SG160334A1 - Epoxy resin, hardenable resin composition containing the same and use thereof - Google Patents

Epoxy resin, hardenable resin composition containing the same and use thereof

Info

Publication number
SG160334A1
SG160334A1 SG201001206-0A SG2010012060A SG160334A1 SG 160334 A1 SG160334 A1 SG 160334A1 SG 2010012060 A SG2010012060 A SG 2010012060A SG 160334 A1 SG160334 A1 SG 160334A1
Authority
SG
Singapore
Prior art keywords
epoxy resin
resin composition
excelling
low dielectric
heat resistance
Prior art date
Application number
SG201001206-0A
Other languages
English (en)
Inventor
Masataka Nakanishi
Yasumasa Akatsuka
Katsuhiko Oshimi
Takao Sunaga
Original Assignee
Nippon Kayaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kk filed Critical Nippon Kayaku Kk
Publication of SG160334A1 publication Critical patent/SG160334A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
SG201001206-0A 2005-02-25 2006-02-20 Epoxy resin, hardenable resin composition containing the same and use thereof SG160334A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005051150 2005-02-25
JP2005051959 2005-02-25

Publications (1)

Publication Number Publication Date
SG160334A1 true SG160334A1 (en) 2010-04-29

Family

ID=36927302

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201001206-0A SG160334A1 (en) 2005-02-25 2006-02-20 Epoxy resin, hardenable resin composition containing the same and use thereof

Country Status (8)

Country Link
EP (1) EP1852451A1 (ja)
JP (1) JP5180583B2 (ja)
KR (1) KR101229854B1 (ja)
CN (1) CN101128501B (ja)
CA (1) CA2599153A1 (ja)
SG (1) SG160334A1 (ja)
TW (1) TWI387608B (ja)
WO (1) WO2006090662A1 (ja)

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WO2007049422A1 (ja) * 2005-10-25 2007-05-03 Mitsubishi Gas Chemical Company, Inc. シアン酸エステル重合体
CN103342877B (zh) * 2006-04-28 2016-05-04 日立化成工业株式会社 树脂组合物、预渍体、层叠板及布线板
JP4926811B2 (ja) * 2006-04-28 2012-05-09 日立化成工業株式会社 樹脂組成物、プリプレグ、積層板及び配線板
JP2008074934A (ja) * 2006-09-20 2008-04-03 Mitsubishi Gas Chem Co Inc プリプレグの製造方法
CN101583489A (zh) 2007-01-16 2009-11-18 住友电木株式会社 绝缘树脂片层叠体、层叠该绝缘树脂片层叠体而成的多层印刷布线板
MY148660A (en) 2007-04-10 2013-05-15 Sumitomo Bakelite Co Resin composition, prepreg, laminated board, multilayer printed wiring board and semiconductor device
KR101047924B1 (ko) * 2007-12-28 2011-07-08 주식회사 엘지화학 경화 조성물 및 이를 이용하여 제조된 경화물
CN102209742B (zh) * 2008-11-06 2013-03-27 日本化药株式会社 酚醛树脂混合物、环氧树脂混合物、环氧树脂组合物及固化物
JP5263134B2 (ja) * 2009-12-07 2013-08-14 住友ベークライト株式会社 回路基板用樹脂組成物、プリプレグ、積層板、樹脂シート、多層プリント配線板および半導体装置
TWI421269B (zh) * 2009-12-29 2014-01-01 Swancor Ind Co Ltd Epoxy resin composition
KR20130127444A (ko) * 2010-10-29 2013-11-22 미츠비시 가스 가가쿠 가부시키가이샤 시안산에스테르 화합물, 시안산에스테르 화합물을 함유하는 경화성 수지 조성물, 및 그 경화물
JP5950127B2 (ja) 2011-08-09 2016-07-13 三菱瓦斯化学株式会社 新規なシアン酸エステル化合物及びその製造方法、並びに該化合物を含む硬化性樹脂組成物及びその硬化物
KR101969191B1 (ko) * 2011-12-07 2019-04-15 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그 및 적층판
JP2014005375A (ja) * 2012-06-25 2014-01-16 Mitsubishi Chemicals Corp エポキシ樹脂、エポキシ樹脂組成物及び硬化物
KR101350997B1 (ko) * 2012-08-21 2014-01-14 주식회사 신아티앤씨 전기적 특성이 우수한 에폭시 화합물 및 그 제조방법
JP5708612B2 (ja) * 2012-10-16 2015-04-30 三菱瓦斯化学株式会社 プリプレグの製造方法
CN102942834B (zh) * 2012-11-09 2016-01-20 太原科技大学 一种防腐蚀用涂料的制备方法
US20160108230A1 (en) * 2013-05-30 2016-04-21 Shengyi Technology Co., Ltd. Cyanate resin composition and use thereof
CN105612190B (zh) * 2013-10-09 2017-11-10 日本化药株式会社 酚树脂、环氧树脂、环氧树脂组合物、预浸料及它们的固化物
WO2015119196A1 (ja) * 2014-02-07 2015-08-13 日本化薬株式会社 エポキシ樹脂混合物、エポキシ樹脂組成物、その硬化物、および半導体装置
JP6493287B2 (ja) * 2015-05-20 2019-04-03 信越化学工業株式会社 液状樹脂組成物
WO2016203829A1 (ja) * 2015-06-17 2016-12-22 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、樹脂シート、金属箔張積層板及びプリント配線板
CN108474119B (zh) * 2016-03-09 2020-01-14 日本制铁株式会社 表面处理钢板以及表面处理钢板的制造方法
WO2018088469A1 (ja) * 2016-11-11 2018-05-17 住友ベークライト株式会社 感光性樹脂組成物、樹脂膜、硬化膜、半導体装置の製造方法、および半導体装置
WO2019013040A1 (ja) * 2017-07-10 2019-01-17 Dic株式会社 積層体、それを用いたプリント配線板、フレキシブルプリント配線板及び成形品
JPWO2019198378A1 (ja) * 2018-04-13 2021-02-12 株式会社Moresco 化合物およびその利用
KR102133400B1 (ko) 2018-12-13 2020-07-14 주식회사 제일화성 내수성이 우수한 섬유 함침용 에폭시 수지 조성물
CN114577331B (zh) * 2019-12-23 2024-04-12 成都高斯电子技术有限公司 一种传感器制备液在电缆缺陷治理中的应用

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JPH09268219A (ja) * 1996-03-29 1997-10-14 Nippon Kayaku Co Ltd ノボラック型樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP2001089550A (ja) * 1999-09-21 2001-04-03 Nippon Kayaku Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP4104107B2 (ja) * 2000-10-05 2008-06-18 日本化薬株式会社 エポキシ樹脂組成物及びその用途
JP4738622B2 (ja) * 2001-04-13 2011-08-03 住友ベークライト株式会社 耐熱性樹脂組成物、これを用いたプリプレグ及び積層板
JP4502195B2 (ja) * 2004-08-27 2010-07-14 日本化薬株式会社 液状エポキシ樹脂、それを含むエポキシ樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
CN101128501B (zh) 2010-12-08
KR20070108384A (ko) 2007-11-09
WO2006090662A1 (ja) 2006-08-31
JP5180583B2 (ja) 2013-04-10
TWI387608B (zh) 2013-03-01
TW200640976A (en) 2006-12-01
KR101229854B1 (ko) 2013-02-05
CA2599153A1 (en) 2006-08-31
EP1852451A1 (en) 2007-11-07
CN101128501A (zh) 2008-02-20
JPWO2006090662A1 (ja) 2008-07-24

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