TR200103487T2 - Isı ile genişletilebilir mikrokapsüller içeren aktif terkip. - Google Patents

Isı ile genişletilebilir mikrokapsüller içeren aktif terkip.

Info

Publication number
TR200103487T2
TR200103487T2 TR2001/03487T TR200103487T TR200103487T2 TR 200103487 T2 TR200103487 T2 TR 200103487T2 TR 2001/03487 T TR2001/03487 T TR 2001/03487T TR 200103487 T TR200103487 T TR 200103487T TR 200103487 T2 TR200103487 T2 TR 200103487T2
Authority
TR
Turkey
Prior art keywords
composition containing
active composition
containing heat
expandable microcapsules
microcapsules
Prior art date
Application number
TR2001/03487T
Other languages
English (en)
Turkish (tr)
Inventor
Stewart Bain Peter
Manfre Giovanni
Original Assignee
Stewart Bain Peter
Manfre Giovanni
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10854522&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TR200103487(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Stewart Bain Peter, Manfre Giovanni filed Critical Stewart Bain Peter
Publication of TR200103487T2 publication Critical patent/TR200103487T2/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
    • B60J10/00—Sealing arrangements
    • B60J10/45—Assembling sealing arrangements with vehicle parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
    • B60J10/00—Sealing arrangements
    • B60J10/70—Sealing arrangements specially adapted for windows or windscreens
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00—Foams characterized by the expanding agent
    • C08J2203/22—Expandable microspheres, e.g. Expancel®
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2207/00—Foams characterised by their intended use
    • C08J2207/02—Adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2375/04—Polyurethanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Materials For Medical Uses (AREA)
TR2001/03487T 1999-06-02 2000-05-26 Isı ile genişletilebilir mikrokapsüller içeren aktif terkip. TR200103487T2 (tr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9912694.8A GB9912694D0 (en) 1999-06-02 1999-06-02 Adhesive

Publications (1)

Publication Number Publication Date
TR200103487T2 true TR200103487T2 (tr) 2002-04-22

Family

ID=10854522

Family Applications (1)

Application Number Title Priority Date Filing Date
TR2001/03487T TR200103487T2 (tr) 1999-06-02 2000-05-26 Isı ile genişletilebilir mikrokapsüller içeren aktif terkip.

Country Status (20)

Country Link
EP (1) EP1185594B2 (enExample)
JP (1) JP2003501544A (enExample)
KR (1) KR100696436B1 (enExample)
CN (1) CN1192070C (enExample)
AT (1) ATE292168T1 (enExample)
AU (1) AU4940200A (enExample)
BR (1) BR0011128B1 (enExample)
CZ (1) CZ20014260A3 (enExample)
DE (1) DE60019109T3 (enExample)
ES (1) ES2239007T5 (enExample)
GB (2) GB9912694D0 (enExample)
HK (1) HK1047446B (enExample)
HU (1) HUP0202982A2 (enExample)
MX (1) MXPA01012504A (enExample)
PL (1) PL352210A1 (enExample)
PT (1) PT1185594E (enExample)
RU (1) RU2265636C2 (enExample)
TR (1) TR200103487T2 (enExample)
WO (1) WO2000075254A1 (enExample)
ZA (1) ZA200109817B (enExample)

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US7371300B2 (en) 1999-06-02 2008-05-13 De-Bonding Limited Adhesive composition comprising thermoexpandable microcapsules
US9511536B2 (en) * 2002-10-18 2016-12-06 The Boeing Company Method and apparatus to assist with removing an adhesive system
FR2852965B1 (fr) * 2003-03-25 2005-06-03 Rescoll Soc Procede de demontage des revetements et assemblages colles programme par utilisation de primaires d'adhesion modifies
GB0307504D0 (en) * 2003-04-01 2003-05-07 Debonding Ltd Method and apparatus for bonding and debonding adhesive interface surfaces
KR20050116838A (ko) 2003-04-01 2005-12-13 디-본딩 리미티드 접착성 계면의 결합 및 탈결합 방법 및 그 장치
FR2877349B1 (fr) * 2004-11-04 2007-04-27 Rescoll Sarl Soc Procede d'assemblage de deux substrats par collage, procede de demontage de cet assemblage colle par migration
HUE028109T2 (en) * 2007-02-28 2016-11-28 Basf Se A method of producing composite elements based on isocyanate-based foam materials
US8709141B2 (en) 2007-03-02 2014-04-29 Ppg Industries Ohio, Inc. Heat releasable composite coatings and related methods
DE202007019297U1 (de) 2007-10-19 2011-11-14 Nitto Denko Corp. Ein Klebeband
US8721831B2 (en) * 2008-06-27 2014-05-13 Glabete Ag Fastening composition and process for fixing an article to a substrate
GB0811941D0 (en) * 2008-07-01 2008-07-30 Bonding Ltd De Coated thermoexpandable microspheres
EP2367619B1 (en) 2008-12-17 2017-04-05 Dow Corning Corporation Suspensions of silicate shell microcapsules for temperature controlled release
DE102009019484B4 (de) * 2009-05-04 2015-12-17 Airbus Defence and Space GmbH Kombination der Effekte von Expansionsstoffen und chemischen Abbaureagenzien für lösbare Klebeverbindungen
DE102009019483A1 (de) * 2009-05-04 2010-11-11 Eads Deutschland Gmbh Klebstoff-Zusammensetzung für lösbare Klebeverbindungen und Modifikation der Verkapselungsmaterialien für gezielte Energieeinbringung
WO2011069771A1 (en) 2009-12-09 2011-06-16 Evonik Degussa Gmbh Heat-expandable microcapsules comprising magnetic metal oxide particles
FR2954777B1 (fr) 2009-12-29 2013-03-08 Rescoll Assemblage de deux substrats colles par un polymere souple, procedes de montage et de demontage par migration de cet assemblage colle
FR2954776B1 (fr) 2009-12-29 2013-03-08 Rescoll Assemblage de deux substrats colles par un polymere rigide, procedes de montage et de demontage par migration de cet assemblage colle
DE102011087636A1 (de) 2011-12-02 2013-06-06 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Entfernen einer durch Verklebung in einen Rahmen eingesetzte Scheibe
DE102011087656B4 (de) * 2011-12-02 2022-09-22 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Entfernen einer durch Verklebung in einen Rahmen eingesetzten Scheibe
CN104119811A (zh) * 2013-04-26 2014-10-29 鸿富锦精密工业（深圳）有限公司 粘结结构及其采用的表面处理剂
EP2942334A1 (de) * 2014-05-06 2015-11-11 Siemens Aktiengesellschaft Schichtsystem für ein Bauteil
GB201416183D0 (en) * 2014-09-12 2014-10-29 Pilkington Group Ltd Wired glazing
KR102748561B1 (ko) 2016-12-02 2025-01-03 삼성디스플레이 주식회사 열박리형 접착 부재 및 이를 포함하는 표시 장치
KR20180136029A (ko) 2017-06-13 2018-12-24 삼성디스플레이 주식회사 열박리형 접착 부재 및 이를 포함하는 표시 장치
WO2022069164A1 (en) 2020-09-30 2022-04-07 Basf Se De-bondable polyurethane adhesives based on thermally expandable microspheres
TW202248372A (zh) 2021-03-31 2022-12-16 日商Ｄｎｐ精細化工股份有限公司 非水性墨水組合物、墨水組、使用其之記錄方法、記錄物之製造方法、記錄物、及噴墨記錄裝置
DE102021210563A1 (de) 2021-09-22 2023-03-23 Tesa Se Primer zur Herstellung einer lösbaren Klebverbindung
CN114437636B (zh) * 2022-02-24 2023-06-16 韦尔通科技股份有限公司 一种单组份丙烯酸酯胶黏剂及其制备方法和基材的粘接方法

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Also Published As

Publication number Publication date
CN1354774A (zh) 2002-06-19
GB9912694D0 (en) 1999-08-04
DE60019109T2 (de) 2006-02-02
KR20020034085A (ko) 2002-05-08
DE60019109D1 (de) 2005-05-04
CZ20014260A3 (cs) 2002-04-17
EP1185594B2 (en) 2009-02-25
GB2365431B (en) 2003-12-17
HK1047446A1 (en) 2003-02-21
CN1192070C (zh) 2005-03-09
HK1047446B (en) 2005-09-23
BR0011128B1 (pt) 2011-07-12
KR100696436B1 (ko) 2007-03-19
ATE292168T1 (de) 2005-04-15
EP1185594A1 (en) 2002-03-13
RU2265636C2 (ru) 2005-12-10
ES2239007T3 (es) 2005-09-16
PT1185594E (pt) 2005-07-29
WO2000075254A1 (en) 2000-12-14
GB0127411D0 (en) 2002-01-09
HUP0202982A2 (en) 2002-12-28
GB2365431A (en) 2002-02-20
MXPA01012504A (es) 2003-10-14
JP2003501544A (ja) 2003-01-14
EP1185594B1 (en) 2005-03-30
BR0011128A (pt) 2002-02-26
AU4940200A (en) 2000-12-28
ES2239007T5 (es) 2009-06-02
ZA200109817B (en) 2002-03-27
DE60019109T3 (de) 2010-01-14
PL352210A1 (en) 2003-08-11

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