SG98407A1 - Method of detaching article fixed through pressure sensitive adhesive double coated sheet and detachment apparatus - Google Patents

Method of detaching article fixed through pressure sensitive adhesive double coated sheet and detachment apparatus

Info

Publication number
SG98407A1
SG98407A1 SG200003403A SG200003403A SG98407A1 SG 98407 A1 SG98407 A1 SG 98407A1 SG 200003403 A SG200003403 A SG 200003403A SG 200003403 A SG200003403 A SG 200003403A SG 98407 A1 SG98407 A1 SG 98407A1
Authority
SG
Singapore
Prior art keywords
detaching
sensitive adhesive
pressure sensitive
coated sheet
double coated
Prior art date
Application number
SG200003403A
Other languages
English (en)
Inventor
Kurokawa Shuji
Kobayashi Kenji
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG98407A1 publication Critical patent/SG98407A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
    • Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Laminated Bodies (AREA)
SG200003403A 1999-06-17 2000-06-16 Method of detaching article fixed through pressure sensitive adhesive double coated sheet and detachment apparatus SG98407A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17092599A JP4275254B2 (ja) 1999-06-17 1999-06-17 両面粘着シートに固定された物品の剥離方法および剥離装置

Publications (1)

Publication Number Publication Date
SG98407A1 true SG98407A1 (en) 2003-09-19

Family

ID=15913912

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200003403A SG98407A1 (en) 1999-06-17 2000-06-16 Method of detaching article fixed through pressure sensitive adhesive double coated sheet and detachment apparatus

Country Status (7)

Country Link
US (1) US6627037B1 (de)
EP (1) EP1061559B1 (de)
JP (1) JP4275254B2 (de)
KR (1) KR100681838B1 (de)
DE (1) DE60038265T2 (de)
MY (1) MY124017A (de)
SG (1) SG98407A1 (de)

