SG170827A1 - Grown nanofin transistors - Google Patents
Grown nanofin transistorsInfo
- Publication number
- SG170827A1 SG170827A1 SG201102381-9A SG2011023819A SG170827A1 SG 170827 A1 SG170827 A1 SG 170827A1 SG 2011023819 A SG2011023819 A SG 2011023819A SG 170827 A1 SG170827 A1 SG 170827A1
- Authority
- SG
- Singapore
- Prior art keywords
- surrounding gate
- semiconductor pillar
- fin
- drain region
- source
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
- H10D10/231—Tunnel BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/025—Manufacture or treatment of FETs having insulated gates [IGFET] of vertical IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/63—Vertical IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6728—Vertical TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6735—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes having gates fully surrounding the channels, e.g. gate-all-around
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H10D62/118—Nanostructure semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H10D62/118—Nanostructure semiconductor bodies
- H10D62/119—Nanowire, nanosheet or nanotube semiconductor bodies
- H10D62/121—Nanowire, nanosheet or nanotube semiconductor bodies oriented parallel to substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/05—Making the transistor
- H10B12/053—Making the transistor the transistor being at least partially in a trench in the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0411—Manufacture or treatment of FETs having insulated gates [IGFET] of FETs having floating gates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Thin Film Transistor (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Semiconductor Memories (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Recrystallisation Techniques (AREA)
- Electrodes Of Semiconductors (AREA)
- Non-Volatile Memory (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/397,430 US8734583B2 (en) | 2006-04-04 | 2006-04-04 | Grown nanofin transistors |
| US11/397,413 US7491995B2 (en) | 2006-04-04 | 2006-04-04 | DRAM with nanofin transistors |
| US11/397,406 US20070228491A1 (en) | 2006-04-04 | 2006-04-04 | Tunneling transistor with sublithographic channel |
| US11/397,358 US8354311B2 (en) | 2006-04-04 | 2006-04-04 | Method for forming nanofin transistors |
| US11/397,527 US7425491B2 (en) | 2006-04-04 | 2006-04-04 | Nanowire transistor with surrounding gate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG170827A1 true SG170827A1 (en) | 2011-05-30 |
Family
ID=38325217
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG201102381-9A SG170827A1 (en) | 2006-04-04 | 2007-04-03 | Grown nanofin transistors |
| SG2011038726A SG172643A1 (en) | 2006-04-04 | 2007-04-03 | Etched nanofin transistors |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2011038726A SG172643A1 (en) | 2006-04-04 | 2007-04-03 | Etched nanofin transistors |
Country Status (5)
| Country | Link |
|---|---|
| EP (4) | EP2002468B1 (enExample) |
| JP (4) | JP5229635B2 (enExample) |
| KR (5) | KR20090007393A (enExample) |
| SG (2) | SG170827A1 (enExample) |
| WO (4) | WO2007120492A1 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100790863B1 (ko) * | 2005-12-28 | 2008-01-03 | 삼성전자주식회사 | 나노 와이어 제조 방법 |
| US8734583B2 (en) | 2006-04-04 | 2014-05-27 | Micron Technology, Inc. | Grown nanofin transistors |
| US7425491B2 (en) | 2006-04-04 | 2008-09-16 | Micron Technology, Inc. | Nanowire transistor with surrounding gate |
| US7491995B2 (en) | 2006-04-04 | 2009-02-17 | Micron Technology, Inc. | DRAM with nanofin transistors |
| US8354311B2 (en) | 2006-04-04 | 2013-01-15 | Micron Technology, Inc. | Method for forming nanofin transistors |
| US8643087B2 (en) * | 2006-09-20 | 2014-02-04 | Micron Technology, Inc. | Reduced leakage memory cells |
| KR100945511B1 (ko) * | 2008-04-10 | 2010-03-09 | 주식회사 하이닉스반도체 | 반도체 소자 및 그의 제조방법 |
| US7897494B2 (en) * | 2008-06-24 | 2011-03-01 | Imec | Formation of single crystal semiconductor nanowires |
| DE102009024311A1 (de) * | 2009-06-05 | 2011-01-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Halbleiterbauelement und Verfahren zu seiner Herstellung |
