DE60038265D1 - Abtrennungsverfahren von einem Geganstand und Abtrennungsvorrichtung - Google Patents

Abtrennungsverfahren von einem Geganstand und Abtrennungsvorrichtung

Info

Publication number
DE60038265D1
DE60038265D1 DE60038265T DE60038265T DE60038265D1 DE 60038265 D1 DE60038265 D1 DE 60038265D1 DE 60038265 T DE60038265 T DE 60038265T DE 60038265 T DE60038265 T DE 60038265T DE 60038265 D1 DE60038265 D1 DE 60038265D1
Authority
DE
Germany
Prior art keywords
separation
gate
separation device
separation process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60038265T
Other languages
English (en)
Other versions
DE60038265T2 (de
Inventor
Shuji Kurokawa
Kenji Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Application granted granted Critical
Publication of DE60038265D1 publication Critical patent/DE60038265D1/de
Publication of DE60038265T2 publication Critical patent/DE60038265T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
    • Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Laminated Bodies (AREA)
DE60038265T 1999-06-17 2000-06-15 Abtrennungsverfahren von einem Geganstand und Abtrennungsvorrichtung Expired - Fee Related DE60038265T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP17092599A JP4275254B2 (ja) 1999-06-17 1999-06-17 両面粘着シートに固定された物品の剥離方法および剥離装置
JP17092599 1999-06-17

Publications (2)

Publication Number Publication Date
DE60038265D1 true DE60038265D1 (de) 2008-04-24
DE60038265T2 DE60038265T2 (de) 2009-03-26

Family

ID=15913912

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60038265T Expired - Fee Related DE60038265T2 (de) 1999-06-17 2000-06-15 Abtrennungsverfahren von einem Geganstand und Abtrennungsvorrichtung

Country Status (7)

Country Link
US (1) US6627037B1 (de)
EP (1) EP1061559B1 (de)
JP (1) JP4275254B2 (de)
KR (1) KR100681838B1 (de)
DE (1) DE60038265T2 (de)
MY (1) MY124017A (de)
SG (1) SG98407A1 (de)