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JP3641217B2 (ja) * 2000-03-31 2005-04-20 Ｔｄｋ株式会社 チップ状電子部品における端部電極形成方法及び装置
JP3892703B2 (ja) 2001-10-19 2007-03-14 富士通株式会社 半導体基板用治具及びこれを用いた半導体装置の製造方法
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JP4565804B2 (ja) * 2002-06-03 2010-10-20 スリーエム イノベイティブ プロパティズ カンパニー 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置
US7534498B2 (en) * 2002-06-03 2009-05-19 3M Innovative Properties Company Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
JP2005005672A (ja) * 2003-05-16 2005-01-06 Fuji Electric Device Technology Co Ltd 半導体素子の製造方法および発泡剥離装置
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JP4130167B2 (ja) * 2003-10-06 2008-08-06 日東電工株式会社 半導体ウエハの剥離方法
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JP4353975B2 (ja) 2006-11-29 2009-10-28 日東電工株式会社 粘着シートの貼付・剥離方法及び粘着シートの貼付装置並びに粘着シートの剥離装置
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JP5087372B2 (ja) * 2007-11-19 2012-12-05 日東電工株式会社 樹脂積層体、粘着シート、該粘着シートを用いた被着体の加工方法、及びその剥離装置
JP2009275060A (ja) * 2008-05-12 2009-11-26 Nitto Denko Corp 粘着シート、その粘着シートを使用した被着体の加工方法、及び粘着シート剥離装置
US7805832B2 (en) * 2008-08-19 2010-10-05 Silverbrook Research Pty Ltd Transfer apparatus for transferring a component of integrated circuitry
US7979979B2 (en) 2008-08-19 2011-07-19 Silverbrook Research Pty Ltd Clamp assembly for an assembler of integrated circuitry on a carrier
US20100043214A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Integrated circuit dice pick and lift head
US8092625B2 (en) * 2008-08-19 2012-01-10 Silverbrook Research Pty Ltd Integrated circuit placement system
US7877876B2 (en) * 2008-08-19 2011-02-01 Silverbrook Research Pty Ltd Method of attaching integrated circuits to a carrier
US20100047962A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Multi-chip printhead assembler
US8296937B2 (en) * 2008-08-19 2012-10-30 Silverbrook Research Pty Ltd Wafer positioning system
US20100047053A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Die picker for picking printhead die from a wafer
US8701276B2 (en) * 2008-08-19 2014-04-22 Zamtec Ltd Placement head for a die placing assembly
JP2010062269A (ja) * 2008-09-02 2010-03-18 Three M Innovative Properties Co ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法
US9991311B2 (en) 2008-12-02 2018-06-05 Arizona Board Of Regents On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
SG171917A1 (en) 2008-12-02 2011-07-28 Univ Arizona Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom
US9601530B2 (en) 2008-12-02 2017-03-21 Arizona Board Of Regents, A Body Corporated Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
US9721825B2 (en) 2008-12-02 2017-08-01 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
CN102460646A (zh) 2009-05-29 2012-05-16 代表亚利桑那大学的亚利桑那校董会 在高温提供柔性半导体器件的方法及其柔性半导体器件
JP5412214B2 (ja) * 2009-08-31 2014-02-12 日東電工株式会社 保護テープ剥離方法およびその装置
KR100988520B1 (ko) * 2010-05-06 2010-10-20 주식회사 세미라인 확장장치 및 이를 구비한 칩 분류장치
WO2012021196A2 (en) 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method for manufacturing electronic devices and electronic devices thereof
WO2012021197A2 (en) 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method of manufacturing electronic devices on both sides of a carrier substrate and electronic devices thereof
FR2968832A1 (fr) * 2010-12-08 2012-06-15 St Microelectronics Grenoble 2 Procédé de fabrication de dispositifs semi-conducteurs et dispositifs semi-conducteurs
KR101303930B1 (ko) * 2011-01-18 2013-09-05 그래핀스퀘어 주식회사 핫프레스를 이용한 그래핀의 전사 방법
EP3659491A1 (de) 2011-12-13 2020-06-03 EndoChoice Innovation Center Ltd. Endoskop mit entfernbarer spitze
JP2014185762A (ja) * 2013-03-25 2014-10-02 Taiho Kogyo Co Ltd バランスウェイト供給装置
US9574063B2 (en) * 2013-09-17 2017-02-21 Lockheed Martin Corporation Method of making a large area graphene composite material
WO2015156891A2 (en) 2014-01-23 2015-10-15 Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
WO2017034645A2 (en) 2015-06-09 2017-03-02 ARIZONA BOARD OF REGENTS, a body corporate for THE STATE OF ARIZONA for and on behalf of ARIZONA STATE UNIVERSITY Method of providing an electronic device and electronic device thereof
WO2015175353A1 (en) 2014-05-13 2015-11-19 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method of providing an electronic device and electronic device thereof
US10381224B2 (en) 2014-01-23 2019-08-13 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an electronic device and electronic device thereof
US10446582B2 (en) 2014-12-22 2019-10-15 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an imaging system and imaging system thereof
US9741742B2 (en) 2014-12-22 2017-08-22 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Deformable electronic device and methods of providing and using deformable electronic device

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JPH1060391A (ja) * 1996-08-19 1998-03-03 Hitachi Chem Co Ltd 半導体ウェハ保護用粘着フィルム及びこれを用いた表面保護方法

Also Published As

Publication number Publication date
JP2001007179A (ja) 2001-01-12
MY124017A (en) 2006-06-30
DE60038265T2 (de) 2009-03-26
DE60038265D1 (de) 2008-04-24
EP1061559A3 (de) 2003-01-22
EP1061559A2 (de) 2000-12-20
KR20010049554A (ko) 2001-06-15
JP4275254B2 (ja) 2009-06-10
EP1061559B1 (de) 2008-03-12
KR100681838B1 (ko) 2007-02-12
US6627037B1 (en) 2003-09-30

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