| DE112011105979B4 (de) | 2011-12-20 | 2022-09-15 | Intel Corporation | Halbleiterbauelement mit isolierten Halbleiterkörperteilen und Herstellungsverfahren |
| KR20130131708A (ko) | 2012-05-24 | 2013-12-04 | 에스케이하이닉스 주식회사 | 메모리 셀 어레이 및 이를 포함하는 가변 저항 메모리 장치 |
| US9006810B2 (en) * | 2012-06-07 | 2015-04-14 | International Business Machines Corporation | DRAM with a nanowire access transistor |
| EP2674978B1 (en) * | 2012-06-15 | 2020-07-29 | IMEC vzw | Tunnel field effect transistor device and method for making the device |
| JP5595619B2 (ja) * | 2012-08-08 | 2014-09-24 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体装置の製造方法、及び、半導体装置 |
| KR20140040543A (ko) * | 2012-09-26 | 2014-04-03 | 삼성전자주식회사 | 핀 구조의 전계효과 트랜지스터, 이를 포함하는 메모리 장치 및 그 반도체 장치 |
| KR20140078326A (ko) * | 2012-12-17 | 2014-06-25 | 경북대학교 산학협력단 | 터널링 전계효과 트랜지스터 및 터널링 전계효과 트랜지스터의 제조 방법 |
| JP5886802B2 (ja) * | 2013-08-29 | 2016-03-16 | 株式会社東芝 | 半導体装置 |
| US9425296B2 (en) * | 2013-09-09 | 2016-08-23 | Qualcomm Incorporated | Vertical tunnel field effect transistor |
| US10727339B2 (en) | 2014-03-28 | 2020-07-28 | Intel Corporation | Selectively regrown top contact for vertical semiconductor devices |
| US9941394B2 (en) | 2014-04-30 | 2018-04-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Tunnel field-effect transistor |
| US9673209B2 (en) | 2014-05-16 | 2017-06-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Memory device and method for fabricating the same |
| CN106463350B (zh) * | 2014-06-13 | 2019-12-20 | 英特尔公司 | 通过选择性削减规则网格的垂直沟道晶体管制造工艺 |
| US9818877B2 (en) | 2014-09-18 | 2017-11-14 | International Business Machines Corporation | Embedded source/drain structure for tall finFET and method of formation |
| US10559690B2 (en) | 2014-09-18 | 2020-02-11 | International Business Machines Corporation | Embedded source/drain structure for tall FinFET and method of formation |
| US9634084B1 (en) | 2016-02-10 | 2017-04-25 | Globalfoundries Inc. | Conformal buffer layer in source and drain regions of fin-type transistors |
| US10186510B2 (en) * | 2017-05-01 | 2019-01-22 | Advanced Micro Devices, Inc. | Vertical gate all around library architecture |
| US10374041B2 (en) | 2017-12-21 | 2019-08-06 | International Business Machines Corporation | Field effect transistor with controllable resistance |
| KR102593708B1 (ko) * | 2018-08-14 | 2023-10-26 | 삼성전자주식회사 | 반도체 장치 및 반도체 장치의 제조 방법 |
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| US4941026A (en) * | 1986-12-05 | 1990-07-10 | General Electric Company | Semiconductor devices exhibiting minimum on-resistance |
| JPH07112067B2 (ja) * | 1990-01-24 | 1995-11-29 | 株式会社東芝 | 半導体装置 |
| US5013680A (en) * | 1990-07-18 | 1991-05-07 | Micron Technology, Inc. | Process for fabricating a DRAM array having feature widths that transcend the resolution limit of available photolithography |
| JP3202223B2 (ja) | 1990-11-27 | 2001-08-27 | 日本電気株式会社 | トランジスタの製造方法 |
| JP3219307B2 (ja) * | 1991-08-28 | 2001-10-15 | シャープ株式会社 | 半導体装置の構造および製造方法 |
| JPH05160408A (ja) * | 1991-12-04 | 1993-06-25 | Toshiba Corp | 電界効果トランジスタおよびこれを用いたダイナミック型半導体記憶装置 |
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| JP4047098B2 (ja) * | 1994-09-13 | 2008-02-13 | 株式会社東芝 | 半導体装置及びその製造方法 |
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| US6967140B2 (en) * | 2000-03-01 | 2005-11-22 | Intel Corporation | Quantum wire gate device and method of making same |
| US6413802B1 (en) * | 2000-10-23 | 2002-07-02 | The Regents Of The University Of California | Finfet transistor structures having a double gate channel extending vertically from a substrate and methods of manufacture |
| US6664143B2 (en) * | 2000-11-22 | 2003-12-16 | North Carolina State University | Methods of fabricating vertical field effect transistors by conformal channel layer deposition on sidewalls |
| US6531727B2 (en) * | 2001-02-09 | 2003-03-11 | Micron Technology, Inc. | Open bit line DRAM with ultra thin body transistors |
| FR2823009B1 (fr) * | 2001-04-02 | 2004-07-09 | St Microelectronics Sa | Procede de fabrication d'un transistor vertical a grille isolee a faible recouvrement de la grille sur la source et sur le drain, et circuit integre comportant un tel transistor |
| US20030008515A1 (en) * | 2001-07-03 | 2003-01-09 | Tai-Ju Chen | Method of fabricating a vertical MOS transistor |
