SG169933A1 - Method for polishing semiconductor wafers - Google Patents

Method for polishing semiconductor wafers

Info

Publication number
SG169933A1
SG169933A1 SG201005449-2A SG2010054492A SG169933A1 SG 169933 A1 SG169933 A1 SG 169933A1 SG 2010054492 A SG2010054492 A SG 2010054492A SG 169933 A1 SG169933 A1 SG 169933A1
Authority
SG
Singapore
Prior art keywords
polishing
semiconductor wafers
polishing semiconductor
agent
polishing agent
Prior art date
Application number
SG201005449-2A
Inventor
Juergen Schwandner
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of SG169933A1 publication Critical patent/SG169933A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D15/00—Hand tools or other devices for non-rotary grinding, polishing, or stropping
    • B24D15/06—Hand tools or other devices for non-rotary grinding, polishing, or stropping specially designed for sharpening cutting edges

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A method for polishing semiconductor wafers using a polishing pad containing an abrasive substance bonded in the polishing pad, and with an alkaline polishing agent being supplied, wherein a volumetric flow rate of the polishing agent is greater than or equal to 5 liters/min and the polishing agent is circulated in a polishing agent circuit during polishing.
SG201005449-2A 2009-10-01 2010-07-28 Method for polishing semiconductor wafers SG169933A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009047926A DE102009047926A1 (en) 2009-10-01 2009-10-01 Process for polishing semiconductor wafers

Publications (1)

Publication Number Publication Date
SG169933A1 true SG169933A1 (en) 2011-04-29

Family

ID=43734504

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201005449-2A SG169933A1 (en) 2009-10-01 2010-07-28 Method for polishing semiconductor wafers

Country Status (7)

Country Link
US (1) US20110081840A1 (en)
JP (1) JP2011077525A (en)
KR (1) KR20110036497A (en)
CN (1) CN102034697A (en)
DE (1) DE102009047926A1 (en)
SG (1) SG169933A1 (en)
TW (1) TW201113944A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8739806B2 (en) 2011-05-11 2014-06-03 Nanya Technology Corp. Chemical mechanical polishing system
US8662963B2 (en) * 2011-05-12 2014-03-04 Nanya Technology Corp. Chemical mechanical polishing system
JP5716612B2 (en) * 2011-09-01 2015-05-13 信越半導体株式会社 Silicon wafer polishing method and polishing apparatus
JP2013184276A (en) * 2012-03-09 2013-09-19 Disco Corp Tool cutting method
JP6052004B2 (en) 2013-03-27 2016-12-27 富士通株式会社 Terminal device and terminal control program
KR102070452B1 (en) 2019-06-14 2020-02-03 최재용 Food waste processing apparatus for restaurants
JP7236990B2 (en) * 2019-12-09 2023-03-10 株式会社荏原製作所 System and polishing equipment for adjusting the surface temperature of the pad
KR20210152099A (en) 2020-06-05 2021-12-15 박성근 Food waste disposal equipment

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5152917B1 (en) * 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
US5310455A (en) * 1992-07-10 1994-05-10 Lsi Logic Corporation Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers
JP2971714B2 (en) * 1993-10-01 1999-11-08 住友金属工業株式会社 Mirror polishing method for semiconductor substrate
US5664990A (en) * 1996-07-29 1997-09-09 Integrated Process Equipment Corp. Slurry recycling in CMP apparatus
JP3341601B2 (en) * 1996-10-18 2002-11-05 日本電気株式会社 Method and apparatus for collecting and reusing abrasives
JPH11151659A (en) * 1997-11-20 1999-06-08 Sony Corp Polishing pad, chemomechanical polishing method, and hcemomechanical polishing device
JPH11277434A (en) * 1998-03-30 1999-10-12 Speedfam Co Ltd Slurry recycle system for cmp device and method therefor
US6036586A (en) * 1998-07-29 2000-03-14 Micron Technology, Inc. Apparatus and method for reducing removal forces for CMP pads
JP3858462B2 (en) * 1998-07-30 2006-12-13 株式会社日立製作所 Manufacturing method of semiconductor device
JP3538042B2 (en) * 1998-11-24 2004-06-14 松下電器産業株式会社 Slurry supply device and slurry supply method
US6299514B1 (en) * 1999-03-13 2001-10-09 Peter Wolters Werkzeugmachinen Gmbh Double-disk polishing machine, particularly for tooling semiconductor wafers
DE10007390B4 (en) 1999-03-13 2008-11-13 Peter Wolters Gmbh Two-disc polishing machine, in particular for processing semiconductor wafers
JP2001088020A (en) * 1999-09-22 2001-04-03 Speedfam Co Ltd Polishing method and device for workpiece
US6558238B1 (en) * 2000-09-19 2003-05-06 Agere Systems Inc. Apparatus and method for reclamation of used polishing slurry
JP2002178261A (en) * 2000-12-13 2002-06-25 Ebara Corp Abrasive fluid supply device, additive replenishing method to abrasive fluid supply device and polishing deice
JP2002252189A (en) * 2001-02-26 2002-09-06 Mitsubishi Materials Silicon Corp Polishing liquid for semiconductor wafer
DE10132504C1 (en) 2001-07-05 2002-10-10 Wacker Siltronic Halbleitermat Method for simultaneously polishing both sides of semiconductor wafer mounted on cogwheel between central cogwheel and annulus uses upper and lower polishing wheel
JP4608856B2 (en) * 2003-07-24 2011-01-12 信越半導体株式会社 Wafer polishing method
JP2005205544A (en) * 2004-01-22 2005-08-04 Ebara Corp Method of manufacturing grinding wheel, grinding wheel and polishing device having this grinding wheel
US20050227590A1 (en) 2004-04-09 2005-10-13 Chien-Min Sung Fixed abrasive tools and associated methods
JP4601445B2 (en) * 2004-06-21 2010-12-22 富士通セミコンダクター株式会社 Abrasive supply method
JP5196709B2 (en) * 2005-04-19 2013-05-15 株式会社荏原製作所 Semiconductor wafer peripheral polishing apparatus and method
WO2009002124A1 (en) * 2007-06-27 2008-12-31 Kolon Industries, Inc Polishing pad and method of manufacturing the same
DE102007035266B4 (en) * 2007-07-27 2010-03-25 Siltronic Ag A method of polishing a substrate of silicon or an alloy of silicon and germanium
JP5163078B2 (en) * 2007-11-29 2013-03-13 株式会社Ｓｕｍｃｏ Polishing apparatus and method

Also Published As

Publication number Publication date
DE102009047926A1 (en) 2011-04-14
TW201113944A (en) 2011-04-16
CN102034697A (en) 2011-04-27
JP2011077525A (en) 2011-04-14
US20110081840A1 (en) 2011-04-07
KR20110036497A (en) 2011-04-07

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