EP2212239A4 - Procédé d'assemblage d'un composant sur un substrat - Google Patents
Procédé d'assemblage d'un composant sur un substratInfo
- Publication number
- EP2212239A4 EP2212239A4 EP08844674.5A EP08844674A EP2212239A4 EP 2212239 A4 EP2212239 A4 EP 2212239A4 EP 08844674 A EP08844674 A EP 08844674A EP 2212239 A4 EP2212239 A4 EP 2212239A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate
- component assembly
- assembly
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/41—Refractivity; Phase-affecting properties, e.g. optical path length
- G01N21/45—Refractivity; Phase-affecting properties, e.g. optical path length using interferometric methods; using Schlieren methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00007—Assembling automatically hinged components, i.e. self-assembly processes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/75—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/41—Refractivity; Phase-affecting properties, e.g. optical path length
- G01N21/45—Refractivity; Phase-affecting properties, e.g. optical path length using interferometric methods; using Schlieren methods
- G01N2021/458—Refractivity; Phase-affecting properties, e.g. optical path length using interferometric methods; using Schlieren methods using interferential sensor, e.g. sensor fibre, possibly on optical waveguide
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
- G01N21/6428—Measuring fluorescence of fluorescent products of reactions or of fluorochrome labelled reactive substances, e.g. measuring quenching effects, using measuring "optrodes"
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/0816—Multilayer mirrors, i.e. having two or more reflecting layers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/28—Interference filters
- G02B5/285—Interference filters comprising deposited thin solid films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Immunology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/933,541 US20090117339A1 (en) | 2007-11-01 | 2007-11-01 | Method of component assembly on a substrate |
AU2008902248A AU2008902248A0 (en) | 2008-05-08 | A sensor structure and a method of fabricating the same | |
PCT/AU2008/001616 WO2009055862A1 (fr) | 2007-11-01 | 2008-10-31 | Procédé d'assemblage d'un composant sur un substrat |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2212239A1 EP2212239A1 (fr) | 2010-08-04 |
EP2212239A4 true EP2212239A4 (fr) | 2014-09-17 |
Family
ID=40590454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08844674.5A Withdrawn EP2212239A4 (fr) | 2007-11-01 | 2008-10-31 | Procédé d'assemblage d'un composant sur un substrat |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2212239A4 (fr) |
CN (1) | CN101903285B (fr) |
AU (1) | AU2008318286A1 (fr) |
WO (1) | WO2009055862A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011016567B4 (de) * | 2011-04-08 | 2023-05-11 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen eines optoelektronischen Bauelements und derart hergestelltes Bauelement |
CN102313717B (zh) * | 2011-08-02 | 2013-08-28 | 上海交通大学 | 多孔硅微腔生物传感器及其制备方法 |
CN102914503A (zh) * | 2012-09-26 | 2013-02-06 | 华侨大学 | 光谱分析仪及其g-t谐振腔阵列的制作方法 |
GB202014318D0 (en) * | 2020-09-11 | 2020-10-28 | Poro Tech Ltd | LED Device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10105872A1 (de) * | 2001-02-09 | 2002-09-05 | Infineon Technologies Ag | Anordnung mit einem Trägersubstrat mit mindestens einem Chip, Matrixdisplay und Verfahren zum Herstellen einer Anordnung mit einem Trägersubstrat mit mindestens einem Chip |
US20060216740A1 (en) * | 1993-11-01 | 2006-09-28 | Edman Carl F | Methods for the electronic, homogeneous assembly and fabrication of devices |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6652808B1 (en) * | 1991-11-07 | 2003-11-25 | Nanotronics, Inc. | Methods for the electronic assembly and fabrication of devices |
GB2366666B (en) * | 2000-09-11 | 2002-12-04 | Toshiba Res Europ Ltd | An optical device and method for its manufacture |
US6974604B2 (en) * | 2001-09-28 | 2005-12-13 | Hrl Laboratories, Llc | Method of self-latching for adhesion during self-assembly of electronic or optical components |
-
2008
- 2008-10-31 EP EP08844674.5A patent/EP2212239A4/fr not_active Withdrawn
- 2008-10-31 WO PCT/AU2008/001616 patent/WO2009055862A1/fr active Application Filing
- 2008-10-31 AU AU2008318286A patent/AU2008318286A1/en not_active Abandoned
- 2008-10-31 CN CN200880119793.1A patent/CN101903285B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060216740A1 (en) * | 1993-11-01 | 2006-09-28 | Edman Carl F | Methods for the electronic, homogeneous assembly and fabrication of devices |
DE10105872A1 (de) * | 2001-02-09 | 2002-09-05 | Infineon Technologies Ag | Anordnung mit einem Trägersubstrat mit mindestens einem Chip, Matrixdisplay und Verfahren zum Herstellen einer Anordnung mit einem Trägersubstrat mit mindestens einem Chip |
Non-Patent Citations (2)
Title |
---|
LUIGI MARTIRADONNA ET AL: "Tailoring the emission spectrum of colloidal nanocrystals by means of lithographically-imprinted hybrid vertical microcavities", PROCEEDINGS OF SPIE, vol. 5840, 7 July 2005 (2005-07-07), pages 168 - 176, XP055134312, ISSN: 0277-786X, DOI: 10.1117/12.608375 * |
See also references of WO2009055862A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2009055862A1 (fr) | 2009-05-07 |
WO2009055862A8 (fr) | 2009-08-20 |
AU2008318286A1 (en) | 2009-05-07 |
CN101903285A (zh) | 2010-12-01 |
EP2212239A1 (fr) | 2010-08-04 |
CN101903285B (zh) | 2012-07-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20100526 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA MK RS |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: HONG, QIAO Inventor name: REECE, PETER, JOHN Inventor name: GAUS, KATHARINA Inventor name: GAL, MICHAEL Inventor name: KILIAN, KRISTOPHER, A C/ONEWSOUTH INNOVA. PTY LTD. Inventor name: GOODING, JOHN, JUSTIN Inventor name: BOECKING, TILL |
|
DAX | Request for extension of the european patent (deleted) | ||
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: MOGUL SOLUTIONS LLC |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20140821 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: G01N 21/45 20060101ALI20140814BHEP Ipc: H01L 21/98 20060101ALI20140814BHEP Ipc: B81C 1/00 20060101AFI20140814BHEP Ipc: G01N 21/75 20060101ALI20140814BHEP Ipc: H01L 25/00 20060101ALI20140814BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20150320 |