KR970077081A - 다이-본딩 장치 - Google Patents

다이-본딩 장치 Download PDF

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Publication number
KR970077081A
KR970077081A KR1019970017021A KR19970017021A KR970077081A KR 970077081 A KR970077081 A KR 970077081A KR 1019970017021 A KR1019970017021 A KR 1019970017021A KR 19970017021 A KR19970017021 A KR 19970017021A KR 970077081 A KR970077081 A KR 970077081A
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KR
South Korea
Prior art keywords
nozzle
positioning
cam
chip
moving
Prior art date
Application number
KR1019970017021A
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English (en)
Other versions
KR100251515B1 (ko
Inventor
야스오 다카나미
Original Assignee
모리시타 요이찌
마쓰시타 덴키 산교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 모리시타 요이찌, 마쓰시타 덴키 산교 가부시키가이샤 filed Critical 모리시타 요이찌
Publication of KR970077081A publication Critical patent/KR970077081A/ko
Application granted granted Critical
Publication of KR100251515B1 publication Critical patent/KR100251515B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

칩을 픽업하는 노즐을 전달하는 헤드부는 칩 공급부에서 웨이퍼로부터 칩을 픽업하고, 칩을 기판상에 설치하는 노즐의 상하 이동용 스트로크를 단축하기 위해 칩 공급부의 웨이퍼 및 위치 설정부의 기판간에 헤드부의 이동동안 캠 및 캠 종동부를 사용해서 상하로 이동되어, 노즐 이동동안 부하는 감소되어, 헤드부가 택트(tact) 시간을 단축하고 작업 능률을 증대시키기 위해 웨이퍼 및 기판간에 이동되는 속도를 증대시키는 것이 가능하다.

Description

다이-본딩 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예 형태에서 다이-본딩 장치를 예시하는 투시도.

Claims (3)

  1. 다이-본딩 장치에 있어서, 베이스상에 구비되어 기판을 위치 설정하는 위치 설정부와, 그 위치 설정부에 위치 설정된 기판 아래에 높이차를 확보해서 상기 베이스 상에 배열된 공급부와, 칩을 흡착하는 노즐을 탑재하게 전달하는 헤드부와, 상기 위치 설정부 및 칩 공급부간에 헤드부를 이동시키는 이동 수단과, 상기 위치 설정부로부터 상기 칩 공급부까지의 하향 구배를 갖는 캠 곡선을 갖는 캠과, 상기 노즐을 상하로 이동시키기 위해 상기 노즐과 집적해서 결합하고 캠 곡선을 따라 이동시키기 위해 사용되는 캠 종동부와, 상기 위치 설정부 또는 칩 공급부 위에서 노즐을 상하로 이동시키기 위해 상기 캠을 상하로 이동시키는 수직 이동 수단을 구비하는 것을 특징으로 하는 다이-본딩 장치.
  2. 청구항 1에 있어서, 상기 캠을 이동시키는 상기 수직 이동 수단이 상기 헤드부와 집적해서 결합되는 것이 아니라 상기 베이스와 집적해서 결합되는 구동부를 가짐으로써 상기 구동부는 칩 공급부 및 위치 설정부간에 상기 헤드부의 이동동안 부하를 발생하지 않는 것을 특징으로 하는 다이-본딩 장치.
  3. 본딩 방법에 있어서, 기판을 위치 설정부에서 위치 설정하는 단계와, 이동동안 상기 노즐을 낮추기 위해 캠을 따라 상기 노즐과 결합된 캠 종동부를 가이드하는 동안 칩 공급부 위의 위치로 노즐을 이동시키는 단계와, 칩을 픽업하기 위해 상기 노즐을 상하로 이동시키는 단계와, 상기 노즐을 올리기 위해 상기 캠을 따라 상기 캠 종동부를 가이드하는 동안 상기 칩 공급 부로부터 위치 설정부 위의 위치로 노즐을 이동시키는 단계와, 칩을 상기 기판상에 본드시키기 위해 상기 노즐을 낮추고 올리는 단계를 구비하는 것을 특징으로 하는 본딩.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970017021A 1996-05-07 1997-05-02 다이-본딩 장치 KR100251515B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11249996A JP3149782B2 (ja) 1996-05-07 1996-05-07 ダイボンディング装置およびダイボンディング方法
JP96-112499 1996-05-07

Publications (2)

Publication Number Publication Date
KR970077081A true KR970077081A (ko) 1997-12-12
KR100251515B1 KR100251515B1 (ko) 2000-04-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970017021A KR100251515B1 (ko) 1996-05-07 1997-05-02 다이-본딩 장치

Country Status (5)

Country Link
US (1) US5876556A (ko)
JP (1) JP3149782B2 (ko)
KR (1) KR100251515B1 (ko)
CN (1) CN1109359C (ko)
TW (1) TW363232B (ko)

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JP5941705B2 (ja) * 2012-02-29 2016-06-29 ファスフォードテクノロジ株式会社 ２軸駆動機構及びダイボンダ
JP2014056979A (ja) * 2012-09-13 2014-03-27 Hitachi High-Tech Instruments Co Ltd 水平軸駆動機構、２軸駆動機構及びダイボンダ
CN103531505B (zh) * 2013-10-12 2015-12-30 四川蓝彩电子科技有限公司 晶片装配系统
JP6573813B2 (ja) * 2015-09-30 2019-09-11 ファスフォードテクノロジ株式会社 ダイボンダおよび半導体装置の製造方法
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Also Published As

Publication number Publication date
KR100251515B1 (ko) 2000-04-15
JPH09298210A (ja) 1997-11-18
TW363232B (en) 1999-07-01
US5876556A (en) 1999-03-02
JP3149782B2 (ja) 2001-03-26
CN1169591A (zh) 1998-01-07
CN1109359C (zh) 2003-05-21

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