SG35053A1 - Process for encapsulating an electronic component an electronic component thus encapsulated and encapsulating material designed therefor - Google Patents

Process for encapsulating an electronic component an electronic component thus encapsulated and encapsulating material designed therefor

Info

Publication number
SG35053A1
SG35053A1 SG1995002387A SG1995002387A SG35053A1 SG 35053 A1 SG35053 A1 SG 35053A1 SG 1995002387 A SG1995002387 A SG 1995002387A SG 1995002387 A SG1995002387 A SG 1995002387A SG 35053 A1 SG35053 A1 SG 35053A1
Authority
SG
Singapore
Prior art keywords
electronic component
encapsulating
encapsulated
encapsulating material
material designed
Prior art date
Application number
SG1995002387A
Other languages
English (en)
Inventor
Johannes Gerard Lodew Nelissen
Original Assignee
3P Licensing Bv
Pas Ireneus Johannes Theodorus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3P Licensing Bv, Pas Ireneus Johannes Theodorus filed Critical 3P Licensing Bv
Priority to SG1995002387A priority Critical patent/SG35053A1/en
Publication of SG35053A1 publication Critical patent/SG35053A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/06—Polysulfones; Polyethersulfones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Formation Of Insulating Films (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Sealing Material Composition (AREA)
SG1995002387A 1994-12-29 1995-12-28 Process for encapsulating an electronic component an electronic component thus encapsulated and encapsulating material designed therefor SG35053A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG1995002387A SG35053A1 (en) 1994-12-29 1995-12-28 Process for encapsulating an electronic component an electronic component thus encapsulated and encapsulating material designed therefor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL9402233A NL9402233A (nl) 1994-12-29 1994-12-29 Werkwijze voor het omhullen van een elektronische component, een aldus omhulde elektronische component en daarvoor bestemd kunststofmateriaal.
SG1995002387A SG35053A1 (en) 1994-12-29 1995-12-28 Process for encapsulating an electronic component an electronic component thus encapsulated and encapsulating material designed therefor

Publications (1)

Publication Number Publication Date
SG35053A1 true SG35053A1 (en) 1997-02-01

Family

ID=19865082

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1995002387A SG35053A1 (en) 1994-12-29 1995-12-28 Process for encapsulating an electronic component an electronic component thus encapsulated and encapsulating material designed therefor

Country Status (14)

