SG97148A1 - Method of manufacturing a surface acoustic wave element - Google Patents

Method of manufacturing a surface acoustic wave element

Info

Publication number
SG97148A1
SG97148A1 SG200002052A SG200002052A SG97148A1 SG 97148 A1 SG97148 A1 SG 97148A1 SG 200002052 A SG200002052 A SG 200002052A SG 200002052 A SG200002052 A SG 200002052A SG 97148 A1 SG97148 A1 SG 97148A1
Authority
SG
Singapore
Prior art keywords
manufacturing
acoustic wave
surface acoustic
wave element
wave
Prior art date
Application number
SG200002052A
Other languages
English (en)
Inventor
Takata Eiichi
Yamamoto Yasuji
Yoneda Toshimaro
Kadota Michio
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of SG97148A1 publication Critical patent/SG97148A1/en

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H03H3/10—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves for obtaining desired frequency or temperature coefficient
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/4908—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/49798—Dividing sequentially from leading end, e.g., by cutting or breaking

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
SG200002052A 1999-04-28 2000-04-11 Method of manufacturing a surface acoustic wave element SG97148A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12250799A JP3712035B2 (ja) 1999-04-28 1999-04-28 表面波装置の製造方法

Publications (1)

Publication Number Publication Date
SG97148A1 true SG97148A1 (en) 2003-07-18

Family

ID=14837569

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200002052A SG97148A1 (en) 1999-04-28 2000-04-11 Method of manufacturing a surface acoustic wave element

Country Status (7)

Country Link
US (3) US6564439B1 (zh)
EP (1) EP1049252A3 (zh)
JP (1) JP3712035B2 (zh)
KR (1) KR100352392B1 (zh)
CN (1) CN1158758C (zh)
SG (1) SG97148A1 (zh)
TW (1) TW480812B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002043880A (ja) * 2000-07-26 2002-02-08 Murata Mfg Co Ltd 弾性表面波素子の周波数調整方法
US6773557B2 (en) * 2001-01-31 2004-08-10 Showa Shinku Co., Ltd. System for frequency adjustment of piezoelectric resonators by dual-track ion etching
DE10206480B4 (de) * 2001-02-16 2005-02-10 Leibniz-Institut für Festkörper- und Werkstoffforschung e.V. Akustisches Oberflächenwellenbauelement
US6997921B2 (en) * 2001-09-07 2006-02-14 Medtronic Minimed, Inc. Infusion device and driving mechanism for same
DE10162580A1 (de) * 2001-12-19 2003-07-17 Infineon Technologies Ag Piezoelektrischer Schwingkreis, Verfahren zu dessen Herstellung und Filteranordnung
CN1290258C (zh) * 2001-12-28 2006-12-13 松下电器产业株式会社 弹性表面波装置以及应用该装置的电子部件和复合模件
KR100814005B1 (ko) * 2002-04-15 2008-03-14 마쯔시다덴기산교 가부시키가이샤 탄성 표면파 장치 및 이를 이용한 이동통신기기 및 센서
KR100496527B1 (ko) * 2002-09-25 2005-06-22 일진디스플레이(주) 표면 탄성파 소자용 탄탈산 리튬 단결정 기판의 제조방법
KR100496526B1 (ko) * 2002-09-25 2005-06-22 일진디스플레이(주) 표면 탄성파 소자용 탄탈산 리튬 단결정 기판의 제조방법
JP2006025396A (ja) 2004-06-09 2006-01-26 Seiko Epson Corp 弾性表面波装置、その製造方法、および電子機器
US8132314B2 (en) * 2008-10-29 2012-03-13 Honeywell International Inc. Method and system for packaging and mounting surface acoustic wave sensor elements to a flex plate
JP4863097B2 (ja) * 2009-08-11 2012-01-25 株式会社村田製作所 弾性表面波素子の製造方法
CN102412802A (zh) * 2011-11-24 2012-04-11 中国电子科技集团公司第二十六研究所 基片级声表面波器件的频率修正方法
CN103701424A (zh) * 2013-12-24 2014-04-02 珠海东精大电子科技有限公司 49s石英晶体谐振器的制备方法
CN106154186B (zh) * 2016-06-20 2020-01-17 瑞声声学科技(常州)有限公司 声表面波磁传感器及其制备方法
DE102019130514B4 (de) * 2019-11-12 2021-09-23 RF360 Europe GmbH Trimmverfahren für einen SAW-Wafer, getrimmte Wafer und getrimmte SAW-Vorrichtungen

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774573A (ja) * 1993-08-31 1995-03-17 Toshiba Corp 弾性表面波素子の周波数調整方法
JPH08139546A (ja) * 1994-11-14 1996-05-31 Murata Mfg Co Ltd 弾性表面波素子の電極形成方法

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US4403165A (en) 1982-05-07 1983-09-06 The United States Of America As Represented By The Secretary Of The Army Transducer isolation in surface acoustic wave processor
US4450374A (en) * 1982-05-27 1984-05-22 Motorola Inc. Oxygen-plasma passivated and low scatter acoustic wave devices
JPS5958907A (ja) * 1982-09-29 1984-04-04 Hitachi Ltd 弾性表面波装置
JPS6120410A (ja) * 1984-07-07 1986-01-29 Nec Kansai Ltd 弾性表面波装置の製造方法
US4756794A (en) * 1987-08-31 1988-07-12 The United States Of America As Represented By The Secretary Of The Navy Atomic layer etching
JPH01231412A (ja) * 1988-03-11 1989-09-14 Fujitsu Ltd 弾性表面波ディバイスの周波数特性調整方法
JPH01238213A (ja) * 1988-03-18 1989-09-22 Fujitsu Ltd 弾性表面波ディバイス用周波数特性調整装置
JPH02189011A (ja) 1989-01-18 1990-07-25 Fujitsu Ltd 弾性表面波デバイスの製造方法
JP3140767B2 (ja) * 1990-10-23 2001-03-05 キンセキ株式会社 弾性表面波素子の製造方法
JPH04199906A (ja) * 1990-11-29 1992-07-21 Kokusai Electric Co Ltd 弾性表面波共振子
JP2589634B2 (ja) 1992-10-05 1997-03-12 松下電器産業株式会社 電子音響集積回路とその製造方法
EP0534354A1 (en) * 1991-09-25 1993-03-31 Sumitomo Electric Industries, Limited Surface acoustic wave device and manufacturing method thereof
JP3109060B2 (ja) * 1991-09-26 2000-11-13 住友電気工業株式会社 表面弾性波素子
US5356870A (en) * 1992-03-26 1994-10-18 Sanyo Electric Co., Ltd. Method for processing superconducting thin films
JPH05299960A (ja) 1992-04-21 1993-11-12 Sanyo Electric Co Ltd 弾性表面波素子の製造方法
JP3132898B2 (ja) 1992-06-16 2001-02-05 富士通株式会社 弾性表面波素子の製造方法
JP3252865B2 (ja) * 1992-09-11 2002-02-04 住友電気工業株式会社 表面弾性波素子および表面弾性波素子の製造方法
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JPH06268463A (ja) 1993-03-10 1994-09-22 Canon Inc 表面弾性波素子及びその製造法
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JP3379049B2 (ja) 1993-10-27 2003-02-17 富士通株式会社 表面弾性波素子とその製造方法
JPH07264000A (ja) * 1994-03-16 1995-10-13 Fujitsu Ltd 弾性表面波フィルタ素子及びそれをパッケージングして成る弾性表面波フィルタ
US5815900A (en) * 1995-03-06 1998-10-06 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a surface acoustic wave module
EP0840369A4 (en) * 1995-06-30 2001-12-19 Toshiba Kk ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
JP3609423B2 (ja) * 1995-09-21 2005-01-12 Ｔｄｋ株式会社 弾性表面波装置及びその製造方法
US5651856A (en) * 1996-01-22 1997-07-29 Micron Technology, Inc. Selective etch process
JPH09270654A (ja) * 1996-03-29 1997-10-14 Kinseki Ltd 弾性表面波素子の製造方法
JPH11163655A (ja) * 1997-12-01 1999-06-18 Murata Mfg Co Ltd 弾性表面波装置の製造方法
JP3266109B2 (ja) * 1998-08-05 2002-03-18 株式会社村田製作所 電子デバイスの作製方法
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Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774573A (ja) * 1993-08-31 1995-03-17 Toshiba Corp 弾性表面波素子の周波数調整方法
JPH08139546A (ja) * 1994-11-14 1996-05-31 Murata Mfg Co Ltd 弾性表面波素子の電極形成方法

Also Published As

Publication number Publication date
JP3712035B2 (ja) 2005-11-02
US6789297B2 (en) 2004-09-14
US6810566B2 (en) 2004-11-02
US6564439B1 (en) 2003-05-20
JP2000315928A (ja) 2000-11-14
CN1158758C (zh) 2004-07-21
KR100352392B1 (ko) 2002-09-11
US20020062542A1 (en) 2002-05-30
EP1049252A2 (en) 2000-11-02
CN1271996A (zh) 2000-11-01
EP1049252A3 (en) 2003-01-22
TW480812B (en) 2002-03-21
KR20000077080A (ko) 2000-12-26
US20020059709A1 (en) 2002-05-23

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