SG68071A1 - Semi-conductor mounting apparatus for applying adhesive to substrate - Google Patents

Semi-conductor mounting apparatus for applying adhesive to substrate

Info

Publication number
SG68071A1
SG68071A1 SG1998003134A SG1998003134A SG68071A1 SG 68071 A1 SG68071 A1 SG 68071A1 SG 1998003134 A SG1998003134 A SG 1998003134A SG 1998003134 A SG1998003134 A SG 1998003134A SG 68071 A1 SG68071 A1 SG 68071A1
Authority
SG
Singapore
Prior art keywords
substrate
semi
mounting apparatus
applying adhesive
conductor mounting
Prior art date
Application number
SG1998003134A
Other languages
English (en)
Inventor
Christoph Koster
Franco Viggiano
Original Assignee
Esec Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Sa filed Critical Esec Sa
Publication of SG68071A1 publication Critical patent/SG68071A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
SG1998003134A 1997-09-05 1998-08-19 Semi-conductor mounting apparatus for applying adhesive to substrate SG68071A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH208997 1997-09-05

Publications (1)

Publication Number Publication Date
SG68071A1 true SG68071A1 (en) 1999-10-19

Family

ID=4225641

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998003134A SG68071A1 (en) 1997-09-05 1998-08-19 Semi-conductor mounting apparatus for applying adhesive to substrate

Country Status (7)

Country Link
US (1) US6129040A (ja)
EP (1) EP0901155B1 (ja)
JP (1) JPH11168111A (ja)
KR (1) KR100543108B1 (ja)
DE (1) DE59811823D1 (ja)
SG (1) SG68071A1 (ja)
TW (1) TW393742B (ja)

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CN105120608B (zh) * 2015-08-31 2017-12-19 东莞市沃德精密机械有限公司 与控制器电性连接的全自动贴装机
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CN110446424B (zh) * 2019-08-30 2024-03-08 恩纳基智能科技无锡有限公司 多功能双工位柔性焊头机构
CN214160301U (zh) * 2020-12-08 2021-09-10 惠州市开蒙医疗科技有限公司 一种高精度点胶定位设备
CN114160371B (zh) * 2021-11-29 2023-07-07 苏州希盟科技股份有限公司 一种点胶装置
CN114042601B (zh) * 2022-01-11 2022-04-08 江苏卓远半导体有限公司 一种半导体用点胶机
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Also Published As

Publication number Publication date
EP0901155B1 (de) 2004-08-18
KR19990029525A (ko) 1999-04-26
TW393742B (en) 2000-06-11
EP0901155A1 (de) 1999-03-10
KR100543108B1 (ko) 2006-08-30
JPH11168111A (ja) 1999-06-22
DE59811823D1 (de) 2004-09-23
US6129040A (en) 2000-10-10

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