FR2954776B1 - Assemblage de deux substrats colles par un polymere rigide, procedes de montage et de demontage par migration de cet assemblage colle - Google Patents
Assemblage de deux substrats colles par un polymere rigide, procedes de montage et de demontage par migration de cet assemblage colleInfo
- Publication number
- FR2954776B1 FR2954776B1 FR0959641A FR0959641A FR2954776B1 FR 2954776 B1 FR2954776 B1 FR 2954776B1 FR 0959641 A FR0959641 A FR 0959641A FR 0959641 A FR0959641 A FR 0959641A FR 2954776 B1 FR2954776 B1 FR 2954776B1
- Authority
- FR
- France
- Prior art keywords
- assembly
- disassembling
- migration
- mounting
- methods
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
- C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/582—Recycling of unreacted starting or intermediate materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Sealing Material Composition (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0959641A FR2954776B1 (fr) | 2009-12-29 | 2009-12-29 | Assemblage de deux substrats colles par un polymere rigide, procedes de montage et de demontage par migration de cet assemblage colle |
US13/517,311 US20120258315A1 (en) | 2009-12-29 | 2010-12-24 | Assembly of two substrates bonded by a rigid polymer, and methods for assembly and dismantling by means of migration of said bonded assembly |
PCT/FR2010/052916 WO2011080477A1 (fr) | 2009-12-29 | 2010-12-24 | Assemblage de deux substrats colles par un polymere rigide, procedes de montage et de demontage par migration de cet assemblage colle |
EP10812873A EP2519565A1 (fr) | 2009-12-29 | 2010-12-24 | Assemblage de deux substrats colles par un polymere rigide, procedes de montage et de demontage par migration de cet assemblage colle |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0959641A FR2954776B1 (fr) | 2009-12-29 | 2009-12-29 | Assemblage de deux substrats colles par un polymere rigide, procedes de montage et de demontage par migration de cet assemblage colle |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2954776A1 FR2954776A1 (fr) | 2011-07-01 |
FR2954776B1 true FR2954776B1 (fr) | 2013-03-08 |
Family
ID=42246270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0959641A Expired - Fee Related FR2954776B1 (fr) | 2009-12-29 | 2009-12-29 | Assemblage de deux substrats colles par un polymere rigide, procedes de montage et de demontage par migration de cet assemblage colle |
Country Status (4)
Country | Link |
---|---|
US (1) | US20120258315A1 (fr) |
EP (1) | EP2519565A1 (fr) |
FR (1) | FR2954776B1 (fr) |
WO (1) | WO2011080477A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5995089B2 (ja) * | 2012-05-31 | 2016-09-21 | パナソニックIpマネジメント株式会社 | シリコンウェハ剥離方法、およびシリコンウェハ剥離装置 |
US9924897B1 (en) * | 2014-06-12 | 2018-03-27 | Masimo Corporation | Heated reprocessing of physiological sensors |
FR3055887B1 (fr) * | 2016-09-14 | 2019-06-21 | Airbus Safran Launchers Sas | Dispositif de liaison a separation commandee par effet thermique non pyrotechnique a temps de reaction reduit |
JP7296950B2 (ja) * | 2018-04-25 | 2023-06-23 | 日東電工株式会社 | ガラスフィルム-樹脂複合体 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9912694D0 (en) | 1999-06-02 | 1999-08-04 | Bain Peter S | Adhesive |
JP2003041208A (ja) * | 2001-07-30 | 2003-02-13 | Hitachi Chem Co Ltd | 接着シートならびに半導体装置およびその製造方法 |
AU2003288362A1 (en) * | 2003-09-19 | 2005-04-11 | Rescoll | Destructuring agent for an adhesive composition, and glue and primer forming said composition |
FR2877349B1 (fr) | 2004-11-04 | 2007-04-27 | Rescoll Sarl Soc | Procede d'assemblage de deux substrats par collage, procede de demontage de cet assemblage colle par migration |
FR2929951B1 (fr) * | 2008-04-15 | 2011-03-11 | Rescoll Soc | Composition stable destinee a l'assemblage demontable de substrats par collage. |
-
2009
- 2009-12-29 FR FR0959641A patent/FR2954776B1/fr not_active Expired - Fee Related
-
2010
- 2010-12-24 EP EP10812873A patent/EP2519565A1/fr not_active Withdrawn
- 2010-12-24 US US13/517,311 patent/US20120258315A1/en not_active Abandoned
- 2010-12-24 WO PCT/FR2010/052916 patent/WO2011080477A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
FR2954776A1 (fr) | 2011-07-01 |
EP2519565A1 (fr) | 2012-11-07 |
WO2011080477A1 (fr) | 2011-07-07 |
US20120258315A1 (en) | 2012-10-11 |
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Legal Events
Date | Code | Title | Description |
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PLFP | Fee payment |
Year of fee payment: 7 |
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PLFP | Fee payment |
Year of fee payment: 8 |
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PLFP | Fee payment |
Year of fee payment: 9 |
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PLFP | Fee payment |
Year of fee payment: 11 |
|
PLFP | Fee payment |
Year of fee payment: 12 |
|
PLFP | Fee payment |
Year of fee payment: 13 |
|
ST | Notification of lapse |
Effective date: 20230808 |