SG157958A1 - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
SG157958A1
SG157958A1 SG200700722-2A SG2007007222A SG157958A1 SG 157958 A1 SG157958 A1 SG 157958A1 SG 2007007222 A SG2007007222 A SG 2007007222A SG 157958 A1 SG157958 A1 SG 157958A1
Authority
SG
Singapore
Prior art keywords
epoxy resin
resin composition
molecular weight
polyphenylene ether
epoxy
Prior art date
Application number
SG200700722-2A
Other languages
English (en)
Inventor
Hiroshi Uchida
Kenzo Onizuka
Yoshihiko Takada
Tetsuji Tokiwa
Original Assignee
Asahi Kasei Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Chemicals Corp filed Critical Asahi Kasei Chemicals Corp
Publication of SG157958A1 publication Critical patent/SG157958A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48—Polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
SG200700722-2A 2003-05-22 2004-05-21 Epoxy resin composition SG157958A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003145423 2003-05-22

Publications (1)

Publication Number Publication Date
SG157958A1 true SG157958A1 (en) 2010-01-29

Family

ID=33475237

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200700722-2A SG157958A1 (en) 2003-05-22 2004-05-21 Epoxy resin composition

Country Status (8)

Country Link
US (1) US20070093614A1 (zh)
EP (1) EP1630199A4 (zh)
JP (1) JP4413190B2 (zh)
KR (1) KR100709149B1 (zh)
CN (1) CN1795238B (zh)
SG (1) SG157958A1 (zh)
TW (1) TWI313284B (zh)
WO (1) WO2004104097A1 (zh)

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PL1716201T3 (pl) * 2004-02-18 2017-08-31 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Kompozycja obniżająca palność z zastosowaniem siloksanów
JP4679201B2 (ja) * 2005-03-29 2011-04-27 旭化成ケミカルズ株式会社 熱可塑性樹脂組成物
US7429800B2 (en) 2005-06-30 2008-09-30 Sabic Innovative Plastics Ip B.V. Molding composition and method, and molded article
US7378455B2 (en) 2005-06-30 2008-05-27 General Electric Company Molding composition and method, and molded article
JP4679388B2 (ja) * 2006-02-20 2011-04-27 パナック株式会社 離型性を有する積層体およびその製造方法
WO2007097231A1 (ja) 2006-02-21 2007-08-30 Asahi Kasei Chemicals Corporation 低分子量ポリフェニレンエーテルの製造方法
US7655278B2 (en) 2007-01-30 2010-02-02 Sabic Innovative Plastics Ip B.V. Composite-forming method, composites formed thereby, and printed circuit boards incorporating them
JP5192198B2 (ja) * 2007-08-22 2013-05-08 旭化成イーマテリアルズ株式会社 多官能エポキシ化ポリフェニレンエーテル樹脂及びその製造方法
CN102083886A (zh) * 2007-09-20 2011-06-01 日本化药株式会社 半导体装置用底漆树脂层及半导体装置
KR100962936B1 (ko) 2007-12-20 2010-06-09 제일모직주식회사 반도체 조립용 접착 필름 조성물 및 접착 필름
JP2010031087A (ja) * 2008-07-25 2010-02-12 Asahi Kasei E-Materials Corp 繊維基材用含浸材、プリプレグ及び繊維強化複合材料
JP5469320B2 (ja) * 2008-08-26 2014-04-16 パナソニック株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板
CN102361903B (zh) * 2009-03-26 2013-08-28 松下电器产业株式会社 环氧树脂组合物、预浸料、树脂涂覆的金属箔、树脂片、层压板和多层板
CN101560322B (zh) * 2009-04-30 2011-12-21 苏州大学 聚苯醚包覆环氧树脂微胶囊及其制备方法
CN102405266B (zh) * 2009-05-13 2014-07-16 日立化成工业株式会社 粘接片
JP5265449B2 (ja) * 2009-05-26 2013-08-14 パナソニック株式会社 樹脂組成物、樹脂組成物の製造方法、プリプレグ、金属張積層板、及びプリント配線板
JP5644249B2 (ja) * 2010-08-12 2014-12-24 日立金属株式会社 熱可塑性樹脂組成物および接着フィルム、並びにそれを用いた配線フィルム
CN102153590B (zh) * 2011-01-21 2013-06-12 华南理工大学 双环笼状磷酸酯硅氧烷阻燃剂及其制备方法
TW201307470A (zh) 2011-05-27 2013-02-16 Taiyo Ink Mfg Co Ltd 熱硬化性樹脂組成物、乾燥膜及印刷配線板
US8859672B2 (en) * 2011-06-27 2014-10-14 Sabic Global Technologies B.V. Poly(arylene ether)-poly(hydroxy ether) block copolymer and method of making
CN103717635B (zh) * 2011-07-19 2016-01-20 松下知识产权经营株式会社 树脂组合物、树脂清漆、预浸料、覆金属层压板及印刷线路板
TWI428390B (zh) 2011-10-21 2014-03-01 Ind Tech Res Inst 低介電樹脂配方、預聚合物、組成物及其複合材料與低介電樹脂預聚合物溶液的製備方法
CN102516530B (zh) * 2011-12-08 2014-03-12 中山台光电子材料有限公司 一种环氧基改质聚苯醚树脂、树脂组合物及其应用
US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9023922B2 (en) 2012-05-24 2015-05-05 Sabic Global Technologies B.V. Flame retardant compositions, articles comprising the same and methods of manufacture thereof
US9394483B2 (en) 2012-05-24 2016-07-19 Sabic Global Technologies B.V. Flame retardant polycarbonate compositions, methods of manufacture thereof and articles comprising the same
KR101476895B1 (ko) * 2012-12-26 2014-12-26 주식회사 두산 수지 조성물 및 이를 포함하는 금속박 적층체
KR20160043975A (ko) * 2013-08-16 2016-04-22 다우 글로벌 테크놀로지스 엘엘씨 1k 열경화성 에폭시 조성물
TWI557155B (zh) 2013-11-20 2016-11-11 Asahi Kasei E Materials Corp And a cured product of a resin composition containing a polyphenyl ether
JP5793641B2 (ja) * 2014-01-30 2015-10-14 パナソニックＩｐマネジメント株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板
WO2016081063A1 (en) * 2014-11-19 2016-05-26 Sabic Global Technologies B.V. Particulate poly(phenylene ether)-containing varnish composition, composite and laminate prepared therefrom, and method of forming composite
CN110191921B (zh) 2017-01-10 2022-04-26 住友精化株式会社 环氧树脂组合物
EP3569626B1 (en) * 2017-01-10 2023-03-01 Sumitomo Seika Chemicals Co., Ltd. Epoxy resin composition
EP3567066A1 (en) * 2018-05-08 2019-11-13 SABIC Global Technologies B.V. Curable epoxy composition and circiut material prepreg, thermoset epoxy composition, and article prepared therefrom

Citations (5)

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JPS5884844A (ja) * 1981-11-16 1983-05-21 Asahi Shiyueebell Kk 樹脂組成物
EP0304125A2 (en) * 1987-08-19 1989-02-22 Shell Internationale Researchmaatschappij B.V. Heat-hardenable compositions based on polyglycidyl ethers and polyhydric phenols, halogenated tetraphenols, polyglycidyl ethers and process for preparing tetraphenols
JPH09235349A (ja) * 1995-12-26 1997-09-09 Matsushita Electric Works Ltd エポキシ樹脂組成物、この樹脂組成物を用いたプリプレグ 、及びこのプリプレグを用いた積層板
JP2001261791A (ja) * 2000-03-23 2001-09-26 Matsushita Electric Works Ltd エポキシ樹脂組成物、プリプレグ及び積層板
JP2002220436A (ja) * 2001-01-26 2002-08-09 Matsushita Electric Works Ltd エポキシ樹脂組成物及びプリプレグ及び樹脂付き金属箔並びに積層板

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JP4674988B2 (ja) * 2001-04-13 2011-04-20 旭化成エポキシ株式会社 オキサゾリドン環含有エポキシ樹脂
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JP3794991B2 (ja) * 2001-08-08 2006-07-12 旭化成エポキシ株式会社 エポキシ樹脂組成物
TWI227249B (en) * 2001-09-20 2005-02-01 Asahi Kasei Chemicals Corp Functionalized polyphenylene ether
JP2003292570A (ja) * 2002-03-29 2003-10-15 Mitsubishi Gas Chem Co Inc 積層板用エポキシ樹脂組成物
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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5884844A (ja) * 1981-11-16 1983-05-21 Asahi Shiyueebell Kk 樹脂組成物
EP0304125A2 (en) * 1987-08-19 1989-02-22 Shell Internationale Researchmaatschappij B.V. Heat-hardenable compositions based on polyglycidyl ethers and polyhydric phenols, halogenated tetraphenols, polyglycidyl ethers and process for preparing tetraphenols
JPH09235349A (ja) * 1995-12-26 1997-09-09 Matsushita Electric Works Ltd エポキシ樹脂組成物、この樹脂組成物を用いたプリプレグ 、及びこのプリプレグを用いた積層板
JP2001261791A (ja) * 2000-03-23 2001-09-26 Matsushita Electric Works Ltd エポキシ樹脂組成物、プリプレグ及び積層板
JP2002220436A (ja) * 2001-01-26 2002-08-09 Matsushita Electric Works Ltd エポキシ樹脂組成物及びプリプレグ及び樹脂付き金属箔並びに積層板

Also Published As

Publication number Publication date
KR20060012638A (ko) 2006-02-08
TW200426190A (en) 2004-12-01
EP1630199A1 (en) 2006-03-01
WO2004104097A1 (ja) 2004-12-02
TWI313284B (en) 2009-08-11
US20070093614A1 (en) 2007-04-26
KR100709149B1 (ko) 2007-04-18
EP1630199A4 (en) 2006-05-17
JP4413190B2 (ja) 2010-02-10
CN1795238B (zh) 2010-06-16
JPWO2004104097A1 (ja) 2006-07-20
CN1795238A (zh) 2006-06-28

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