GB9912694D0 - Adhesive - Google Patents

Adhesive

Info

Publication number
GB9912694D0
GB9912694D0 GBGB9912694.8A GB9912694A GB9912694D0 GB 9912694 D0 GB9912694 D0 GB 9912694D0 GB 9912694 A GB9912694 A GB 9912694A GB 9912694 D0 GB9912694 D0 GB 9912694D0
Authority
GB
United Kingdom
Prior art keywords
adhesive
microcapsules
composition
act
release
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB9912694.8A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAIN PETER S
MAFR GIOVANNI
Original Assignee
BAIN PETER S
MAFR GIOVANNI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10854522&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=GB9912694(D0) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by BAIN PETER S, MAFR GIOVANNI filed Critical BAIN PETER S
Priority to GBGB9912694.8A priority Critical patent/GB9912694D0/en
Publication of GB9912694D0 publication Critical patent/GB9912694D0/en
Priority to GB0127411A priority patent/GB2365431B/en
Priority to CZ20014260A priority patent/CZ20014260A3/cs
Priority to DE60019109T priority patent/DE60019109T3/de
Priority to DK00931451T priority patent/DK1185594T4/da
Priority to ES00931451T priority patent/ES2239007T5/es
Priority to AT00931451T priority patent/ATE292168T1/de
Priority to MXPA01012504A priority patent/MXPA01012504A/es
Priority to CNB008083967A priority patent/CN1192070C/zh
Priority to AU49402/00A priority patent/AU4940200A/en
Priority to JP2001502525A priority patent/JP2003501544A/ja
Priority to KR1020017015343A priority patent/KR100696436B1/ko
Priority to PL00352210A priority patent/PL352210A1/xx
Priority to TR2001/03487T priority patent/TR200103487T2/xx
Priority to PT00931451T priority patent/PT1185594E/pt
Priority to HU0202982A priority patent/HUP0202982A2/hu
Priority to BRPI0011128-7A priority patent/BR0011128B1/pt
Priority to EP00931451A priority patent/EP1185594B2/en
Priority to HK02106741.7A priority patent/HK1047446B/en
Priority to RU2001132628/04A priority patent/RU2265636C2/ru
Priority to PCT/GB2000/002059 priority patent/WO2000075254A1/en
Priority to ZA200109817A priority patent/ZA200109817B/xx
Priority to US10/909,098 priority patent/US7371300B2/en
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
    • B60J10/00—Sealing arrangements
    • B60J10/45—Assembling sealing arrangements with vehicle parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
    • B60J10/00—Sealing arrangements
    • B60J10/70—Sealing arrangements specially adapted for windows or windscreens
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00—Foams characterized by the expanding agent
    • C08J2203/22—Expandable microspheres, e.g. Expancel®
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2207/00—Foams characterised by their intended use
    • C08J2207/02—Adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2375/04—Polyurethanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Materials For Medical Uses (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
GBGB9912694.8A 1999-06-02 1999-06-02 Adhesive Ceased GB9912694D0 (en)

Priority Applications (23)

Application Number Priority Date Filing Date Title
GBGB9912694.8A GB9912694D0 (en) 1999-06-02 1999-06-02 Adhesive
RU2001132628/04A RU2265636C2 (ru) 1999-06-02 2000-05-26 Клеевая композиция
PCT/GB2000/002059 WO2000075254A1 (en) 1999-06-02 2000-05-26 Adhesive composition comprising thermoexpandable microcapsules
AU49402/00A AU4940200A (en) 1999-06-02 2000-05-26 Adhesive composition comprising thermoexpandable microcapsules
PL00352210A PL352210A1 (en) 1999-06-02 2000-05-26 Bonding composition containing thermally expandable microcapsules
DE60019109T DE60019109T3 (de) 1999-06-02 2000-05-26 Thermoexpandierbare mikrohohlkugeln enthaltende klebstoffzusammensetzung
DK00931451T DK1185594T4 (da) 1999-06-02 2000-05-26 Adhæsivpræparat omfattende termoekspanderbare mikrokapsler
ES00931451T ES2239007T5 (es) 1999-06-02 2000-05-26 Composicion adhesiva que comprende microcapsulas termoexpandibles.
AT00931451T ATE292168T1 (de) 1999-06-02 2000-05-26 Thermoexpandierbare mikrohohlkugeln enthaltende klebstoffzusammensetzung
MXPA01012504A MXPA01012504A (es) 1999-06-02 2000-05-26 Composicion adhesiva que comprende microcapsulas termoexpansibles.
CNB008083967A CN1192070C (zh) 1999-06-02 2000-05-26 含有可热膨胀微胶囊的胶粘剂组合物
GB0127411A GB2365431B (en) 1999-06-02 2000-05-26 Adhesive composition comprising thermoexpandable microcapsules
JP2001502525A JP2003501544A (ja) 1999-06-02 2000-05-26 熱膨張性のマイクロカプセルを含んでなる接着用の組成物
KR1020017015343A KR100696436B1 (ko) 1999-06-02 2000-05-26 열팽창성 마이크로캡슐을 포함하는 접착성 조성물
CZ20014260A CZ20014260A3 (cs) 1999-06-02 2000-05-26 Adhezívní přípravek obsahující teplem se rozpínající mikrokapsle
TR2001/03487T TR200103487T2 (tr) 1999-06-02 2000-05-26 Isı ile genişletilebilir mikrokapsüller içeren aktif terkip.
PT00931451T PT1185594E (pt) 1999-06-02 2000-05-26 Composicao adesiva que compreende microcapsulas termoexpansiveis
HU0202982A HUP0202982A2 (en) 1999-06-02 2000-05-26 Adhesive composition comprising thermoexpandable microcapsules
BRPI0011128-7A BR0011128B1 (pt) 1999-06-02 2000-05-26 método de remoção de um pára-brisa de veìculo, vidro fixo ou painel de veìculo.
EP00931451A EP1185594B2 (en) 1999-06-02 2000-05-26 Adhesive composition comprising thermoexpandable microcapsules
HK02106741.7A HK1047446B (en) 1999-06-02 2000-05-26 Binder composition containing thermally expandable microcapsules
ZA200109817A ZA200109817B (en) 1999-06-02 2001-11-29 Adhesive composition comprising thermoexpandable microcapsules.
US10/909,098 US7371300B2 (en) 1999-06-02 2004-07-30 Adhesive composition comprising thermoexpandable microcapsules

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9912694.8A GB9912694D0 (en) 1999-06-02 1999-06-02 Adhesive

Publications (1)

Publication Number Publication Date
GB9912694D0 true GB9912694D0 (en) 1999-08-04

Family

ID=10854522

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB9912694.8A Ceased GB9912694D0 (en) 1999-06-02 1999-06-02 Adhesive
GB0127411A Expired - Fee Related GB2365431B (en) 1999-06-02 2000-05-26 Adhesive composition comprising thermoexpandable microcapsules

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB0127411A Expired - Fee Related GB2365431B (en) 1999-06-02 2000-05-26 Adhesive composition comprising thermoexpandable microcapsules

Country Status (20)

Country Link
EP (1) EP1185594B2 (enExample)
JP (1) JP2003501544A (enExample)
KR (1) KR100696436B1 (enExample)
CN (1) CN1192070C (enExample)
AT (1) ATE292168T1 (enExample)
AU (1) AU4940200A (enExample)
BR (1) BR0011128B1 (enExample)
CZ (1) CZ20014260A3 (enExample)
DE (1) DE60019109T3 (enExample)
ES (1) ES2239007T5 (enExample)
GB (2) GB9912694D0 (enExample)
HK (1) HK1047446B (enExample)
HU (1) HUP0202982A2 (enExample)
MX (1) MXPA01012504A (enExample)
PL (1) PL352210A1 (enExample)
PT (1) PT1185594E (enExample)
RU (1) RU2265636C2 (enExample)
TR (1) TR200103487T2 (enExample)
WO (1) WO2000075254A1 (enExample)
ZA (1) ZA200109817B (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7371300B2 (en) 1999-06-02 2008-05-13 De-Bonding Limited Adhesive composition comprising thermoexpandable microcapsules
US9511536B2 (en) * 2002-10-18 2016-12-06 The Boeing Company Method and apparatus to assist with removing an adhesive system
FR2852965B1 (fr) * 2003-03-25 2005-06-03 Rescoll Soc Procede de demontage des revetements et assemblages colles programme par utilisation de primaires d'adhesion modifies
GB0307504D0 (en) * 2003-04-01 2003-05-07 Debonding Ltd Method and apparatus for bonding and debonding adhesive interface surfaces
EP1608717B2 (en) 2003-04-01 2013-05-15 De-Bonding Limited Method and apparatus for bonding and debonding adhesive interface surfaces
FR2877349B1 (fr) * 2004-11-04 2007-04-27 Rescoll Sarl Soc Procede d'assemblage de deux substrats par collage, procede de demontage de cet assemblage colle par migration
EP2125323B1 (de) * 2007-02-28 2015-08-19 Basf Se Verfahren zur herstellung von verbundkörpern auf der basis von schaumstoffen auf isocyanatbasis
US8709141B2 (en) 2007-03-02 2014-04-29 Ppg Industries Ohio, Inc. Heat releasable composite coatings and related methods
DE202007019297U1 (de) 2007-10-19 2011-11-14 Nitto Denko Corp. Ein Klebeband
EP2291437B1 (de) * 2008-06-27 2019-08-14 Aufrecht GmbH Befestigungsmittel und verfahren zur fixierung eines gegenstands auf einer unterlage
GB0811941D0 (en) * 2008-07-01 2008-07-30 Bonding Ltd De Coated thermoexpandable microspheres
JP2012512025A (ja) 2008-12-17 2012-05-31 ダウ コーニング コーポレーション 温度制御放出用のシリケートシェルマイクロカプセルの懸濁液
DE102009019483A1 (de) 2009-05-04 2010-11-11 Eads Deutschland Gmbh Klebstoff-Zusammensetzung für lösbare Klebeverbindungen und Modifikation der Verkapselungsmaterialien für gezielte Energieeinbringung
DE102009019484B4 (de) * 2009-05-04 2015-12-17 Airbus Defence and Space GmbH Kombination der Effekte von Expansionsstoffen und chemischen Abbaureagenzien für lösbare Klebeverbindungen
WO2011069771A1 (en) 2009-12-09 2011-06-16 Evonik Degussa Gmbh Heat-expandable microcapsules comprising magnetic metal oxide particles
FR2954776B1 (fr) 2009-12-29 2013-03-08 Rescoll Assemblage de deux substrats colles par un polymere rigide, procedes de montage et de demontage par migration de cet assemblage colle
FR2954777B1 (fr) 2009-12-29 2013-03-08 Rescoll Assemblage de deux substrats colles par un polymere souple, procedes de montage et de demontage par migration de cet assemblage colle
DE102011087636A1 (de) 2011-12-02 2013-06-06 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Entfernen einer durch Verklebung in einen Rahmen eingesetzte Scheibe
DE102011087656B4 (de) * 2011-12-02 2022-09-22 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Entfernen einer durch Verklebung in einen Rahmen eingesetzten Scheibe
CN104119811A (zh) * 2013-04-26 2014-10-29 鸿富锦精密工业（深圳）有限公司 粘结结构及其采用的表面处理剂
EP2942334A1 (de) * 2014-05-06 2015-11-11 Siemens Aktiengesellschaft Schichtsystem für ein Bauteil
GB201416183D0 (en) * 2014-09-12 2014-10-29 Pilkington Group Ltd Wired glazing
KR102748561B1 (ko) 2016-12-02 2025-01-03 삼성디스플레이 주식회사 열박리형 접착 부재 및 이를 포함하는 표시 장치
KR20180136029A (ko) 2017-06-13 2018-12-24 삼성디스플레이 주식회사 열박리형 접착 부재 및 이를 포함하는 표시 장치
WO2022069164A1 (en) 2020-09-30 2022-04-07 Basf Se De-bondable polyurethane adhesives based on thermally expandable microspheres
JPWO2022211030A1 (enExample) 2021-03-31 2022-10-06
DE102021210563A1 (de) 2021-09-22 2023-03-23 Tesa Se Primer zur Herstellung einer lösbaren Klebverbindung
CN114437636B (zh) * 2022-02-24 2023-06-16 韦尔通科技股份有限公司 一种单组份丙烯酸酯胶黏剂及其制备方法和基材的粘接方法

