BRPI0509932A - processo de soldagem - Google Patents

processo de soldagem

Info

Publication number
BRPI0509932A
BRPI0509932A BRPI0509932-3A BRPI0509932A BRPI0509932A BR PI0509932 A BRPI0509932 A BR PI0509932A BR PI0509932 A BRPI0509932 A BR PI0509932A BR PI0509932 A BRPI0509932 A BR PI0509932A
Authority
BR
Brazil
Prior art keywords
metal oxide
welding
layer
gases
bath
Prior art date
Application number
BRPI0509932-3A
Other languages
English (en)
Inventor
Lawrence C Kay
Erik J Severin
Luis A Aguirre
Original Assignee
P Kay Metal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by P Kay Metal Inc filed Critical P Kay Metal Inc
Publication of BRPI0509932A publication Critical patent/BRPI0509932A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture And Refinement Of Metals (AREA)

Abstract

PROCESSO DE SOLDAGEM A presente invenção refere-se a um processo pelo qual uma solda fundida é purificada in-situ, tornando o processo de soldagem mais eficiente e rendendo melhores resultados, particularmente para soldas isentas de chumbo. Soldas isentas de chumbo tomam-se práticas para uso uma vez que a temperatura para uma soldagem confiável é reduzida.Uma camada de aditivo ativo é mantida na superfície da solda fundida para expulsar os gases queimados de óxidos metálicos da solda e assimilar o óxido metálico em uma camada líquida. O aditivo ativo é um líquido orgânico tendo grupos nucleofílicos e/ou eletrofílico. Como exemplo, uma camada de ácido dímero mantida em um aparelho de soldagem em ondas expulsa os gases queimados de óxidos metálicos do banho, e assimila os dejetos que possam se formar na superfície. A expulsão de gases queimados de óxido metálico limpa o banho e diminui a viscosidade da solda, e placas de circuito impresso ou similares soldadas no aparelho de soldagem em ondas têm juntas de solda confiáveis.
BRPI0509932-3A 2004-04-16 2005-04-18 processo de soldagem BRPI0509932A (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US56296404P 2004-04-16 2004-04-16
US60958904P 2004-09-14 2004-09-14
PCT/US2005/013153 WO2005110657A2 (en) 2004-04-16 2005-04-18 Soldering process

Publications (1)

Publication Number Publication Date
BRPI0509932A true BRPI0509932A (pt) 2007-09-25

Family

ID=35107043

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0509932-3A BRPI0509932A (pt) 2004-04-16 2005-04-18 processo de soldagem

Country Status (14)

Country Link
EP (1) EP1748864B1 (pt)
JP (1) JP5021460B2 (pt)
KR (1) KR101297611B1 (pt)
AU (1) AU2005243743A1 (pt)
BR (1) BRPI0509932A (pt)
CA (1) CA2563385C (pt)
HK (1) HK1105918A1 (pt)
HU (1) HUE033419T2 (pt)
IL (1) IL178640A (pt)
MX (1) MXPA06011954A (pt)
PL (1) PL1748864T3 (pt)
RU (1) RU2372175C2 (pt)
SG (1) SG152220A1 (pt)
WO (1) WO2005110657A2 (pt)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2926233B1 (fr) * 2008-01-10 2010-08-13 Air Liquide Dispositif d'alimentation en gaz d'une machine de brasage ou etamage a la vague.
JP4375485B2 (ja) * 2008-02-22 2009-12-02 日本ジョイント株式会社 鉛フリーはんだ合金の製造方法及び半導体装置の製造方法
JP4375491B1 (ja) * 2008-06-23 2009-12-02 日本ジョイント株式会社 電子部品のはんだ付け装置およびはんだ付け方法
WO2011022514A1 (en) 2009-08-18 2011-02-24 Ms2 Technologies, Llc Tool for removing solder dross with a receptacle and a lift; method of treating solder dross using such tool
JP6310894B2 (ja) * 2015-09-30 2018-04-11 株式会社タムラ製作所 はんだ組成物および電子基板の製造方法
JP6460198B1 (ja) * 2017-10-11 2019-01-30 千住金属工業株式会社 フラックス及びソルダペースト
JP6540789B1 (ja) * 2017-12-29 2019-07-10 千住金属工業株式会社 樹脂組成物及びはんだ付け用フラックス
JP6540788B1 (ja) 2017-12-29 2019-07-10 千住金属工業株式会社 フラックス及びソルダペースト
JP6501003B1 (ja) 2018-01-17 2019-04-17 千住金属工業株式会社 はんだ付け用樹脂組成物、やに入りはんだ、フラックスコートはんだ及び液状フラックス
JP6540833B1 (ja) * 2018-01-17 2019-07-10 千住金属工業株式会社 フラックス及びソルダペースト
CN108471678B (zh) * 2018-04-13 2019-02-22 荆门紫菘电子有限公司 一种电子焊接用单片机基座安装装置
CN113977963B (zh) * 2021-12-02 2022-11-29 山东润德复合材料有限公司 一种基于土工格栅的焊接装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3058441A (en) * 1956-10-02 1962-10-16 Sanders Associates Inc Soldering apparatus and method of soldering electrical conductors
US3445919A (en) * 1968-07-11 1969-05-27 Electronic Eng Co California Method of using a solder contact fluid
US3755886A (en) * 1971-10-22 1973-09-04 Magnavox Co Method for soldering electrical conductors
JPS5276250A (en) * 1975-12-23 1977-06-27 Yoshio Tobari Antioxidant for solder
US4171761A (en) * 1978-03-20 1979-10-23 Rockwell International Corporation Wave solder apparatus
CH660145A5 (de) * 1983-07-15 1987-03-31 Landis & Gyr Ag Verfahren zum schutz der oberflaeche eines loetbads.
US4495007A (en) * 1984-03-12 1985-01-22 At&T Technologies, Inc. Soldering flux
JPH10163617A (ja) * 1996-11-26 1998-06-19 Sony Corp はんだドロスの還元方法および還元装置
JP2001320162A (ja) * 1998-02-27 2001-11-16 Matsushita Electric Ind Co Ltd はんだ回収装置と酸化物の除去方法
EP1378309B1 (en) * 1998-02-27 2008-07-09 Matsushita Electric Industrial Co., Ltd. Method for separating solder and solder oxides
JP2001068848A (ja) * 1999-08-24 2001-03-16 Furukawa Electric Co Ltd:The 半田組成物およびそれを用いた半田供給方法

Also Published As

Publication number Publication date
IL178640A0 (en) 2007-02-11
EP1748864A2 (en) 2007-02-07
MXPA06011954A (es) 2007-03-26
WO2005110657A3 (en) 2006-01-12
IL178640A (en) 2011-10-31
KR20070006901A (ko) 2007-01-11
HUE033419T2 (en) 2017-11-28
RU2006140378A (ru) 2008-05-27
PL1748864T3 (pl) 2017-12-29
JP2007532321A (ja) 2007-11-15
WO2005110657A2 (en) 2005-11-24
EP1748864B1 (en) 2017-06-07
JP5021460B2 (ja) 2012-09-05
AU2005243743A1 (en) 2005-11-24
KR101297611B1 (ko) 2013-08-19
HK1105918A1 (en) 2008-02-29
RU2372175C2 (ru) 2009-11-10
CA2563385C (en) 2012-02-21
CA2563385A1 (en) 2005-11-24
SG152220A1 (en) 2009-05-29

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements