CN1192070C - 含有可热膨胀微胶囊的胶粘剂组合物 - Google Patents

含有可热膨胀微胶囊的胶粘剂组合物 Download PDF

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Publication number
CN1192070C
CN1192070C CNB008083967A CN00808396A CN1192070C CN 1192070 C CN1192070 C CN 1192070C CN B008083967 A CNB008083967 A CN B008083967A CN 00808396 A CN00808396 A CN 00808396A CN 1192070 C CN1192070 C CN 1192070C
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CN
China
Prior art keywords
microcapsules
adhesive
composition
adhesive composition
shell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB008083967A
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English (en)
Chinese (zh)
Other versions
CN1354774A (zh
Inventor
彼得·斯图尔特·贝恩
乔凡尼·曼弗雷
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Individual
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Application filed by Individual filed Critical Individual
Publication of CN1354774A publication Critical patent/CN1354774A/zh
Application granted granted Critical
Publication of CN1192070C publication Critical patent/CN1192070C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
    • B60J10/00—Sealing arrangements
    • B60J10/45—Assembling sealing arrangements with vehicle parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
    • B60J10/00—Sealing arrangements
    • B60J10/70—Sealing arrangements specially adapted for windows or windscreens
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00—Foams characterized by the expanding agent
    • C08J2203/22—Expandable microspheres, e.g. Expancel®
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2207/00—Foams characterised by their intended use
    • C08J2207/02—Adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2375/04—Polyurethanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Materials For Medical Uses (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
CNB008083967A 1999-06-02 2000-05-26 含有可热膨胀微胶囊的胶粘剂组合物 Expired - Fee Related CN1192070C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9912694.8 1999-06-02
GBGB9912694.8A GB9912694D0 (en) 1999-06-02 1999-06-02 Adhesive

Publications (2)

Publication Number Publication Date
CN1354774A CN1354774A (zh) 2002-06-19
CN1192070C true CN1192070C (zh) 2005-03-09

Family

ID=10854522

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB008083967A Expired - Fee Related CN1192070C (zh) 1999-06-02 2000-05-26 含有可热膨胀微胶囊的胶粘剂组合物

Country Status (20)

Country Link
EP (1) EP1185594B2 (enExample)
JP (1) JP2003501544A (enExample)
KR (1) KR100696436B1 (enExample)
CN (1) CN1192070C (enExample)
AT (1) ATE292168T1 (enExample)
AU (1) AU4940200A (enExample)
BR (1) BR0011128B1 (enExample)
CZ (1) CZ20014260A3 (enExample)
DE (1) DE60019109T3 (enExample)
ES (1) ES2239007T5 (enExample)
GB (2) GB9912694D0 (enExample)
HK (1) HK1047446B (enExample)
HU (1) HUP0202982A2 (enExample)
MX (1) MXPA01012504A (enExample)
PL (1) PL352210A1 (enExample)
PT (1) PT1185594E (enExample)
RU (1) RU2265636C2 (enExample)
TR (1) TR200103487T2 (enExample)
WO (1) WO2000075254A1 (enExample)
ZA (1) ZA200109817B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022069164A1 (en) 2020-09-30 2022-04-07 Basf Se De-bondable polyurethane adhesives based on thermally expandable microspheres

