SG46999A1 - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
SG46999A1
SG46999A1 SG1996001425A SG1996001425A SG46999A1 SG 46999 A1 SG46999 A1 SG 46999A1 SG 1996001425 A SG1996001425 A SG 1996001425A SG 1996001425 A SG1996001425 A SG 1996001425A SG 46999 A1 SG46999 A1 SG 46999A1
Authority
SG
Singapore
Prior art keywords
resin composition
photosensitive resin
photosensitive
composition
resin
Prior art date
Application number
SG1996001425A
Other languages
English (en)
Inventor
Kouichi Katou
Eiji Watanabe
Kouichi Kunimune
Original Assignee
Chisso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chisso Corp filed Critical Chisso Corp
Publication of SG46999A1 publication Critical patent/SG46999A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/81—Unsaturated isocyanates or isothiocyanates
    • C08G18/8141—Unsaturated isocyanates or isothiocyanates masked
    • C08G18/815—Polyisocyanates or polyisothiocyanates masked with unsaturated compounds having active hydrogen
    • C08G18/8158—Polyisocyanates or polyisothiocyanates masked with unsaturated compounds having active hydrogen with unsaturated compounds having only one group containing active hydrogen
    • C08G18/8175—Polyisocyanates or polyisothiocyanates masked with unsaturated compounds having active hydrogen with unsaturated compounds having only one group containing active hydrogen with esters of acrylic or alkylacrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
    • C08G18/78—Nitrogen
    • C08G18/79—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates
    • C08G18/791—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing isocyanurate groups
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/107—Polyamide or polyurethane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
SG1996001425A 1992-06-25 1993-06-24 Photosensitive resin composition SG46999A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19015592A JP3211108B2 (ja) 1992-06-25 1992-06-25 感光性樹脂組成物

Publications (1)

Publication Number Publication Date
SG46999A1 true SG46999A1 (en) 1998-03-20

Family

ID=16253341

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996001425A SG46999A1 (en) 1992-06-25 1993-06-24 Photosensitive resin composition

Country Status (7)

Country Link
US (1) US5589319A (ja)
EP (1) EP0601203B1 (ja)
JP (1) JP3211108B2 (ja)
KR (1) KR100291376B1 (ja)
DE (1) DE69326598T2 (ja)
SG (1) SG46999A1 (ja)
WO (1) WO1994000800A1 (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0867754A (ja) * 1994-06-24 1996-03-12 Toray Ind Inc 硬化性組成物
TW424172B (en) * 1995-04-19 2001-03-01 Hitachi Chemical Co Ltd Photosensitive resin composition and photosensitive element using the same
US5925498A (en) * 1997-06-16 1999-07-20 Kodak Polychrome Graphics Llc Photosensitive polymer composition and element containing photosensitive polyamide and mixture of acrylates
JPH1152572A (ja) * 1997-08-08 1999-02-26 Fujitsu Ltd 感光性樹脂組成物及びそれを用いたパターン形成方法
US6515355B1 (en) * 1998-09-02 2003-02-04 Micron Technology, Inc. Passivation layer for packaged integrated circuits
US6242935B1 (en) 1999-01-21 2001-06-05 Micron Technology, Inc. Interconnect for testing semiconductor components and method of fabrication
US6819127B1 (en) 1999-02-19 2004-11-16 Micron Technology, Inc. Method for testing semiconductor components using interposer
US6242932B1 (en) 1999-02-19 2001-06-05 Micron Technology, Inc. Interposer for semiconductor components having contact balls
JP4770011B2 (ja) * 1999-09-28 2011-09-07 住友ベークライト株式会社 絶縁材用樹脂組成物及びこれを用いた絶縁材
JP4590690B2 (ja) * 2000-06-22 2010-12-01 住友ベークライト株式会社 絶縁材用樹脂組成物及びこれを用いた絶縁材
JP4981215B2 (ja) * 2001-03-19 2012-07-18 株式会社カネカ 感光性樹脂組成物およびそれを用いた感光性ドライフィルムレジスト
US6784275B2 (en) 2001-06-28 2004-08-31 Dainippon Ink And Chemicals, Inc. Active energy ray-curable polyimide resin composition
WO2003038526A1 (fr) 2001-10-30 2003-05-08 Kaneka Corporation Composition de resine photosensible et films et stratifies photosensibles ainsi obtenus
JP4222120B2 (ja) 2002-10-07 2009-02-12 Ｊｓｒ株式会社 光導波路形成用感光性樹脂組成物および光導波路
JP4372065B2 (ja) * 2004-09-09 2009-11-25 信越化学工業株式会社 無溶剤型ポリイミドシリコーン樹脂組成物及びその硬化樹脂皮膜
US7604836B2 (en) 2006-12-13 2009-10-20 Hitachi Global Storage Technologies Netherlands B.V. Release layer and resist material for master tool and stamper tool
CN105503755B (zh) * 2016-01-10 2018-10-30 江苏博砚电子科技有限公司 一种彩色光阻用赛克基丙烯酸酯树脂及其制备方法
WO2018154688A1 (ja) * 2017-02-23 2018-08-30 日立化成デュポンマイクロシステムズ株式会社 樹脂組成物、硬化物、パターン硬化物、硬化物の製造方法、層間絶縁膜、表面保護膜及び電子部品

