SG97310A1 - Photosemiconductor encapsulating resin composition - Google Patents

Photosemiconductor encapsulating resin composition

Info

Publication number
SG97310A1
SG97310A1 SG200302845A SG200302845A SG97310A1 SG 97310 A1 SG97310 A1 SG 97310A1 SG 200302845 A SG200302845 A SG 200302845A SG 200302845 A SG200302845 A SG 200302845A SG 97310 A1 SG97310 A1 SG 97310A1
Authority
SG
Singapore
Prior art keywords
group
polyvalent carboxylic
resin composition
encapsulating resin
alkylene group
Prior art date
Application number
SG200302845A
Other languages
English (en)
Inventor
Toshiyuki Hasegawa
Yujiro Kawaguchi
Shigeki Naitoh
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of SG97310A1 publication Critical patent/SG97310A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60—Organic compounds having low molecular weight
    • H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
    • H10K85/621—Aromatic anhydride or imide compounds, e.g. perylene tetra-carboxylic dianhydride or perylene tetracarboxylic di-imide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG200302845A 2001-09-14 2002-09-12 Photosemiconductor encapsulating resin composition SG97310A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001279518 2001-09-14

Publications (1)

Publication Number Publication Date
SG97310A1 true SG97310A1 (en) 2006-09-29

Family

ID=19103695

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200302845A SG97310A1 (en) 2001-09-14 2002-09-12 Photosemiconductor encapsulating resin composition

Country Status (9)

Country Link
US (2) US7423083B2 (ja)
EP (1) EP1426394A4 (ja)
JP (1) JP2009041028A (ja)
KR (2) KR100946607B1 (ja)
CN (1) CN1247651C (ja)
CA (1) CA2442314A1 (ja)
SG (1) SG97310A1 (ja)
TW (1) TWI300073B (ja)
WO (1) WO2003025043A1 (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003025043A1 (en) * 2001-09-14 2003-03-27 Sumitomo Chemical Company, Limited Resin composition for optical-semiconductor encapsulation
US20060235717A1 (en) * 2005-04-18 2006-10-19 Solaria Corporation Method and system for manufacturing solar panels using an integrated solar cell using a plurality of photovoltaic regions
US20070095386A1 (en) * 2005-06-06 2007-05-03 Solaria Corporation Method and system for integrated solar cell using a plurality of photovoltaic regions
US20080178922A1 (en) * 2005-07-26 2008-07-31 Solaria Corporation Method and system for manufacturing solar panels using an integrated solar cell using a plurality of photovoltaic regions
US7910822B1 (en) 2005-10-17 2011-03-22 Solaria Corporation Fabrication process for photovoltaic cell
US8227688B1 (en) 2005-10-17 2012-07-24 Solaria Corporation Method and resulting structure for assembling photovoltaic regions onto lead frame members for integration on concentrating elements for solar cells
US20090056806A1 (en) * 2007-09-05 2009-03-05 Solaria Corporation Solar cell structure including a plurality of concentrator elements with a notch design and predetermined radii and method
US7910392B2 (en) 2007-04-02 2011-03-22 Solaria Corporation Method and system for assembling a solar cell package
US8119902B2 (en) 2007-05-21 2012-02-21 Solaria Corporation Concentrating module and method of manufacture for photovoltaic strips
US7910035B2 (en) 2007-12-12 2011-03-22 Solaria Corporation Method and system for manufacturing integrated molded concentrator photovoltaic device
KR101895831B1 (ko) * 2008-01-09 2018-09-07 히타치가세이가부시끼가이샤 열경화성 수지 조성물, 에폭시 수지 성형 재료 및 다가 카르복시산 축합체
US8637593B2 (en) 2008-01-09 2014-01-28 Hitachi Chemical Company, Ltd. Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
TWI370525B (en) * 2008-04-25 2012-08-11 Ind Tech Res Inst Encapsulant composition and method for fabricating encapsulant material
USD699176S1 (en) 2011-06-02 2014-02-11 Solaria Corporation Fastener for solar modules
JP6125349B2 (ja) * 2013-06-25 2017-05-10 日本カーバイド工業株式会社 熱硬化性組成物
JP6039080B2 (ja) * 2014-05-30 2016-12-07 積水化学工業株式会社 狭額縁設計表示素子用接着剤
WO2018003690A1 (ja) * 2016-06-28 2018-01-04 東レ株式会社 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06281801A (ja) * 1992-01-14 1994-10-07 Sanyo Chem Ind Ltd 熱硬化性組成物およびカラーフィルターの表面保護剤
GB2294044A (en) * 1994-10-11 1996-04-17 Daicel Chem Alkenyl and epoxy (meth)acrylates and polymers thereof
JPH09100274A (ja) * 1995-10-04 1997-04-15 Daicel Chem Ind Ltd エポキシ環およびアルケニル基を有する（メタ）アクリレートとその製造方法
JP2000159860A (ja) * 1998-11-27 2000-06-13 Hitachi Chem Co Ltd 耐熱性樹脂組成物

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL204817A (ja) * 1955-02-24
US3781379A (en) * 1971-08-16 1973-12-25 Ford Motor Co Powdered coating compositions containing glycidyl methacrylate copolymers with anhydride crosslinking agents and flow control agent
JPS60217230A (ja) * 1984-04-11 1985-10-30 Japan Synthetic Rubber Co Ltd 熱硬化性組成物
JPS61206943A (ja) * 1985-03-09 1986-09-13 Matsushita Electric Works Ltd 光学式デイスク基板の製法
JPS61235424A (ja) * 1985-04-10 1986-10-20 Nippon Zeon Co Ltd エポキシ基含有エラストマ−加硫性組成物
JPS61252225A (ja) * 1985-04-30 1986-11-10 Japan Synthetic Rubber Co Ltd 熱硬化性重合体組成物
JPS62128161A (ja) * 1985-11-28 1987-06-10 Nitto Electric Ind Co Ltd 光半導体装置
JPH0623238B2 (ja) * 1986-04-08 1994-03-30 日本ゼオン株式会社 アクリレ−ト系エラストマ−加硫性組成物
DE4027742A1 (de) * 1990-09-01 1992-03-05 Bayer Ag Bindemittelkombinationen und ihre verwendung in beschichtungsmitteln und dichtmassen
JPH04356522A (ja) * 1991-03-06 1992-12-10 Dainippon Ink & Chem Inc 硬化性樹脂組成物
JPH05297590A (ja) * 1992-04-16 1993-11-12 Sumitomo Chem Co Ltd 硬化性樹脂組成物
WO1993024569A1 (en) * 1992-06-01 1993-12-09 Allied-Signal Inc. Crosslinkable fluoropolymer compositions
DE4222194A1 (de) * 1992-07-07 1994-01-13 Basf Lacke & Farben Verfahren zur Herstellung einer zweischichtigen Lackierung und für dieses Verfahren geeignete Pulverlacke
JPH06316626A (ja) 1993-05-06 1994-11-15 Nippon Kayaku Co Ltd 透明性エポキシ樹脂組成物及びその硬化物
JPH07196774A (ja) * 1993-12-28 1995-08-01 Sumitomo Bakelite Co Ltd 液状エポキシ樹脂組成物
JP3623530B2 (ja) * 1994-04-18 2005-02-23 日東電工株式会社 光半導体装置
JP3820602B2 (ja) * 1995-06-21 2006-09-13 日本油脂株式会社 潜在化二塩基酸化合物及び熱硬化性組成物
CA2182761A1 (en) * 1995-08-08 1997-02-09 Manabu Yoshioka Curable resin composition, coating composition and method for forming coated film
EP0773268A3 (en) * 1995-11-09 1998-04-29 Nippon Paint Co., Ltd. Powder coating composition, and method for forming coated film
JP3360546B2 (ja) * 1996-10-22 2002-12-24 大日本インキ化学工業株式会社 熱硬化性樹脂組成物
JPH10219123A (ja) * 1997-02-12 1998-08-18 Nof Corp 硬化性組成物、塗装仕上げ方法及び塗装物品
JP3618238B2 (ja) 1998-12-25 2005-02-09 日亜化学工業株式会社 発光ダイオード
JP2000281758A (ja) * 1999-04-01 2000-10-10 Kansai Paint Co Ltd 硬化性樹脂組成物
JP2000292920A (ja) 1999-04-02 2000-10-20 Jsr Corp カラーフィルタ用感放射線性組成物
JP2000344868A (ja) 1999-06-03 2000-12-12 Tonen Chem Corp エポキシ樹脂組成物
DE60025720T2 (de) * 1999-06-18 2006-11-09 Hitachi Chemical Co., Ltd. Klebstoff, klebstoffgegenstand, schaltungssubstrat für halbleitermontage mit einem klebstoff und eine halbleiteranordnung die diesen enthält
JP2001019721A (ja) * 1999-07-09 2001-01-23 Nippon Shokubai Co Ltd 硬化性樹脂組成物
JP4245740B2 (ja) 1999-07-29 2009-04-02 新日鐵化学株式会社 光重合性樹脂組成物並びにカラーフィルター
JP2001081416A (ja) 1999-09-13 2001-03-27 Nippon Steel Chem Co Ltd 硬化膜並びにこれを用いたカラーフィルター
JP2001234032A (ja) * 2000-02-24 2001-08-28 Sumitomo Bakelite Co Ltd 光半導体封止用エポキシ樹脂組成物
JP2001323135A (ja) 2000-03-06 2001-11-20 Sumitomo Bakelite Co Ltd 光半導体封止用エポキシ樹脂組成物および光半導体装置
JP2001272775A (ja) 2000-03-24 2001-10-05 Nippon Paint Co Ltd 水性フォトソルダーレジスト組成物
US7034075B1 (en) * 2000-11-28 2006-04-25 H. B. Fuller Licensing & Financing Inc. Low gloss powder coating compositions
US20030059618A1 (en) * 2001-03-23 2003-03-27 Hideyuke Takai Method of producing epoxy compound, epoxy resin composition and its applications, ultraviolet rays-curable can-coating composition and method of producing coated metal can
WO2003025043A1 (en) * 2001-09-14 2003-03-27 Sumitomo Chemical Company, Limited Resin composition for optical-semiconductor encapsulation
JP2003255120A (ja) 2002-02-28 2003-09-10 Showa Denko Kk カラーフィルタ用樹脂組成物
US7291684B2 (en) * 2003-03-11 2007-11-06 Sumitomo Bakelite Co., Ltd. Resin composition for encapsulating semiconductor chip and semiconductor device therewith
JP4163162B2 (ja) * 2003-08-29 2008-10-08 住友ベークライト株式会社 エポキシ樹脂用潜伏性触媒、エポキシ樹脂組成物および半導体装置
JP2006131867A (ja) * 2004-10-08 2006-05-25 Hitachi Chem Co Ltd 樹脂組成物、及びそれを用いた光学部材とその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06281801A (ja) * 1992-01-14 1994-10-07 Sanyo Chem Ind Ltd 熱硬化性組成物およびカラーフィルターの表面保護剤
GB2294044A (en) * 1994-10-11 1996-04-17 Daicel Chem Alkenyl and epoxy (meth)acrylates and polymers thereof
JPH09100274A (ja) * 1995-10-04 1997-04-15 Daicel Chem Ind Ltd エポキシ環およびアルケニル基を有する（メタ）アクリレートとその製造方法
JP2000159860A (ja) * 1998-11-27 2000-06-13 Hitachi Chem Co Ltd 耐熱性樹脂組成物

