electronic Chemicals, Ltd. Stripping liquid compositions
JP2980772B2 (ja) 1992-04-02 1999-11-22 ナガセ電子化学株式会社 剥離剤組成物
US6326130B1 (en) 1993-10-07 2001-12-04 Mallinckrodt Baker, Inc. Photoresist strippers containing reducing agents to reduce metal corrosion
JP3264405B2 (ja) 1994-01-07 2002-03-11 三菱瓦斯化学株式会社 半導体装置洗浄剤および半導体装置の製造方法
JPH08262746A (ja) * 1995-03-28 1996-10-11 Mitsubishi Gas Chem Co Inc フォトレジスト剥離剤組成物および剥離方法
US5567574A (en) 1995-01-10 1996-10-22 Mitsubishi Gas Chemical Company, Inc. Removing agent composition for photoresist and method of removing
US5612304A (en) * 1995-07-07 1997-03-18 Olin Microelectronic Chemicals, Inc. Redox reagent-containing post-etch residue cleaning composition
DE69636618T2 (de) * 1995-07-27 2007-08-30 Mitsubishi Chemical Corp. Verfahren zur behandlung einer substratoberfläche und behandlungsmittel hierfür
US5678232A (en) * 1995-07-31 1997-10-14 Corpex Technologies, Inc. Lead decontamination method
TW387936B (en) * 1997-08-12 2000-04-21 Kanto Kagaku Washing solution
US5977041A (en) * 1997-09-23 1999-11-02 Olin Microelectronic Chemicals Aqueous rinsing composition
US6231677B1 (en) * 1998-02-27 2001-05-15 Kanto Kagaku Kabushiki Kaisha Photoresist stripping liquid composition
JP4308959B2 (ja) * 1998-02-27 2009-08-05 関東化学株式会社 フォトレジスト剥離液組成物
JP2000162788A (ja) 1998-11-27 2000-06-16 Tokyo Ohka Kogyo Co Ltd 銅配線形成基板に用いるホトレジスト用剥離液組成物およびこれを用いたレジスト剥離方法
JP3328250B2 (ja) 1998-12-09 2002-09-24 岸本産業株式会社 レジスト残渣除去剤
JP2000284506A (ja) * 1999-03-31 2000-10-13 Sharp Corp フォトレジスト剥離剤組成物および剥離方法
JP2001022095A (ja) 1999-07-02 2001-01-26 Nippon Zeon Co Ltd ポジ型レジスト用剥離液
JP2001022096A (ja) 1999-07-02 2001-01-26 Nippon Zeon Co Ltd ポジ型レジスト用剥離液
JP3389166B2 (ja) 1999-09-10 2003-03-24 日本電気株式会社 レジスト用剥離液組成物
JP2001252481A (ja) * 2000-03-14 2001-09-18 Takara Co Ltd 貯金箱玩具

Also Published As

Publication number Publication date
KR20030076188A (ko) 2003-09-26
CN1246739C (zh) 2006-03-22
CN1423172A (zh) 2003-06-11
TWI311242B (https=) 2009-06-21
US20030143495A1 (en) 2003-07-31
JP3787085B2 (ja) 2006-06-21
JP2003167360A (ja) 2003-06-13
EP1318432A1 (en) 2003-06-11
DE60239181D1 (de) 2011-03-31
EP1318432B1 (en) 2011-02-16
KR100927148B1 (ko) 2009-11-18
US6864044B2 (en) 2005-03-08

Similar Documents

Publication Publication Date Title
TW200300876A (en) Photoresist residue removing liquid composition
JP5278319B2 (ja) 洗浄防食用組成物および半導体素子または表示素子の製造方法
TWI230733B (en) Non-corrosive cleaning composition for removing plasma etching residues
JP5431630B2 (ja) エッチング残渣を除去するための組成物基板及びその使用
KR100595024B1 (ko) 박리제 조성물
EP3080240B1 (en) Cleaning formulation for removing residues on surfaces
JP4252758B2 (ja) フォトレジスト残渣除去液組成物
CN100529039C (zh) 干蚀刻后的洗涤液组合物及半导体装置的制造方法
CN104662643A (zh) 清洗用液态组合物、半导体元件的清洗方法、以及半导体元件的制造方法
JP2000273663A (ja) 金属の腐食防止剤及び洗浄液
CN1645259B (zh) 抗蚀剂残渣去除液组合物及半导体电路元件的制造方法
TWI388943B (zh) 剝離劑組合物
EP3774680A1 (en) Cleaning compositions
JP7657154B2 (ja) エッチング組成物
JP2003035963A (ja) フォトレジスト残渣除去液組成物
TW201022433A (en) Solution for removal of residue after semiconductor dry processing and residue removal method using same
JP3298628B2 (ja) 半導体装置の製造方法
JP2004094034A (ja) 剥離剤組成物

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees