JP2003501544A - 熱膨張性のマイクロカプセルを含んでなる接着用の組成物 - Google Patents

熱膨張性のマイクロカプセルを含んでなる接着用の組成物

Info

Publication number
JP2003501544A
JP2003501544A JP2001502525A JP2001502525A JP2003501544A JP 2003501544 A JP2003501544 A JP 2003501544A JP 2001502525 A JP2001502525 A JP 2001502525A JP 2001502525 A JP2001502525 A JP 2001502525A JP 2003501544 A JP2003501544 A JP 2003501544A
Authority
JP
Japan
Prior art keywords
composition
microcapsules
adhesive
composition according
range
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001502525A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003501544A5 (enExample
Inventor
ベイン，ピーター・スチュワート
マンフレ，ジョヴァンニ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10854522&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP2003501544(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Individual filed Critical Individual
Publication of JP2003501544A publication Critical patent/JP2003501544A/ja
Publication of JP2003501544A5 publication Critical patent/JP2003501544A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
    • B60J10/00—Sealing arrangements
    • B60J10/45—Assembling sealing arrangements with vehicle parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
    • B60J10/00—Sealing arrangements
    • B60J10/70—Sealing arrangements specially adapted for windows or windscreens
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00—Foams characterized by the expanding agent
    • C08J2203/22—Expandable microspheres, e.g. Expancel®
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2207/00—Foams characterised by their intended use
    • C08J2207/02—Adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2375/04—Polyurethanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Materials For Medical Uses (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
JP2001502525A 1999-06-02 2000-05-26 熱膨張性のマイクロカプセルを含んでなる接着用の組成物 Pending JP2003501544A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9912694.8 1999-06-02
GBGB9912694.8A GB9912694D0 (en) 1999-06-02 1999-06-02 Adhesive
PCT/GB2000/002059 WO2000075254A1 (en) 1999-06-02 2000-05-26 Adhesive composition comprising thermoexpandable microcapsules

Publications (2)

Publication Number Publication Date
JP2003501544A true JP2003501544A (ja) 2003-01-14
JP2003501544A5 JP2003501544A5 (enExample) 2007-07-05

Family

ID=10854522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001502525A Pending JP2003501544A (ja) 1999-06-02 2000-05-26 熱膨張性のマイクロカプセルを含んでなる接着用の組成物

Country Status (20)

Country Link
EP (1) EP1185594B2 (enExample)
JP (1) JP2003501544A (enExample)
KR (1) KR100696436B1 (enExample)
CN (1) CN1192070C (enExample)
AT (1) ATE292168T1 (enExample)
AU (1) AU4940200A (enExample)
BR (1) BR0011128B1 (enExample)
CZ (1) CZ20014260A3 (enExample)
DE (1) DE60019109T3 (enExample)
ES (1) ES2239007T5 (enExample)
GB (2) GB9912694D0 (enExample)
HK (1) HK1047446B (enExample)
HU (1) HUP0202982A2 (enExample)
MX (1) MXPA01012504A (enExample)
PL (1) PL352210A1 (enExample)
PT (1) PT1185594E (enExample)
RU (1) RU2265636C2 (enExample)
TR (1) TR200103487T2 (enExample)
WO (1) WO2000075254A1 (enExample)
ZA (1) ZA200109817B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006522197A (ja) * 2003-04-01 2006-09-28 ディ‐ボンディング・リミテッド 接着界面の接合および剥離のための方法および装置
JP2011525551A (ja) * 2008-06-27 2011-09-22 グラベーテ アクチエンゲゼルシャフト 固定剤及び基材上に物品を固定する方法

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7371300B2 (en) 1999-06-02 2008-05-13 De-Bonding Limited Adhesive composition comprising thermoexpandable microcapsules
US9511536B2 (en) * 2002-10-18 2016-12-06 The Boeing Company Method and apparatus to assist with removing an adhesive system
FR2852965B1 (fr) * 2003-03-25 2005-06-03 Rescoll Soc Procede de demontage des revetements et assemblages colles programme par utilisation de primaires d'adhesion modifies
GB0307504D0 (en) * 2003-04-01 2003-05-07 Debonding Ltd Method and apparatus for bonding and debonding adhesive interface surfaces
FR2877349B1 (fr) * 2004-11-04 2007-04-27 Rescoll Sarl Soc Procede d'assemblage de deux substrats par collage, procede de demontage de cet assemblage colle par migration
CN101622114B (zh) * 2007-02-28 2013-06-26 巴斯夫欧洲公司 在基于异氰酸酯的泡沫材料的基础上制备复合元件的方法
US8709141B2 (en) 2007-03-02 2014-04-29 Ppg Industries Ohio, Inc. Heat releasable composite coatings and related methods
DE202007019297U1 (de) 2007-10-19 2011-11-14 Nitto Denko Corp. Ein Klebeband
GB0811941D0 (en) * 2008-07-01 2008-07-30 Bonding Ltd De Coated thermoexpandable microspheres
KR101669634B1 (ko) 2008-12-17 2016-10-26 다우 코닝 코포레이션 온도 조절 방출을 위한 실리케이트 쉘 마이크로캡슐의 현탁액
DE102009019483A1 (de) 2009-05-04 2010-11-11 Eads Deutschland Gmbh Klebstoff-Zusammensetzung für lösbare Klebeverbindungen und Modifikation der Verkapselungsmaterialien für gezielte Energieeinbringung
DE102009019484B4 (de) * 2009-05-04 2015-12-17 Airbus Defence and Space GmbH Kombination der Effekte von Expansionsstoffen und chemischen Abbaureagenzien für lösbare Klebeverbindungen
WO2011069771A1 (en) 2009-12-09 2011-06-16 Evonik Degussa Gmbh Heat-expandable microcapsules comprising magnetic metal oxide particles
FR2954776B1 (fr) 2009-12-29 2013-03-08 Rescoll Assemblage de deux substrats colles par un polymere rigide, procedes de montage et de demontage par migration de cet assemblage colle
FR2954777B1 (fr) 2009-12-29 2013-03-08 Rescoll Assemblage de deux substrats colles par un polymere souple, procedes de montage et de demontage par migration de cet assemblage colle
DE102011087636A1 (de) 2011-12-02 2013-06-06 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Entfernen einer durch Verklebung in einen Rahmen eingesetzte Scheibe
DE102011087656B4 (de) * 2011-12-02 2022-09-22 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Entfernen einer durch Verklebung in einen Rahmen eingesetzten Scheibe
CN104119811A (zh) * 2013-04-26 2014-10-29 鸿富锦精密工业（深圳）有限公司 粘结结构及其采用的表面处理剂
EP2942334A1 (de) * 2014-05-06 2015-11-11 Siemens Aktiengesellschaft Schichtsystem für ein Bauteil
GB201416183D0 (en) * 2014-09-12 2014-10-29 Pilkington Group Ltd Wired glazing
KR102748561B1 (ko) 2016-12-02 2025-01-03 삼성디스플레이 주식회사 열박리형 접착 부재 및 이를 포함하는 표시 장치
KR20180136029A (ko) 2017-06-13 2018-12-24 삼성디스플레이 주식회사 열박리형 접착 부재 및 이를 포함하는 표시 장치
CN116234850A (zh) 2020-09-30 2023-06-06 巴斯夫欧洲公司 基于热膨胀微球的可脱粘聚氨酯粘合剂
TW202248372A (zh) 2021-03-31 2022-12-16 日商Ｄｎｐ精細化工股份有限公司 非水性墨水組合物、墨水組、使用其之記錄方法、記錄物之製造方法、記錄物、及噴墨記錄裝置
DE102021210563A1 (de) 2021-09-22 2023-03-23 Tesa Se Primer zur Herstellung einer lösbaren Klebverbindung
CN114437636B (zh) * 2022-02-24 2023-06-16 韦尔通科技股份有限公司 一种单组份丙烯酸酯胶黏剂及其制备方法和基材的粘接方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5013878Y1 (enExample) * 1970-04-30 1975-04-28
JPS5124534B1 (enExample) * 1969-03-24 1976-07-24
JPS5661469A (en) * 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Hot-bonding adhesive
JPS5661468A (en) * 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Releasable adhesive
JPS60252681A (ja) * 1984-05-30 1985-12-13 F S K Kk 熱剥離性粘着シ−ト
JPH05269906A (ja) * 1992-03-26 1993-10-19 Toppan Printing Co Ltd 積層体およびその分離方法
JPH07138538A (ja) * 1993-11-12 1995-05-30 Daicel Chem Ind Ltd 熱剥離性フィルム及び剥離方法
JPH1072035A (ja) * 1996-08-27 1998-03-17 Shiseido Co Ltd 装着部材付き容器
JPH11166164A (ja) * 1997-12-01 1999-06-22 Nitto Denko Corp 加熱剥離型粘着シート

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL302030A (enExample) † 1962-12-21 1900-01-01
US5064494A (en) * 1987-06-12 1991-11-12 Teroson G.M.B.H. Process for the at least partial curing of sealants and adhesives using pulsed microwave energy
JP3057236B2 (ja) * 1990-07-01 2000-06-26 株式会社アルファ技研 ２―シアノアクリレート系組成物
JPH04292684A (ja) * 1991-03-19 1992-10-16 Asahi Corp 膨脹シーリング材
ES2093236T3 (es) * 1991-07-03 1996-12-16 Gurit Essex Ag Uniones adhesivas separables, procedimiento para su fabricacion y la utilizacion de dispositivos para separar tales uniones adhesivas.
JP2970963B2 (ja) † 1991-08-14 1999-11-02 日東電工株式会社 剥離性感圧接着剤及びその粘着部材
IT1269293B (it) * 1994-03-07 1997-03-26 Ppg Ind Italia S R L Composizione di adesivo per il riempimento di parti scatolate di scocche di veicoli
DE69517396T2 (de) * 1994-12-15 2001-02-22 Saint Gobain Performance Plast Geschäumtes Druckklebemittel
DE19822044A1 (de) † 1998-05-16 2000-01-13 Daimler Chrysler Ag Klebeverbindung
JP4540150B2 (ja) * 1998-09-30 2010-09-08 日東電工株式会社 熱剥離型粘着シート
JP3594853B2 (ja) * 1999-11-08 2004-12-02 日東電工株式会社 加熱剥離型粘着シート
JP2001226650A (ja) * 2000-02-16 2001-08-21 Nitto Denko Corp 放射線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
JP2001323228A (ja) * 2000-05-15 2001-11-22 Nitto Denko Corp 加熱剥離型粘着シート

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5124534B1 (enExample) * 1969-03-24 1976-07-24
JPS5013878Y1 (enExample) * 1970-04-30 1975-04-28
JPS5661469A (en) * 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Hot-bonding adhesive
JPS5661468A (en) * 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Releasable adhesive
JPS60252681A (ja) * 1984-05-30 1985-12-13 F S K Kk 熱剥離性粘着シ−ト
JPH05269906A (ja) * 1992-03-26 1993-10-19 Toppan Printing Co Ltd 積層体およびその分離方法
JPH07138538A (ja) * 1993-11-12 1995-05-30 Daicel Chem Ind Ltd 熱剥離性フィルム及び剥離方法
JPH1072035A (ja) * 1996-08-27 1998-03-17 Shiseido Co Ltd 装着部材付き容器
JPH11166164A (ja) * 1997-12-01 1999-06-22 Nitto Denko Corp 加熱剥離型粘着シート

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006522197A (ja) * 2003-04-01 2006-09-28 ディ‐ボンディング・リミテッド 接着界面の接合および剥離のための方法および装置
JP2011525551A (ja) * 2008-06-27 2011-09-22 グラベーテ アクチエンゲゼルシャフト 固定剤及び基材上に物品を固定する方法

Also Published As

Publication number Publication date
TR200103487T2 (tr) 2002-04-22
WO2000075254A1 (en) 2000-12-14
KR100696436B1 (ko) 2007-03-19
CZ20014260A3 (cs) 2002-04-17
ATE292168T1 (de) 2005-04-15
PT1185594E (pt) 2005-07-29
HK1047446A1 (en) 2003-02-21
MXPA01012504A (es) 2003-10-14
BR0011128B1 (pt) 2011-07-12
EP1185594B2 (en) 2009-02-25
BR0011128A (pt) 2002-02-26
KR20020034085A (ko) 2002-05-08
GB0127411D0 (en) 2002-01-09
EP1185594A1 (en) 2002-03-13
CN1192070C (zh) 2005-03-09
DE60019109D1 (de) 2005-05-04
GB9912694D0 (en) 1999-08-04
PL352210A1 (en) 2003-08-11
HK1047446B (en) 2005-09-23
ES2239007T3 (es) 2005-09-16
EP1185594B1 (en) 2005-03-30
ES2239007T5 (es) 2009-06-02
CN1354774A (zh) 2002-06-19
DE60019109T3 (de) 2010-01-14
DE60019109T2 (de) 2006-02-02
AU4940200A (en) 2000-12-28
GB2365431B (en) 2003-12-17
HUP0202982A2 (en) 2002-12-28
GB2365431A (en) 2002-02-20
RU2265636C2 (ru) 2005-12-10
ZA200109817B (en) 2002-03-27

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