Also Published As

Publication number Publication date
KR100946609B1 (ko) 2010-03-09
JP2009041028A (ja) 2009-02-26
TWI300073B (en) 2008-08-21
CN1507462A (zh) 2004-06-23
CN1247651C (zh) 2006-03-29
US20080249220A1 (en) 2008-10-09
US20040092668A1 (en) 2004-05-13
KR20040032099A (ko) 2004-04-14
WO2003025043A1 (en) 2003-03-27
US7423083B2 (en) 2008-09-09
CA2442314A1 (en) 2003-03-27
EP1426394A4 (en) 2010-11-03
KR100946607B1 (ko) 2010-03-09
KR20090027737A (ko) 2009-03-17
US7919550B2 (en) 2011-04-05
EP1426394A1 (en) 2004-06-09

Similar Documents

Publication Publication Date Title
SG97310A1 (en) Photosemiconductor encapsulating resin composition
ATE376565T1 (de) Phosphor enthaltende epoxidharzzusammensetzung, verbundfolie die diese enthält, mehrschichtwerkstoff aus metall, prepreg und laminierte platte, mehrschichtplatte
MY145608A (en) Thermosetting resin composition and semiconductor sealing medium
TW200642995A (en) (Meth)acryloyl group-containing aromatic isocyanate compound and production process thereof
WO2003076528A3 (en) Photocurable resin composition and optical component
CA2611303A1 (en) Polythioether polymers and curable compositions containing them
EP2090594A4 (en) AQUEOUS-BASED RESIN COMPOSITION CURABLE BY ACTINIC ENERGY RAY, ACTINIC ENERGY-CURABLE RAY-CURABLE COATING MATERIAL, METHOD OF FORMING CURED COATING FILM, AND CORRESPONDING ARTICLE
TW200708865A (en) Sealing material for the liquid crystal dispensing method, transferring material and liquid crystal display devices
TW200609262A (en) Ultraviolet-curable composition
WO2009041389A1 (ja) エポキシ樹脂組成物、その硬化物及び発光ダイオード
DE60126649D1 (de) Kosmetische zusammensetzung enthaltend heteropolymere und eine feste substanz und anwendungsverfahren
EP1308471A3 (en) Radiation curable resin composition for Fresnel lens and Fresnel lens sheet
MY124259A (en) Epoxy resin composition for encapsulating photosemiconductor element photosemiconductor device
TW200600558A (en) Acrylic resin composition
TW200734377A (en) Phenol resin and resin composition
TW200734365A (en) Resin composition, resin cured product, and liquid discharge head
TW200801062A (en) Epoxy resin molding material for sealing and device of electronic part
TW200510501A (en) Acrylic resin composition
TW200634432A (en) Photosensitive resin composition for interplayer insulating film
WO2008123237A1 (ja) エポキシ樹脂組成物
TW200619257A (en) Epoxyresin compositions and articles
TW200619240A (en) Star polymer, acid-decomposable resin composition, resist composition, and di(meth) acrylate compound
TW200636390A (en) Photosensitive resin composition and color filter using the same
TW200635977A (en) Epoxy resin composition and optical material using same
TW200420703A (en) Acrylic resin composition, adhesive comprising the composition, and optical laminate comprising the adhesive