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JP4137310B2 (ja) 1999-09-06 2008-08-20 リンテック株式会社 両面粘着シートに固定された物品の剥離方法および剥離装置
JP3641217B2 (ja) * 2000-03-31 2005-04-20 Ｔｄｋ株式会社 チップ状電子部品における端部電極形成方法及び装置
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JP2003218063A (ja) * 2002-01-24 2003-07-31 Canon Inc ウエハ貼着用粘着シート及び該シートを利用する加工方法
US6749713B2 (en) * 2002-04-03 2004-06-15 3M Innovative Properties Company Apparatus and method for separating a fuel cell assembly from a bonding fixture
US7534498B2 (en) * 2002-06-03 2009-05-19 3M Innovative Properties Company Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
JP4565804B2 (ja) * 2002-06-03 2010-10-20 スリーエム イノベイティブ プロパティズ カンパニー 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置
JP2005005672A (ja) * 2003-05-16 2005-01-06 Fuji Electric Device Technology Co Ltd 半導体素子の製造方法および発泡剥離装置
JP4592270B2 (ja) 2003-10-06 2010-12-01 日東電工株式会社 半導体ウエハの支持材からの剥離方法およびこれを用いた装置
JP4130167B2 (ja) 2003-10-06 2008-08-06 日東電工株式会社 半導体ウエハの剥離方法
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US7241084B2 (en) * 2004-06-30 2007-07-10 Omega Tools, Inc. Tool assembly with universal coupling for various tools, for work on underground pipes
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US20080200011A1 (en) * 2006-10-06 2008-08-21 Pillalamarri Sunil K High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach
JP4353975B2 (ja) 2006-11-29 2009-10-28 日東電工株式会社 粘着シートの貼付・剥離方法及び粘着シートの貼付装置並びに粘着シートの剥離装置
US8043460B2 (en) * 2007-04-20 2011-10-25 GM Global Technology Operations LLC Reversible dry adhesives
KR100891384B1 (ko) * 2007-06-14 2009-04-02 삼성모바일디스플레이주식회사 플렉서블 기판 접합 및 탈착장치
JP5087372B2 (ja) * 2007-11-19 2012-12-05 日東電工株式会社 樹脂積層体、粘着シート、該粘着シートを用いた被着体の加工方法、及びその剥離装置
JP2009275060A (ja) * 2008-05-12 2009-11-26 Nitto Denko Corp 粘着シート、その粘着シートを使用した被着体の加工方法、及び粘着シート剥離装置
US8701276B2 (en) * 2008-08-19 2014-04-22 Zamtec Ltd Placement head for a die placing assembly
US8296937B2 (en) * 2008-08-19 2012-10-30 Silverbrook Research Pty Ltd Wafer positioning system
US20100047053A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Die picker for picking printhead die from a wafer
US20100043214A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Integrated circuit dice pick and lift head
US8092625B2 (en) * 2008-08-19 2012-01-10 Silverbrook Research Pty Ltd Integrated circuit placement system
US20100047962A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Multi-chip printhead assembler
US7979979B2 (en) 2008-08-19 2011-07-19 Silverbrook Research Pty Ltd Clamp assembly for an assembler of integrated circuitry on a carrier
US7805832B2 (en) * 2008-08-19 2010-10-05 Silverbrook Research Pty Ltd Transfer apparatus for transferring a component of integrated circuitry
US7877876B2 (en) * 2008-08-19 2011-02-01 Silverbrook Research Pty Ltd Method of attaching integrated circuits to a carrier
JP2010062269A (ja) * 2008-09-02 2010-03-18 Three M Innovative Properties Co ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法
US9991311B2 (en) 2008-12-02 2018-06-05 Arizona Board Of Regents On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
US9601530B2 (en) 2008-12-02 2017-03-21 Arizona Board Of Regents, A Body Corporated Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
US9721825B2 (en) 2008-12-02 2017-08-01 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
CN103596370A (zh) 2008-12-02 2014-02-19 代表亚利桑那大学的亚利桑那校董会 准备柔性基板组件的方法和从其得到的柔性基板组件
SG176601A1 (en) 2009-05-29 2012-01-30 Univ Arizona Method of providing a flexible semiconductor device at high temperatures and flexible semiconductor device thereof
JP5412214B2 (ja) * 2009-08-31 2014-02-12 日東電工株式会社 保護テープ剥離方法およびその装置
KR100988520B1 (ko) * 2010-05-06 2010-10-20 주식회사 세미라인 확장장치 및 이를 구비한 칩 분류장치
WO2012021197A2 (en) 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method of manufacturing electronic devices on both sides of a carrier substrate and electronic devices thereof
WO2012021196A2 (en) 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method for manufacturing electronic devices and electronic devices thereof
FR2968832A1 (fr) * 2010-12-08 2012-06-15 St Microelectronics Grenoble 2 Procédé de fabrication de dispositifs semi-conducteurs et dispositifs semi-conducteurs
KR101303930B1 (ko) * 2011-01-18 2013-09-05 그래핀스퀘어 주식회사 핫프레스를 이용한 그래핀의 전사 방법
EP2604175B1 (de) 2011-12-13 2019-11-20 EndoChoice Innovation Center Ltd. Endoskop mit entfernbarer Spitze
JP2014185762A (ja) * 2013-03-25 2014-10-02 Taiho Kogyo Co Ltd バランスウェイト供給装置
US9574063B2 (en) * 2013-09-17 2017-02-21 Lockheed Martin Corporation Method of making a large area graphene composite material
US10381224B2 (en) 2014-01-23 2019-08-13 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an electronic device and electronic device thereof
WO2017034645A2 (en) 2015-06-09 2017-03-02 ARIZONA BOARD OF REGENTS, a body corporate for THE STATE OF ARIZONA for and on behalf of ARIZONA STATE UNIVERSITY Method of providing an electronic device and electronic device thereof
WO2015156891A2 (en) 2014-01-23 2015-10-15 Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
WO2015175353A1 (en) 2014-05-13 2015-11-19 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method of providing an electronic device and electronic device thereof
US9741742B2 (en) 2014-12-22 2017-08-22 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Deformable electronic device and methods of providing and using deformable electronic device
US10446582B2 (en) 2014-12-22 2019-10-15 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an imaging system and imaging system thereof

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Also Published As

Publication number Publication date
US6627037B1 (en) 2003-09-30
EP1061559A3 (de) 2003-01-22
JP2001007179A (ja) 2001-01-12
DE60038265T2 (de) 2009-03-26
JP4275254B2 (ja) 2009-06-10
KR100681838B1 (ko) 2007-02-12
SG98407A1 (en) 2003-09-19
EP1061559B1 (de) 2008-03-12
EP1061559A2 (de) 2000-12-20
MY124017A (en) 2006-06-30
KR20010049554A (ko) 2001-06-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee