SG152220A1 - Soldering process - Google Patents

Soldering process

Info

Publication number
SG152220A1
SG152220A1 SG200902277-3A SG2009022773A SG152220A1 SG 152220 A1 SG152220 A1 SG 152220A1 SG 2009022773 A SG2009022773 A SG 2009022773A SG 152220 A1 SG152220 A1 SG 152220A1
Authority
SG
Singapore
Prior art keywords
solder
metal oxide
soldering
layer
bath
Prior art date
Application number
SG200902277-3A
Other languages
English (en)
Inventor
Lawrence C Kay
Erik J Severin
Luis A Aguirre
Original Assignee
P Kay Metal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by P Kay Metal Inc filed Critical P Kay Metal Inc
Publication of SG152220A1 publication Critical patent/SG152220A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture And Refinement Of Metals (AREA)
SG200902277-3A 2004-04-16 2005-04-18 Soldering process SG152220A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US56296404P 2004-04-16 2004-04-16
US60958904P 2004-09-14 2004-09-14

Publications (1)

Publication Number Publication Date
SG152220A1 true SG152220A1 (en) 2009-05-29

Family

ID=35107043

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200902277-3A SG152220A1 (en) 2004-04-16 2005-04-18 Soldering process

Country Status (13)

Country Link
EP (1) EP1748864B1 (https=)
JP (1) JP5021460B2 (https=)
KR (1) KR101297611B1 (https=)
AU (1) AU2005243743A1 (https=)
BR (1) BRPI0509932A (https=)
CA (1) CA2563385C (https=)
HU (1) HUE033419T2 (https=)
IL (1) IL178640A (https=)
MX (1) MXPA06011954A (https=)
PL (1) PL1748864T3 (https=)
RU (1) RU2372175C2 (https=)
SG (1) SG152220A1 (https=)
WO (1) WO2005110657A2 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2926233B1 (fr) * 2008-01-10 2010-08-13 Air Liquide Dispositif d'alimentation en gaz d'une machine de brasage ou etamage a la vague.
JP4375485B2 (ja) * 2008-02-22 2009-12-02 日本ジョイント株式会社 鉛フリーはんだ合金の製造方法及び半導体装置の製造方法
JP4375491B1 (ja) * 2008-06-23 2009-12-02 日本ジョイント株式会社 電子部品のはんだ付け装置およびはんだ付け方法
WO2011022514A1 (en) 2009-08-18 2011-02-24 Ms2 Technologies, Llc Tool for removing solder dross with a receptacle and a lift; method of treating solder dross using such tool
JP6310894B2 (ja) * 2015-09-30 2018-04-11 株式会社タムラ製作所 はんだ組成物および電子基板の製造方法
JP6460198B1 (ja) 2017-10-11 2019-01-30 千住金属工業株式会社 フラックス及びソルダペースト
JP6540789B1 (ja) * 2017-12-29 2019-07-10 千住金属工業株式会社 樹脂組成物及びはんだ付け用フラックス
JP6540788B1 (ja) * 2017-12-29 2019-07-10 千住金属工業株式会社 フラックス及びソルダペースト
JP6501003B1 (ja) * 2018-01-17 2019-04-17 千住金属工業株式会社 はんだ付け用樹脂組成物、やに入りはんだ、フラックスコートはんだ及び液状フラックス
JP6540833B1 (ja) * 2018-01-17 2019-07-10 千住金属工業株式会社 フラックス及びソルダペースト
CN108471678B (zh) * 2018-04-13 2019-02-22 荆门紫菘电子有限公司 一种电子焊接用单片机基座安装装置
CN113977963B (zh) * 2021-12-02 2022-11-29 山东润德复合材料有限公司 一种基于土工格栅的焊接装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3058441A (en) * 1956-10-02 1962-10-16 Sanders Associates Inc Soldering apparatus and method of soldering electrical conductors
US3445919A (en) * 1968-07-11 1969-05-27 Electronic Eng Co California Method of using a solder contact fluid
US3755886A (en) * 1971-10-22 1973-09-04 Magnavox Co Method for soldering electrical conductors
SU408736A1 (https=) * 1972-03-20 1973-11-30
JPS5276250A (en) * 1975-12-23 1977-06-27 Yoshio Tobari Antioxidant for solder
SU578170A1 (ru) * 1976-06-18 1977-10-30 Уфимский Приборостроительный Завод Им.В.И.Ленина Устройство дл пайки струей припо
US4171761A (en) * 1978-03-20 1979-10-23 Rockwell International Corporation Wave solder apparatus
SU969487A1 (ru) * 1980-07-25 1982-10-30 Предприятие П/Я В-8525 Жидкость дл защиты припо от окислени
CH660145A5 (de) * 1983-07-15 1987-03-31 Landis & Gyr Ag Verfahren zum schutz der oberflaeche eines loetbads.
US4495007A (en) * 1984-03-12 1985-01-22 At&T Technologies, Inc. Soldering flux
RU2116172C1 (ru) * 1995-12-27 1998-07-27 Московский государственный технический университет гражданской авиации Способ увеличения эксплуатационных свойств изделий авионики
JPH10163617A (ja) * 1996-11-26 1998-06-19 Sony Corp はんだドロスの還元方法および還元装置
JP2001320162A (ja) * 1998-02-27 2001-11-16 Matsushita Electric Ind Co Ltd はんだ回収装置と酸化物の除去方法
DE69939072D1 (de) * 1998-02-27 2008-08-21 Matsushita Electric Industrial Co Ltd Verfahren zum Trennen des Lötmaterials von der Oxidlötung
JP2001068848A (ja) * 1999-08-24 2001-03-16 Furukawa Electric Co Ltd:The 半田組成物およびそれを用いた半田供給方法

Also Published As

Publication number Publication date
EP1748864B1 (en) 2017-06-07
HUE033419T2 (en) 2017-11-28
CA2563385C (en) 2012-02-21
MXPA06011954A (es) 2007-03-26
WO2005110657A3 (en) 2006-01-12
IL178640A0 (en) 2007-02-11
AU2005243743A1 (en) 2005-11-24
BRPI0509932A (pt) 2007-09-25
KR101297611B1 (ko) 2013-08-19
RU2006140378A (ru) 2008-05-27
PL1748864T3 (pl) 2017-12-29
WO2005110657A2 (en) 2005-11-24
JP5021460B2 (ja) 2012-09-05
HK1105918A1 (zh) 2008-02-29
CA2563385A1 (en) 2005-11-24
JP2007532321A (ja) 2007-11-15
KR20070006901A (ko) 2007-01-11
RU2372175C2 (ru) 2009-11-10
EP1748864A2 (en) 2007-02-07
IL178640A (en) 2011-10-31

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