KR100696436B1 - 열팽창성 마이크로캡슐을 포함하는 접착성 조성물 - Google Patents

열팽창성 마이크로캡슐을 포함하는 접착성 조성물 Download PDF

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Publication number
KR100696436B1
KR100696436B1 KR1020017015343A KR20017015343A KR100696436B1 KR 100696436 B1 KR100696436 B1 KR 100696436B1 KR 1020017015343 A KR1020017015343 A KR 1020017015343A KR 20017015343 A KR20017015343 A KR 20017015343A KR 100696436 B1 KR100696436 B1 KR 100696436B1
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KR
South Korea
Prior art keywords
delete delete
microcapsules
adhesive
heat
vehicle
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020017015343A
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English (en)
Korean (ko)
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KR20020034085A (ko
Inventor
피터 스튜어트 배인
지오바니 만프레
Original Assignee
피터 스튜어트 배인
지오바니 만프레
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Application filed by 피터 스튜어트 배인, 지오바니 만프레 filed Critical 피터 스튜어트 배인
Publication of KR20020034085A publication Critical patent/KR20020034085A/ko
Application granted granted Critical
Publication of KR100696436B1 publication Critical patent/KR100696436B1/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
    • B60J10/00—Sealing arrangements
    • B60J10/45—Assembling sealing arrangements with vehicle parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
    • B60J10/00—Sealing arrangements
    • B60J10/70—Sealing arrangements specially adapted for windows or windscreens
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00—Foams characterized by the expanding agent
    • C08J2203/22—Expandable microspheres, e.g. Expancel®
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2207/00—Foams characterised by their intended use
    • C08J2207/02—Adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2375/04—Polyurethanes

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Materials For Medical Uses (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
KR1020017015343A 1999-06-02 2000-05-26 열팽창성 마이크로캡슐을 포함하는 접착성 조성물 Expired - Fee Related KR100696436B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9912694.8 1999-06-02
GBGB9912694.8A GB9912694D0 (en) 1999-06-02 1999-06-02 Adhesive

Publications (2)

Publication Number Publication Date
KR20020034085A KR20020034085A (ko) 2002-05-08
KR100696436B1 true KR100696436B1 (ko) 2007-03-19

Family

ID=10854522

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020017015343A Expired - Fee Related KR100696436B1 (ko) 1999-06-02 2000-05-26 열팽창성 마이크로캡슐을 포함하는 접착성 조성물

Country Status (20)

Country Link
EP (1) EP1185594B2 (enExample)
JP (1) JP2003501544A (enExample)
KR (1) KR100696436B1 (enExample)
CN (1) CN1192070C (enExample)
AT (1) ATE292168T1 (enExample)
AU (1) AU4940200A (enExample)
BR (1) BR0011128B1 (enExample)
CZ (1) CZ20014260A3 (enExample)
DE (1) DE60019109T3 (enExample)
ES (1) ES2239007T5 (enExample)
GB (2) GB9912694D0 (enExample)
HK (1) HK1047446B (enExample)
HU (1) HUP0202982A2 (enExample)
MX (1) MXPA01012504A (enExample)
PL (1) PL352210A1 (enExample)
PT (1) PT1185594E (enExample)
RU (1) RU2265636C2 (enExample)
TR (1) TR200103487T2 (enExample)
WO (1) WO2000075254A1 (enExample)
ZA (1) ZA200109817B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10316219B2 (en) 2016-12-02 2019-06-11 Samsung Display Co., Ltd. Thermally releasable adhesive member and display apparatus including the same
US10745592B2 (en) 2017-06-13 2020-08-18 Samsung Display Co., Ltd. Thermally releasable adhesive member and display apparatus including the same