Country Link
US (1) US5895620A (es)
EP (1) EP0720901B1 (es)
JP (1) JP3126104B2 (es)
KR (1) KR960026681A (es)
AT (1) ATE180201T1 (es)
CA (1) CA2166043A1 (es)
DE (1) DE69509739T2 (es)
ES (1) ES2133662T3 (es)
MX (1) MX9600185A (es)
MY (1) MY131688A (es)
NL (1) NL9402233A (es)
RU (1) RU2151447C1 (es)
SG (1) SG35053A1 (es)
TW (1) TW312843B (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2768707B1 (fr) * 1997-09-22 1999-10-29 Plastic Omnium Cie Dispositif de transport et/ou de collecte en matiere plastique moulee comportant un dispositif d'identification et procede de fabrication
DE19841498C2 (de) * 1998-09-10 2002-02-21 Beru Ag Verfahren zum Herstellen eines Elektronikbauelementes, insbesondere eines Hallsensors
US7585443B2 (en) 2004-05-20 2009-09-08 Albemarle Corporation Pelletized brominated anionic styrenic polymers and their preparation and use
US9202770B1 (en) 2014-09-01 2015-12-01 Freescale Semiconductor, Inc. Non-homogeneous molding of packaged semiconductor devices
DE102017219020A1 (de) * 2017-10-25 2019-04-25 Volkswagen Aktiengesellschaft Verfahren zur Herstellung eines fertigen Bauteils umfassend ein Elektronikelement
KR102536941B1 (ko) * 2020-09-28 2023-05-26 한국전자통신연구원 반도체 패키지의 제조 방법
CN113644203B (zh) * 2021-08-09 2024-02-27 天津大学 一种基于热塑性弹性体的有机太阳能电池及其制备方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3911075A (en) * 1974-02-28 1975-10-07 Western Electric Co Transfer molding thermosetting polymeric material
US3969461A (en) * 1974-02-28 1976-07-13 Western Electric Company, Inc. Transfer molding thermosetting polymeric material
US4327369A (en) * 1979-08-06 1982-04-27 Hi-Tech Industries, Inc. Encapsulating moisture-proof coating
US4359831A (en) * 1980-05-19 1982-11-23 De Lorean Manufacturing Company Reversibly powered rotary snow tiller
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
JPS57158271A (en) * 1981-03-26 1982-09-30 Showa Electric Wire & Cable Co Ltd Film extrusion-coating resin composition
JPS5911360A (ja) * 1982-07-09 1984-01-20 Toray Ind Inc 耐衝撃性熱可塑性樹脂組成物
US4528346A (en) * 1982-09-17 1985-07-09 Dainippun Ink and Chemicals, Inc. Resin composition
FR2545653B1 (fr) * 1983-05-04 1986-06-06 Pichot Michel Procede et dispositif d'encapsulation de circuits integres
EP0151553A3 (de) * 1984-02-03 1987-05-27 Ciba-Geigy Ag Epoxiharz/Polysulfon-Formmassen für gehärtete Produkte mit ausgezeichneter Riss- und Feuchtigkeitsbeständigkeit
JPS6220555A (ja) * 1985-07-18 1987-01-29 Mitsubishi Electric Corp エポキシ樹脂組成物
US4853442A (en) * 1987-04-03 1989-08-01 Hercules Incorporated Amine-terminated polysulfone sulfide, useful as epoxy curing agent
JPS63289016A (ja) * 1987-05-22 1988-11-25 Asahi Glass Co Ltd エポキシ樹脂組成物
US5364914A (en) * 1988-10-05 1994-11-15 Imperial Chemical Industries Plc Moulding composition comprising a thermoset component and thermoplast component
US4972031A (en) * 1988-10-05 1990-11-20 Imperial Chemical Industries Plc Plastic moulding composition comprising an uncured or partly cured thermoset resin precursor and a polyarylsulphone
US5326516A (en) * 1989-10-03 1994-07-05 Plasticolors, Inc. Method of preparing a cured pigmented thermosetting polymer composition exhibiting improved color values and reduced haze
JP3112938B2 (ja) * 1990-08-27 2000-11-27 イー・アイ・デユポン・ドウ・ヌムール・アンド・カンパニー 強化熱可塑性ポリエステル組成物
DE4140876C2 (de) * 1991-12-11 1994-04-21 Voith Gmbh J M Walzenpresse
US5443775A (en) * 1992-05-08 1995-08-22 Plasticolors, Inc. Process for preparing pigmented thermoplastic polymer compositions and low shrinking thermosetting resin molding composition
DE69323129T2 (de) * 1992-08-11 1999-08-19 Hexcel Corp. Mit Sulfonpolymeren zäher gemachte hitzehärtbare Harze

Also Published As

Publication number Publication date
KR960026681A (ko) 1996-07-22
NL9402233A (nl) 1996-08-01
CA2166043A1 (en) 1996-06-30
ES2133662T3 (es) 1999-09-16
US5895620A (en) 1999-04-20
MY131688A (en) 2007-08-30
JP3126104B2 (ja) 2001-01-22
DE69509739D1 (de) 1999-06-24
TW312843B (es) 1997-08-11
EP0720901B1 (en) 1999-05-19
RU2151447C1 (ru) 2000-06-20
JPH08274221A (ja) 1996-10-18
MX9600185A (es) 1997-01-31
DE69509739T2 (de) 1999-10-21
ATE180201T1 (de) 1999-06-15
EP0720901A1 (en) 1996-07-10

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