| US6815750B1 (en) * | 2002-05-22 | 2004-11-09 | Hewlett-Packard Development Company, L.P. | Field effect transistor with channel extending through layers on a substrate |
| US6821834B2 (en) * | 2002-12-04 | 2004-11-23 | Yoshiyuki Ando | Ion implantation methods and transistor cell layout for fin type transistors |
| US6794718B2 (en) * | 2002-12-19 | 2004-09-21 | International Business Machines Corporation | High mobility crystalline planes in double-gate CMOS technology |
| JP4108537B2 (ja) * | 2003-05-28 | 2008-06-25 | 富士雄 舛岡 | 半導体装置 |
| US6855582B1 (en) * | 2003-06-12 | 2005-02-15 | Advanced Micro Devices, Inc. | FinFET gate formation using reverse trim and oxide polish |
| JP2005116969A (ja) * | 2003-10-10 | 2005-04-28 | Toshiba Corp | 半導体装置及びその製造方法 |
| US7348243B2 (en) * | 2003-12-27 | 2008-03-25 | Dongbu Electronics Co., Ltd. | Semiconductor device and method for fabricating the same |
| CN100570894C (zh) * | 2004-01-22 | 2009-12-16 | 国际商业机器公司 | 垂直鳍片场效应晶体管mos器件 |
| US7122425B2 (en) * | 2004-08-24 | 2006-10-17 | Micron Technology, Inc. | Methods of forming semiconductor constructions |
| US7242057B2 (en) * | 2004-08-26 | 2007-07-10 | Micron Technology, Inc. | Vertical transistor structures having vertical-surrounding-gates with self-aligned features |
| US7241655B2 (en) * | 2004-08-30 | 2007-07-10 | Micron Technology, Inc. | Method of fabricating a vertical wrap-around-gate field-effect-transistor for high density, low voltage logic and memory array |
| US7910288B2 (en) * | 2004-09-01 | 2011-03-22 | Micron Technology, Inc. | Mask material conversion |
| JP3764161B2 (ja) * | 2004-09-17 | 2006-04-05 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
| DE102005045078B4 (de) * | 2004-09-25 | 2009-01-22 | Samsung Electronics Co., Ltd., Suwon | Feldeffekttransistor mit einer verspannten Kanalschicht an Seitenwänden einer Struktur an einem Halbleitersubstrat |
-
2007
- 2007-04-03 EP EP07754621.6A patent/EP2002468B1/en not_active Not-in-force
- 2007-04-03 WO PCT/US2007/008123 patent/WO2007120492A1/en not_active Ceased
- 2007-04-03 JP JP2009504238A patent/JP5229635B2/ja active Active
- 2007-04-03 KR KR1020087026970A patent/KR20090007393A/ko not_active Withdrawn
- 2007-04-03 EP EP07809002.4A patent/EP2002470B1/en active Active
- 2007-04-03 KR KR1020147009477A patent/KR20140051463A/ko not_active Ceased
- 2007-04-03 EP EP07754850A patent/EP2008309A1/en not_active Ceased
- 2007-04-03 JP JP2009504239A patent/JP2009532905A/ja not_active Withdrawn
- 2007-04-03 SG SG201102381-9A patent/SG170827A1/en unknown
- 2007-04-03 JP JP2009504280A patent/JP5234439B2/ja active Active
- 2007-04-03 SG SG2011038726A patent/SG172643A1/en unknown
- 2007-04-03 WO PCT/US2007/008124 patent/WO2007120493A1/en not_active Ceased
- 2007-04-03 KR KR1020087027075A patent/KR20090006169A/ko not_active Ceased
- 2007-04-03 WO PCT/US2007/008400 patent/WO2007114927A1/en not_active Ceased
- 2007-04-03 WO PCT/US2007/008084 patent/WO2007136461A2/en not_active Ceased
- 2007-04-03 EP EP07754622A patent/EP2002469A1/en not_active Withdrawn
- 2007-04-03 JP JP2009504232A patent/JP5229587B2/ja active Active
-
2008
- 2008-11-03 KR KR1020087026973A patent/KR101474028B1/ko active Active
- 2008-11-04 KR KR1020087027077A patent/KR101378256B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009532905A (ja) | 2009-09-10 |
| JP2009532903A (ja) | 2009-09-10 |
| KR20090006169A (ko) | 2009-01-14 |
| KR20090007397A (ko) | 2009-01-16 |
| SG172643A1 (en) | 2011-07-28 |
| KR101474028B1 (ko) | 2014-12-17 |
| WO2007120493A1 (en) | 2007-10-25 |
| JP5234439B2 (ja) | 2013-07-10 |
| EP2002469A1 (en) | 2008-12-17 |
| WO2007136461A2 (en) | 2007-11-29 |
| WO2007136461A3 (en) | 2008-01-17 |
| KR101378256B1 (ko) | 2014-03-25 |
| JP2009532907A (ja) | 2009-09-10 |
| KR20140051463A (ko) | 2014-04-30 |
| WO2007114927A1 (en) | 2007-10-11 |
| KR20090005149A (ko) | 2009-01-12 |
| EP2008309A1 (en) | 2008-12-31 |
| EP2002470A2 (en) | 2008-12-17 |
| EP2002468B1 (en) | 2013-07-24 |
| JP5229635B2 (ja) | 2013-07-03 |
| EP2002470B1 (en) | 2016-03-09 |
| WO2007120492A1 (en) | 2007-10-25 |
| KR20090007393A (ko) | 2009-01-16 |
| JP5229587B2 (ja) | 2013-07-03 |
| EP2002468A1 (en) | 2008-12-17 |
| JP2009532904A (ja) | 2009-09-10 |
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