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7371300B2 (en) 1999-06-02 2008-05-13 De-Bonding Limited Adhesive composition comprising thermoexpandable microcapsules
US9511536B2 (en) * 2002-10-18 2016-12-06 The Boeing Company Method and apparatus to assist with removing an adhesive system
FR2852965B1 (fr) * 2003-03-25 2005-06-03 Rescoll Soc Procede de demontage des revetements et assemblages colles programme par utilisation de primaires d'adhesion modifies
GB0307504D0 (en) * 2003-04-01 2003-05-07 Debonding Ltd Method and apparatus for bonding and debonding adhesive interface surfaces
EP1608717B2 (en) 2003-04-01 2013-05-15 De-Bonding Limited Method and apparatus for bonding and debonding adhesive interface surfaces
FR2877349B1 (fr) * 2004-11-04 2007-04-27 Rescoll Sarl Soc Procede d'assemblage de deux substrats par collage, procede de demontage de cet assemblage colle par migration
EP2125323B1 (de) * 2007-02-28 2015-08-19 Basf Se Verfahren zur herstellung von verbundkörpern auf der basis von schaumstoffen auf isocyanatbasis
US8709141B2 (en) 2007-03-02 2014-04-29 Ppg Industries Ohio, Inc. Heat releasable composite coatings and related methods
DE202007019297U1 (de) 2007-10-19 2011-11-14 Nitto Denko Corp. Ein Klebeband
EP2291437B1 (de) * 2008-06-27 2019-08-14 Aufrecht GmbH Befestigungsmittel und verfahren zur fixierung eines gegenstands auf einer unterlage
GB0811941D0 (en) * 2008-07-01 2008-07-30 Bonding Ltd De Coated thermoexpandable microspheres
JP2012512025A (ja) 2008-12-17 2012-05-31 ダウ コーニング コーポレーション 温度制御放出用のシリケートシェルマイクロカプセルの懸濁液
DE102009019483A1 (de) 2009-05-04 2010-11-11 Eads Deutschland Gmbh Klebstoff-Zusammensetzung für lösbare Klebeverbindungen und Modifikation der Verkapselungsmaterialien für gezielte Energieeinbringung
DE102009019484B4 (de) * 2009-05-04 2015-12-17 Airbus Defence and Space GmbH Kombination der Effekte von Expansionsstoffen und chemischen Abbaureagenzien für lösbare Klebeverbindungen
WO2011069771A1 (en) 2009-12-09 2011-06-16 Evonik Degussa Gmbh Heat-expandable microcapsules comprising magnetic metal oxide particles
FR2954776B1 (fr) 2009-12-29 2013-03-08 Rescoll Assemblage de deux substrats colles par un polymere rigide, procedes de montage et de demontage par migration de cet assemblage colle
FR2954777B1 (fr) 2009-12-29 2013-03-08 Rescoll Assemblage de deux substrats colles par un polymere souple, procedes de montage et de demontage par migration de cet assemblage colle
DE102011087636A1 (de) 2011-12-02 2013-06-06 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Entfernen einer durch Verklebung in einen Rahmen eingesetzte Scheibe
DE102011087656B4 (de) * 2011-12-02 2022-09-22 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Entfernen einer durch Verklebung in einen Rahmen eingesetzten Scheibe
CN104119811A (zh) * 2013-04-26 2014-10-29 鸿富锦精密工业（深圳）有限公司 粘结结构及其采用的表面处理剂
EP2942334A1 (de) * 2014-05-06 2015-11-11 Siemens Aktiengesellschaft Schichtsystem für ein Bauteil
GB201416183D0 (en) * 2014-09-12 2014-10-29 Pilkington Group Ltd Wired glazing
WO2022069164A1 (en) 2020-09-30 2022-04-07 Basf Se De-bondable polyurethane adhesives based on thermally expandable microspheres
JPWO2022211030A1 (enExample) 2021-03-31 2022-10-06
DE102021210563A1 (de) 2021-09-22 2023-03-23 Tesa Se Primer zur Herstellung einer lösbaren Klebverbindung
CN114437636B (zh) * 2022-02-24 2023-06-16 韦尔通科技股份有限公司 一种单组份丙烯酸酯胶黏剂及其制备方法和基材的粘接方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995024441A1 (en) * 1994-03-07 1995-09-14 Ppg Industries Italia S.R.L. An adhesive composition for filling box parts of vehicle bodies

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL302030A (enExample) † 1962-12-21 1900-01-01
SE374759B (enExample) * 1969-03-24 1975-03-17 Litton Business Systems Inc
JPS5013878Y1 (enExample) * 1970-04-30 1975-04-28
JPS5661469A (en) * 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Hot-bonding adhesive
JPS5661468A (en) * 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Releasable adhesive
JPS60252681A (ja) * 1984-05-30 1985-12-13 F S K Kk 熱剥離性粘着シ−ト
JPH01503546A (ja) * 1987-06-12 1989-11-30 ヘンケル・テロゾン・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 密閉‐及び接着剤を少くとも部分的に硬化するための方法及び装置
JP3057236B2 (ja) * 1990-07-01 2000-06-26 株式会社アルファ技研 ２―シアノアクリレート系組成物
JPH04292684A (ja) * 1991-03-19 1992-10-16 Asahi Corp 膨脹シーリング材
ES2093236T3 (es) * 1991-07-03 1996-12-16 Gurit Essex Ag Uniones adhesivas separables, procedimiento para su fabricacion y la utilizacion de dispositivos para separar tales uniones adhesivas.
JP2970963B2 (ja) † 1991-08-14 1999-11-02 日東電工株式会社 剥離性感圧接着剤及びその粘着部材
JPH05269906A (ja) * 1992-03-26 1993-10-19 Toppan Printing Co Ltd 積層体およびその分離方法
JP3405576B2 (ja) * 1993-11-12 2003-05-12 ダイセル化学工業株式会社 熱剥離性フィルム及び剥離方法
ES2146284T3 (es) * 1994-12-15 2000-08-01 Saint Gobain Performance Plast Adhesivo esponjoso sensible a la presion.
JPH1072035A (ja) * 1996-08-27 1998-03-17 Shiseido Co Ltd 装着部材付き容器
JP3810911B2 (ja) * 1997-12-01 2006-08-16 日東電工株式会社 加熱剥離型粘着シート
DE19822044A1 (de) † 1998-05-16 2000-01-13 Daimler Chrysler Ag Klebeverbindung
JP4540150B2 (ja) * 1998-09-30 2010-09-08 日東電工株式会社 熱剥離型粘着シート
JP3594853B2 (ja) * 1999-11-08 2004-12-02 日東電工株式会社 加熱剥離型粘着シート
JP2001226650A (ja) * 2000-02-16 2001-08-21 Nitto Denko Corp 放射線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
JP2001323228A (ja) * 2000-05-15 2001-11-22 Nitto Denko Corp 加熱剥離型粘着シート

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995024441A1 (en) * 1994-03-07 1995-09-14 Ppg Industries Italia S.R.L. An adhesive composition for filling box parts of vehicle bodies

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10316219B2 (en) 2016-12-02 2019-06-11 Samsung Display Co., Ltd. Thermally releasable adhesive member and display apparatus including the same
US10745592B2 (en) 2017-06-13 2020-08-18 Samsung Display Co., Ltd. Thermally releasable adhesive member and display apparatus including the same
US11491762B2 (en) 2017-06-13 2022-11-08 Samsung Display Co., Ltd. Thermally releasable adhesive member and display apparatus including the same

Also Published As

Publication number Publication date
ATE292168T1 (de) 2005-04-15
TR200103487T2 (tr) 2002-04-22
ES2239007T5 (es) 2009-06-02
JP2003501544A (ja) 2003-01-14
GB2365431B (en) 2003-12-17
BR0011128B1 (pt) 2011-07-12
DE60019109D1 (de) 2005-05-04
AU4940200A (en) 2000-12-28
EP1185594A1 (en) 2002-03-13
GB9912694D0 (en) 1999-08-04
EP1185594B1 (en) 2005-03-30
PL352210A1 (en) 2003-08-11
CN1192070C (zh) 2005-03-09
RU2265636C2 (ru) 2005-12-10
GB0127411D0 (en) 2002-01-09
HUP0202982A2 (en) 2002-12-28
ES2239007T3 (es) 2005-09-16
BR0011128A (pt) 2002-02-26
KR20020034085A (ko) 2002-05-08
DE60019109T2 (de) 2006-02-02
HK1047446A1 (en) 2003-02-21
CZ20014260A3 (cs) 2002-04-17
GB2365431A (en) 2002-02-20
EP1185594B2 (en) 2009-02-25
DE60019109T3 (de) 2010-01-14
ZA200109817B (en) 2002-03-27
MXPA01012504A (es) 2003-10-14
PT1185594E (pt) 2005-07-29
WO2000075254A1 (en) 2000-12-14
HK1047446B (en) 2005-09-23
CN1354774A (zh) 2002-06-19

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