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5952822B2 (ja) * 1978-04-14 1984-12-21 東レ株式会社 耐熱性感光材料
JPS5541422A (en) * 1978-09-18 1980-03-24 Fujitsu Ltd Encipherment treatment system
JPS5545746A (en) * 1978-09-29 1980-03-31 Hitachi Ltd Reactive polymer composition
US4416973A (en) * 1982-01-04 1983-11-22 E. I. Du Pont De Nemours & Co. Radiation-sensitive polyimide precursor composition derived from a diaryl fluoro compound
JPS58120636A (ja) * 1982-01-04 1983-07-18 イ−・アイ・デユポン・ド・ネモア−ス・アンド・コンパニ− 放射感受性ポリイミド前駆体組成物およびその製造方法
US4430418A (en) * 1982-09-30 1984-02-07 E. I. Du Pont De Nemours And Company Radiation-sensitive polyimide precursor composition derived from a diaryl fluoronated diamine compound
JPS5915449A (ja) * 1982-07-16 1984-01-26 Nitto Electric Ind Co Ltd 感光性樹脂組成物
JPS606729A (ja) * 1983-06-24 1985-01-14 Ube Ind Ltd 有機溶媒に可溶性の感光性ポリイミド
US4515887A (en) * 1983-08-29 1985-05-07 General Electric Company Photopatternable dielectric compositions, method for making and use
US4604230A (en) * 1984-10-15 1986-08-05 Stauffer Chemical Company Thermally stable adhesive
US4692272A (en) * 1984-10-15 1987-09-08 Stauffer Chemical Company Thermally stable adhesive comprising soluble polyimide resin and epoxy resin
JPS63226639A (ja) * 1986-10-08 1988-09-21 Hitachi Chem Co Ltd 感光性樹脂組成物
JPS63183439A (ja) * 1987-01-26 1988-07-28 Hitachi Chem Co Ltd 画像の製造方法
JPS63206740A (ja) * 1987-02-24 1988-08-26 Mitsubishi Gas Chem Co Inc 感光性重合体組成物
US4927431A (en) * 1988-09-08 1990-05-22 Minnesota Mining And Manufacturing Company Binder for coated abrasives
JPH02144539A (ja) * 1988-11-28 1990-06-04 Sumitomo Bakelite Co Ltd 感光性樹脂組成物
JPH02154260A (ja) * 1988-12-07 1990-06-13 Hitachi Chem Co Ltd 感光性樹脂組成物およびこれを用いた感光性エレメント
JPH0391752A (ja) * 1989-09-04 1991-04-17 Sumitomo Bakelite Co Ltd 感光性樹脂組成物
JPH03160058A (ja) * 1989-11-17 1991-07-10 Mitsubishi Rayon Co Ltd 架橋硬化型樹脂組成物
JP2980359B2 (ja) * 1990-04-16 1999-11-22 富士通株式会社 感光性耐熱樹脂組成物とそれを用いたパターン形成方法
US5236472A (en) * 1991-02-22 1993-08-17 Minnesota Mining And Manufacturing Company Abrasive product having a binder comprising an aminoplast binder
JP2890213B2 (ja) * 1991-02-25 1999-05-10 チッソ株式会社 感光性重合体組成物及びパターンの形成方法

Also Published As

Publication number Publication date
DE69326598T2 (de) 2000-02-03
JP3211108B2 (ja) 2001-09-25
EP0601203A4 (en) 1995-06-07
WO1994000800A1 (en) 1994-01-06
JPH0611830A (ja) 1994-01-21
EP0601203B1 (en) 1999-09-29
EP0601203A1 (en) 1994-06-15
DE69326598D1 (de) 1999-11-04
KR100291376B1 (ko) 2001-09-17
US5589319A (en) 1996-12-31

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