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JPH01503546A (ja) * 1987-06-12 1989-11-30 ヘンケル・テロゾン・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 密閉‐及び接着剤を少くとも部分的に硬化するための方法及び装置
JP3057236B2 (ja) * 1990-07-01 2000-06-26 株式会社アルファ技研 ２―シアノアクリレート系組成物
JPH04292684A (ja) * 1991-03-19 1992-10-16 Asahi Corp 膨脹シーリング材
ES2093236T3 (es) * 1991-07-03 1996-12-16 Gurit Essex Ag Uniones adhesivas separables, procedimiento para su fabricacion y la utilizacion de dispositivos para separar tales uniones adhesivas.
JP2970963B2 (ja) † 1991-08-14 1999-11-02 日東電工株式会社 剥離性感圧接着剤及びその粘着部材
JPH05269906A (ja) * 1992-03-26 1993-10-19 Toppan Printing Co Ltd 積層体およびその分離方法
JP3405576B2 (ja) * 1993-11-12 2003-05-12 ダイセル化学工業株式会社 熱剥離性フィルム及び剥離方法
IT1269293B (it) * 1994-03-07 1997-03-26 Ppg Ind Italia S R L Composizione di adesivo per il riempimento di parti scatolate di scocche di veicoli
ES2146284T3 (es) * 1994-12-15 2000-08-01 Saint Gobain Performance Plast Adhesivo esponjoso sensible a la presion.
JPH1072035A (ja) * 1996-08-27 1998-03-17 Shiseido Co Ltd 装着部材付き容器
JP3810911B2 (ja) * 1997-12-01 2006-08-16 日東電工株式会社 加熱剥離型粘着シート
DE19822044A1 (de) † 1998-05-16 2000-01-13 Daimler Chrysler Ag Klebeverbindung
JP4540150B2 (ja) * 1998-09-30 2010-09-08 日東電工株式会社 熱剥離型粘着シート
JP3594853B2 (ja) * 1999-11-08 2004-12-02 日東電工株式会社 加熱剥離型粘着シート
JP2001226650A (ja) * 2000-02-16 2001-08-21 Nitto Denko Corp 放射線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
JP2001323228A (ja) * 2000-05-15 2001-11-22 Nitto Denko Corp 加熱剥離型粘着シート

Also Published As

Publication number Publication date
KR100696436B1 (ko) 2007-03-19
ATE292168T1 (de) 2005-04-15
TR200103487T2 (tr) 2002-04-22
ES2239007T5 (es) 2009-06-02
JP2003501544A (ja) 2003-01-14
GB2365431B (en) 2003-12-17
BR0011128B1 (pt) 2011-07-12
DE60019109D1 (de) 2005-05-04
AU4940200A (en) 2000-12-28
EP1185594A1 (en) 2002-03-13
EP1185594B1 (en) 2005-03-30
PL352210A1 (en) 2003-08-11
CN1192070C (zh) 2005-03-09
RU2265636C2 (ru) 2005-12-10
GB0127411D0 (en) 2002-01-09
HUP0202982A2 (en) 2002-12-28
ES2239007T3 (es) 2005-09-16
BR0011128A (pt) 2002-02-26
KR20020034085A (ko) 2002-05-08
DE60019109T2 (de) 2006-02-02
HK1047446A1 (en) 2003-02-21
CZ20014260A3 (cs) 2002-04-17
GB2365431A (en) 2002-02-20
EP1185594B2 (en) 2009-02-25
DE60019109T3 (de) 2010-01-14
ZA200109817B (en) 2002-03-27
MXPA01012504A (es) 2003-10-14
PT1185594E (pt) 2005-07-29
WO2000075254A1 (en) 2000-12-14
HK1047446B (en) 2005-09-23
CN1354774A (zh) 2002-06-19

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