SG170663A1 - Method for polishing a semiconductor wafer - Google Patents

Method for polishing a semiconductor wafer

Info

Publication number
SG170663A1
SG170663A1 SG201006281-8A SG2010062818A SG170663A1 SG 170663 A1 SG170663 A1 SG 170663A1 SG 2010062818 A SG2010062818 A SG 2010062818A SG 170663 A1 SG170663 A1 SG 170663A1
Authority
SG
Singapore
Prior art keywords
polishing
semiconductor wafer
polished
carrier
polishing pad
Prior art date
Application number
SG201006281-8A
Other languages
English (en)
Inventor
Juergen Schwandner
Thomas Buschhardt
Roland Koppert
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of SG170663A1 publication Critical patent/SG170663A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG201006281-8A 2009-10-28 2010-08-30 Method for polishing a semiconductor wafer SG170663A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009051007A DE102009051007B4 (de) 2009-10-28 2009-10-28 Verfahren zum Polieren einer Halbleiterscheibe

Publications (1)

Publication Number Publication Date
SG170663A1 true SG170663A1 (en) 2011-05-30

Family

ID=43828687

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201006281-8A SG170663A1 (en) 2009-10-28 2010-08-30 Method for polishing a semiconductor wafer

Country Status (6)

Country Link
US (2) US20110097974A1 (zh)
JP (2) JP2011103460A (zh)
CN (1) CN102049723B (zh)
DE (1) DE102009051007B4 (zh)
SG (1) SG170663A1 (zh)
TW (1) TWI421934B (zh)

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CN102294649A (zh) * 2011-09-07 2011-12-28 清华大学 化学机械抛光方法
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CN103203681B (zh) * 2013-04-07 2015-04-29 大连理工大学 一种ii-vi族软脆晶体研磨抛光方法
JP6696756B2 (ja) * 2014-11-13 2020-05-20 富士紡ホールディングス株式会社 保持具及びその製造方法
JP6447472B2 (ja) 2015-11-26 2019-01-09 株式会社Sumco ウェーハ研磨方法
CN106992112A (zh) * 2016-01-21 2017-07-28 苏州新美光纳米科技有限公司 超薄晶片的抛光方法
CN106584227A (zh) * 2016-12-01 2017-04-26 大连液压件有限公司 工件单面加工装置及工艺
JP7046495B2 (ja) * 2017-03-27 2022-04-04 富士紡ホールディングス株式会社 保持具及び保持具の製造方法
CN109129028B (zh) * 2017-06-15 2021-11-12 北京天科合达半导体股份有限公司 一种高效的碳化硅晶片的加工方法
CN107139067A (zh) * 2017-07-14 2017-09-08 青岛嘉星晶电科技股份有限公司 一种控制蓝宝石晶片抛光ttv/ltv的方法及装置
CN107498462A (zh) * 2017-07-31 2017-12-22 安庆市晶科电子有限公司 一种具有弹性限位机构的晶体生产用治具
JP6822432B2 (ja) * 2018-02-23 2021-01-27 株式会社Sumco ウェーハの片面研磨方法
JP6947135B2 (ja) * 2018-04-25 2021-10-13 信越半導体株式会社 研磨装置、ウェーハの研磨方法、及び、ウェーハの製造方法
CN109397070A (zh) * 2018-10-24 2019-03-01 中国科学院上海技术物理研究所 一种磷化铟晶圆片及其外延晶圆片的衬底抛光模具
CN114260820A (zh) * 2021-12-30 2022-04-01 西安奕斯伟材料科技有限公司 一种抛光头和抛光设备

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Also Published As

Publication number Publication date
CN102049723A (zh) 2011-05-11
TWI421934B (zh) 2014-01-01
JP2011103460A (ja) 2011-05-26
JP2013214784A (ja) 2013-10-17
DE102009051007B4 (de) 2011-12-22
TW201117281A (en) 2011-05-16
US8647173B2 (en) 2014-02-11
DE102009051007A1 (de) 2011-05-05
CN102049723B (zh) 2013-08-14
US20130189904A1 (en) 2013-07-25
US20110097974A1 (en) 2011-04-28

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