SG96163A1 - Resin sealing/molding apparatus sealing electronic parts - Google Patents
Resin sealing/molding apparatus sealing electronic partsInfo
- Publication number
- SG96163A1 SG96163A1 SG9610974A SG1996010974A SG96163A1 SG 96163 A1 SG96163 A1 SG 96163A1 SG 9610974 A SG9610974 A SG 9610974A SG 1996010974 A SG1996010974 A SG 1996010974A SG 96163 A1 SG96163 A1 SG 96163A1
- Authority
- SG
- Singapore
- Prior art keywords
- sealing
- molding apparatus
- electronic parts
- resin
- resin sealing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7306911A JPH09123206A (ja) | 1995-10-30 | 1995-10-30 | 電子部品の樹脂封止成形装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG96163A1 true SG96163A1 (en) | 2003-05-23 |
Family
ID=17962764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG9610974A SG96163A1 (en) | 1995-10-30 | 1996-10-28 | Resin sealing/molding apparatus sealing electronic parts |
Country Status (7)
Country | Link |
---|---|
US (1) | US5783220A (ko) |
EP (1) | EP0771638A3 (ko) |
JP (1) | JPH09123206A (ko) |
KR (1) | KR100187537B1 (ko) |
MY (1) | MY123756A (ko) |
SG (1) | SG96163A1 (ko) |
TW (1) | TW317532B (ko) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3631848B2 (ja) * | 1996-06-28 | 2005-03-23 | 富士通株式会社 | 画像表示システム |
JP2944569B2 (ja) * | 1997-05-16 | 1999-09-06 | 九州日本電気株式会社 | 樹脂封止金型の洗浄方法 |
KR100446111B1 (ko) * | 1997-10-27 | 2004-10-14 | 삼성전자주식회사 | 반도체 패키지 몰딩 프레스 장치 및 이의 반도체 패키지몰딩 프레스 방법 |
US6098637A (en) * | 1998-03-03 | 2000-08-08 | Applied Materials, Inc. | In situ cleaning of the surface inside a vacuum processing chamber |
KR100339020B1 (ko) * | 1999-08-02 | 2002-05-31 | 윤종용 | 반도체칩 패키징 시스템 및 이를 이용한 반도체칩 패키징 방법 |
DE10115394B4 (de) * | 2001-03-29 | 2005-03-24 | Christof Diener | Maschinenbauteil und/oder verfahrenstechnische Anlage mit einem Hohlraum und Reinigungsverfahren hierfür |
KR100408457B1 (ko) * | 2001-05-10 | 2003-12-06 | 삼성전자주식회사 | 반도체 칩 패키지 몰딩 장치용 클리닝 장치 |
TW552188B (en) * | 2001-11-16 | 2003-09-11 | Towa Corp | Apparatus and method for evaluating degree of adhesion of adherents to mold surface, apparatus and method for surface treatment of mold surface and method and apparatus for cleaning mold used for molding resin |
JP5004410B2 (ja) * | 2004-04-26 | 2012-08-22 | Towa株式会社 | 光素子の樹脂封止成形方法および樹脂封止成形装置 |
JP5128047B2 (ja) * | 2004-10-07 | 2013-01-23 | Towa株式会社 | 光デバイス及び光デバイスの生産方法 |
US7985357B2 (en) * | 2005-07-12 | 2011-07-26 | Towa Corporation | Method of resin-sealing and molding an optical device |
SI21788A (sl) * | 2005-09-22 | 2005-12-31 | Koroski Holding D.O.O. | Avtomatizirana centralna enota za nanos locilnega sredstva v kalupe |
KR100822523B1 (ko) * | 2005-09-27 | 2008-04-16 | 토와 가부시기가이샤 | 전자부품의 수지밀봉 성형 방법 및 장치 |
US7618249B2 (en) * | 2006-09-22 | 2009-11-17 | Asm Technology Singapore Pte Ltd. | Memory card molding apparatus and process |
KR100780453B1 (ko) * | 2006-11-21 | 2007-11-28 | 세크론 주식회사 | 트레이 이송 장치 및 이를 이용하는 트레이 이송 방법 |
SG143180A1 (en) * | 2006-11-22 | 2008-06-27 | Apic Yamada Corporaton | Resin molding machine and method of resin molding |
KR100890741B1 (ko) * | 2007-03-13 | 2009-03-26 | 삼성전기주식회사 | 고출력 led 패키지 및 그 제조방법 |
US8394203B2 (en) * | 2008-10-02 | 2013-03-12 | Molecular Imprints, Inc. | In-situ cleaning of an imprint lithography tool |
TWI410288B (zh) * | 2008-10-02 | 2013-10-01 | Molecular Imprints Inc | 壓印微影術工具之原地清潔技術 |
US8980751B2 (en) | 2010-01-27 | 2015-03-17 | Canon Nanotechnologies, Inc. | Methods and systems of material removal and pattern transfer |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6058238A (ja) * | 1983-09-09 | 1985-04-04 | Ushio Inc | 紫外線洗浄方法 |
JPS60250915A (ja) * | 1984-05-28 | 1985-12-11 | Polyplastics Co | 成形用金型付着物の除去法 |
JPH01122417A (ja) * | 1987-11-06 | 1989-05-15 | Rohm Co Ltd | 合成樹脂モールド用金型の清掃方法 |
EP0606648A2 (en) * | 1993-01-15 | 1994-07-20 | Kabushiki Kaisha Toshiba | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1935887C3 (de) * | 1969-07-15 | 1975-07-10 | G. Siempelkamp & Co, 4150 Krefeld | Anlage zur Herstellung von Spanplatten, Faserplatten und dergleichen |
CH522489A (it) * | 1970-07-24 | 1972-06-30 | Italtrade | Pressa per lo stampaggio di materie plastische, gomma e simili |
US3941537A (en) * | 1975-03-24 | 1976-03-02 | Caterpillar Tractor Co. | Rotary spray cleaner for circular dies |
JPS59220931A (ja) * | 1983-05-31 | 1984-12-12 | Seiei Kosan Kk | 集積回路用自動モ−ルデイング装置 |
US4534921A (en) * | 1984-03-06 | 1985-08-13 | Asm Fico Tooling, B.V. | Method and apparatus for mold cleaning by reverse sputtering |
JPS6131219A (ja) * | 1984-07-23 | 1986-02-13 | Hitachi Ltd | デイスク成形金型クリ−ニング機構 |
JPS61293814A (ja) * | 1985-06-21 | 1986-12-24 | Nec Corp | 樹脂封止金型の金型掃除用クリ−ナ |
JPS63237913A (ja) * | 1987-03-27 | 1988-10-04 | Hitachi Ltd | 金型装置 |
JPH01105708A (ja) * | 1987-10-19 | 1989-04-24 | Mitsubishi Electric Corp | モールド装置 |
JPH04158007A (ja) * | 1990-10-22 | 1992-06-01 | Sharp Corp | 金型クリーニング装置 |
JPH05218276A (ja) * | 1991-11-12 | 1993-08-27 | Motorola Inc | 割れにくい半導体装置およびその作製方法 |
JPH05138685A (ja) * | 1991-11-18 | 1993-06-08 | Fujitsu Miyagi Electron:Kk | モールド装置 |
JP2932137B2 (ja) * | 1993-07-22 | 1999-08-09 | トーワ株式会社 | 電子部品の樹脂封止成形方法及び装置 |
JP2932136B2 (ja) * | 1993-07-22 | 1999-08-09 | トーワ株式会社 | 電子部品の樹脂封止成形方法及び装置 |
TW257745B (ko) * | 1993-07-22 | 1995-09-21 | Towa Kk | |
JPH0794539A (ja) * | 1993-09-20 | 1995-04-07 | Fujitsu Ltd | 半導体装置 |
JPH07148746A (ja) * | 1993-11-30 | 1995-06-13 | Apic Yamada Kk | モールド金型のクリーニング装置 |
JP3165009B2 (ja) * | 1995-08-02 | 2001-05-14 | 松下電子工業株式会社 | 半導体装置の製造方法 |
-
1995
- 1995-10-30 JP JP7306911A patent/JPH09123206A/ja active Pending
-
1996
- 1996-07-06 TW TW085108202A patent/TW317532B/zh active
- 1996-10-24 MY MYPI96004416A patent/MY123756A/en unknown
- 1996-10-25 US US08/738,095 patent/US5783220A/en not_active Expired - Fee Related
- 1996-10-28 SG SG9610974A patent/SG96163A1/en unknown
- 1996-10-29 EP EP96307794A patent/EP0771638A3/en not_active Withdrawn
- 1996-10-29 KR KR1019960049365A patent/KR100187537B1/ko not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6058238A (ja) * | 1983-09-09 | 1985-04-04 | Ushio Inc | 紫外線洗浄方法 |
JPS60250915A (ja) * | 1984-05-28 | 1985-12-11 | Polyplastics Co | 成形用金型付着物の除去法 |
JPH01122417A (ja) * | 1987-11-06 | 1989-05-15 | Rohm Co Ltd | 合成樹脂モールド用金型の清掃方法 |
EP0606648A2 (en) * | 1993-01-15 | 1994-07-20 | Kabushiki Kaisha Toshiba | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
EP0771638A2 (en) | 1997-05-07 |
JPH09123206A (ja) | 1997-05-13 |
MY123756A (en) | 2006-06-30 |
EP0771638A3 (en) | 1999-03-17 |
KR100187537B1 (ko) | 1999-06-01 |
KR970020382A (ko) | 1997-05-28 |
TW317532B (ko) | 1997-10-11 |
US5783220A (en) | 1998-07-21 |
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