EP2212239A4 - Procédé d'assemblage d'un composant sur un substrat - Google Patents

Procédé d'assemblage d'un composant sur un substrat

Info

Publication number
EP2212239A4
EP2212239A4 EP08844674.5A EP08844674A EP2212239A4 EP 2212239 A4 EP2212239 A4 EP 2212239A4 EP 08844674 A EP08844674 A EP 08844674A EP 2212239 A4 EP2212239 A4 EP 2212239A4
Authority
EP
European Patent Office
Prior art keywords
substrate
component assembly
assembly
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08844674.5A
Other languages
German (de)
English (en)
Other versions
EP2212239A1 (fr
Inventor
Till Böcking
John Justin Gooding
Kristopher A Kilian
Michael Gal
Katharina Gaus
Peter John Reece
Qiao Hong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamiras Per Pte Ltd LLC
Original Assignee
Mogul Solutions LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/933,541 external-priority patent/US20090117339A1/en
Priority claimed from AU2008902248A external-priority patent/AU2008902248A0/en
Application filed by Mogul Solutions LLC filed Critical Mogul Solutions LLC
Publication of EP2212239A1 publication Critical patent/EP2212239A1/fr
Publication of EP2212239A4 publication Critical patent/EP2212239A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/41Refractivity; Phase-affecting properties, e.g. optical path length
    • G01N21/45Refractivity; Phase-affecting properties, e.g. optical path length using interferometric methods; using Schlieren methods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00007Assembling automatically hinged components, i.e. self-assembly processes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/75Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/41Refractivity; Phase-affecting properties, e.g. optical path length
    • G01N21/45Refractivity; Phase-affecting properties, e.g. optical path length using interferometric methods; using Schlieren methods
    • G01N2021/458Refractivity; Phase-affecting properties, e.g. optical path length using interferometric methods; using Schlieren methods using interferential sensor, e.g. sensor fibre, possibly on optical waveguide
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64Fluorescence; Phosphorescence
    • G01N21/6428Measuring fluorescence of fluorescent products of reactions or of fluorochrome labelled reactive substances, e.g. measuring quenching effects, using measuring "optrodes"
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/08Mirrors
    • G02B5/0816Multilayer mirrors, i.e. having two or more reflecting layers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • G02B5/28Interference filters
    • G02B5/285Interference filters comprising deposited thin solid films
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
EP08844674.5A 2007-11-01 2008-10-31 Procédé d'assemblage d'un composant sur un substrat Withdrawn EP2212239A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/933,541 US20090117339A1 (en) 2007-11-01 2007-11-01 Method of component assembly on a substrate
AU2008902248A AU2008902248A0 (en) 2008-05-08 A sensor structure and a method of fabricating the same
PCT/AU2008/001616 WO2009055862A1 (fr) 2007-11-01 2008-10-31 Procédé d'assemblage d'un composant sur un substrat

Publications (2)

Publication Number Publication Date
EP2212239A1 EP2212239A1 (fr) 2010-08-04
EP2212239A4 true EP2212239A4 (fr) 2014-09-17

Family

ID=40590454

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08844674.5A Withdrawn EP2212239A4 (fr) 2007-11-01 2008-10-31 Procédé d'assemblage d'un composant sur un substrat

Country Status (4)

Country Link
EP (1) EP2212239A4 (fr)
CN (1) CN101903285B (fr)
AU (1) AU2008318286A1 (fr)
WO (1) WO2009055862A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011016567B4 (de) * 2011-04-08 2023-05-11 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines optoelektronischen Bauelements und derart hergestelltes Bauelement
CN102313717B (zh) * 2011-08-02 2013-08-28 上海交通大学 多孔硅微腔生物传感器及其制备方法
CN102914503A (zh) * 2012-09-26 2013-02-06 华侨大学 光谱分析仪及其g-t谐振腔阵列的制作方法
GB202014318D0 (en) * 2020-09-11 2020-10-28 Poro Tech Ltd LED Device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10105872A1 (de) * 2001-02-09 2002-09-05 Infineon Technologies Ag Anordnung mit einem Trägersubstrat mit mindestens einem Chip, Matrixdisplay und Verfahren zum Herstellen einer Anordnung mit einem Trägersubstrat mit mindestens einem Chip
US20060216740A1 (en) * 1993-11-01 2006-09-28 Edman Carl F Methods for the electronic, homogeneous assembly and fabrication of devices

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6652808B1 (en) * 1991-11-07 2003-11-25 Nanotronics, Inc. Methods for the electronic assembly and fabrication of devices
GB2366666B (en) * 2000-09-11 2002-12-04 Toshiba Res Europ Ltd An optical device and method for its manufacture
US6974604B2 (en) * 2001-09-28 2005-12-13 Hrl Laboratories, Llc Method of self-latching for adhesion during self-assembly of electronic or optical components

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060216740A1 (en) * 1993-11-01 2006-09-28 Edman Carl F Methods for the electronic, homogeneous assembly and fabrication of devices
DE10105872A1 (de) * 2001-02-09 2002-09-05 Infineon Technologies Ag Anordnung mit einem Trägersubstrat mit mindestens einem Chip, Matrixdisplay und Verfahren zum Herstellen einer Anordnung mit einem Trägersubstrat mit mindestens einem Chip

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
LUIGI MARTIRADONNA ET AL: "Tailoring the emission spectrum of colloidal nanocrystals by means of lithographically-imprinted hybrid vertical microcavities", PROCEEDINGS OF SPIE, vol. 5840, 7 July 2005 (2005-07-07), pages 168 - 176, XP055134312, ISSN: 0277-786X, DOI: 10.1117/12.608375 *
See also references of WO2009055862A1 *

Also Published As

Publication number Publication date
WO2009055862A1 (fr) 2009-05-07
WO2009055862A8 (fr) 2009-08-20
AU2008318286A1 (en) 2009-05-07
CN101903285A (zh) 2010-12-01
EP2212239A1 (fr) 2010-08-04
CN101903285B (zh) 2012-07-18

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RIN1 Information on inventor provided before grant (corrected)

Inventor name: HONG, QIAO

Inventor name: REECE, PETER, JOHN

Inventor name: GAUS, KATHARINA

Inventor name: GAL, MICHAEL

Inventor name: KILIAN, KRISTOPHER, A C/ONEWSOUTH INNOVA. PTY LTD.

Inventor name: GOODING, JOHN, JUSTIN

Inventor name: BOECKING, TILL

DAX Request for extension of the european patent (deleted)
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Owner name: MOGUL SOLUTIONS LLC

A4 Supplementary search report drawn up and despatched

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RIC1 Information provided on ipc code assigned before grant

Ipc: G01N 21/45 20060101ALI20140814BHEP

Ipc: H01L 21/98 20060101ALI20140814BHEP

Ipc: B81C 1/00 20060101AFI20140814BHEP

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