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US9511536B2 (en) * 2002-10-18 2016-12-06 The Boeing Company Method and apparatus to assist with removing an adhesive system
FR2852965B1 (fr) * 2003-03-25 2005-06-03 Rescoll Soc Procede de demontage des revetements et assemblages colles programme par utilisation de primaires d'adhesion modifies
GB0307504D0 (en) * 2003-04-01 2003-05-07 Debonding Ltd Method and apparatus for bonding and debonding adhesive interface surfaces
DK1608717T3 (da) 2003-04-01 2010-07-19 Bonding Ltd De Fremgangsmåde og apparat til binding eller afbinding af adhæsive grænseoverflader
FR2877349B1 (fr) * 2004-11-04 2007-04-27 Rescoll Sarl Soc Procede d'assemblage de deux substrats par collage, procede de demontage de cet assemblage colle par migration
CN101622114B (zh) * 2007-02-28 2013-06-26 巴斯夫欧洲公司 在基于异氰酸酯的泡沫材料的基础上制备复合元件的方法
US8709141B2 (en) 2007-03-02 2014-04-29 Ppg Industries Ohio, Inc. Heat releasable composite coatings and related methods
DE202007019297U1 (de) 2007-10-19 2011-11-14 Nitto Denko Corp. Ein Klebeband
ES2754817T3 (es) * 2008-06-27 2020-04-20 Aufrecht Gmbh Medio de fijación y procedimiento para fijar un artículo sobre un sustrato
GB0811941D0 (en) * 2008-07-01 2008-07-30 Bonding Ltd De Coated thermoexpandable microspheres
KR101669634B1 (ko) 2008-12-17 2016-10-26 다우 코닝 코포레이션 온도 조절 방출을 위한 실리케이트 쉘 마이크로캡슐의 현탁액
DE102009019483A1 (de) 2009-05-04 2010-11-11 Eads Deutschland Gmbh Klebstoff-Zusammensetzung für lösbare Klebeverbindungen und Modifikation der Verkapselungsmaterialien für gezielte Energieeinbringung
DE102009019484B4 (de) * 2009-05-04 2015-12-17 Airbus Defence and Space GmbH Kombination der Effekte von Expansionsstoffen und chemischen Abbaureagenzien für lösbare Klebeverbindungen
WO2011069771A1 (en) 2009-12-09 2011-06-16 Evonik Degussa Gmbh Heat-expandable microcapsules comprising magnetic metal oxide particles
FR2954776B1 (fr) 2009-12-29 2013-03-08 Rescoll Assemblage de deux substrats colles par un polymere rigide, procedes de montage et de demontage par migration de cet assemblage colle
FR2954777B1 (fr) 2009-12-29 2013-03-08 Rescoll Assemblage de deux substrats colles par un polymere souple, procedes de montage et de demontage par migration de cet assemblage colle
DE102011087636A1 (de) 2011-12-02 2013-06-06 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Entfernen einer durch Verklebung in einen Rahmen eingesetzte Scheibe
DE102011087656B4 (de) * 2011-12-02 2022-09-22 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Entfernen einer durch Verklebung in einen Rahmen eingesetzten Scheibe
CN104119811A (zh) * 2013-04-26 2014-10-29 鸿富锦精密工业（深圳）有限公司 粘结结构及其采用的表面处理剂
EP2942334A1 (de) * 2014-05-06 2015-11-11 Siemens Aktiengesellschaft Schichtsystem für ein Bauteil
GB201416183D0 (en) * 2014-09-12 2014-10-29 Pilkington Group Ltd Wired glazing
KR102748561B1 (ko) 2016-12-02 2025-01-03 삼성디스플레이 주식회사 열박리형 접착 부재 및 이를 포함하는 표시 장치
KR20180136029A (ko) 2017-06-13 2018-12-24 삼성디스플레이 주식회사 열박리형 접착 부재 및 이를 포함하는 표시 장치
TW202248372A (zh) 2021-03-31 2022-12-16 日商Ｄｎｐ精細化工股份有限公司 非水性墨水組合物、墨水組、使用其之記錄方法、記錄物之製造方法、記錄物、及噴墨記錄裝置
DE102021210563A1 (de) 2021-09-22 2023-03-23 Tesa Se Primer zur Herstellung einer lösbaren Klebverbindung
CN114437636B (zh) * 2022-02-24 2023-06-16 韦尔通科技股份有限公司 一种单组份丙烯酸酯胶黏剂及其制备方法和基材的粘接方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022069164A1 (en) 2020-09-30 2022-04-07 Basf Se De-bondable polyurethane adhesives based on thermally expandable microspheres

Also Published As

Publication number Publication date
TR200103487T2 (tr) 2002-04-22
WO2000075254A1 (en) 2000-12-14
JP2003501544A (ja) 2003-01-14
KR100696436B1 (ko) 2007-03-19
CZ20014260A3 (cs) 2002-04-17
ATE292168T1 (de) 2005-04-15
PT1185594E (pt) 2005-07-29
HK1047446A1 (en) 2003-02-21
MXPA01012504A (es) 2003-10-14
BR0011128B1 (pt) 2011-07-12
EP1185594B2 (en) 2009-02-25
BR0011128A (pt) 2002-02-26
KR20020034085A (ko) 2002-05-08
GB0127411D0 (en) 2002-01-09
EP1185594A1 (en) 2002-03-13
DE60019109D1 (de) 2005-05-04
GB9912694D0 (en) 1999-08-04
PL352210A1 (en) 2003-08-11
HK1047446B (en) 2005-09-23
ES2239007T3 (es) 2005-09-16
EP1185594B1 (en) 2005-03-30
ES2239007T5 (es) 2009-06-02
CN1354774A (zh) 2002-06-19
DE60019109T3 (de) 2010-01-14
DE60019109T2 (de) 2006-02-02
AU4940200A (en) 2000-12-28
GB2365431B (en) 2003-12-17
HUP0202982A2 (en) 2002-12-28
GB2365431A (en) 2002-02-20
RU2265636C2 (ru) 2005-12-10
ZA200109817B (en) 2002-03-27

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Granted publication date: 20050309

Termination date: 20140526