SG63762A1 - Solder material and electronic part using the same - Google Patents

Solder material and electronic part using the same

Info

Publication number
SG63762A1
SG63762A1 SG1997003771A SG1997003771A SG63762A1 SG 63762 A1 SG63762 A1 SG 63762A1 SG 1997003771 A SG1997003771 A SG 1997003771A SG 1997003771 A SG1997003771 A SG 1997003771A SG 63762 A1 SG63762 A1 SG 63762A1
Authority
SG
Singapore
Prior art keywords
solder material
ingot
plating
die
chip
Prior art date
Application number
SG1997003771A
Other languages
English (en)
Inventor
Kazuhiro Aoi
Toshinori Ogashiwa
Takatoshi Arikawa
Yoshiharu Sawada
Original Assignee
Matsushita Electric Ind Co Ltd
Tanaka Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd, Tanaka Electronics Ind filed Critical Matsushita Electric Ind Co Ltd
Publication of SG63762A1 publication Critical patent/SG63762A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
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  • Chemically Coating (AREA)
SG1997003771A 1996-10-17 1997-10-17 Solder material and electronic part using the same SG63762A1 (en)

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DE69706948D1 (de) 2001-10-31
JP3226213B2 (ja) 2001-11-05
CN1076998C (zh) 2002-01-02
EP0847828B1 (de) 2001-09-26
JPH10118783A (ja) 1998-05-12
MY119338A (en) 2005-05-31
CN1186009A (zh) 1998-07-01
US6187114B1 (en) 2001-02-13
EP0847828A1 (de) 1998-06-17

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