ATE152021T1 - Lötflussmittel, enthaltend durch licht erzeugte oxidentferner - Google Patents

Lötflussmittel, enthaltend durch licht erzeugte oxidentferner

Info

Publication number
ATE152021T1
ATE152021T1 AT91915204T AT91915204T ATE152021T1 AT E152021 T1 ATE152021 T1 AT E152021T1 AT 91915204 T AT91915204 T AT 91915204T AT 91915204 T AT91915204 T AT 91915204T AT E152021 T1 ATE152021 T1 AT E152021T1
Authority
AT
Austria
Prior art keywords
pcbs
compounds
containing light
soldering flux
flux containing
Prior art date
Application number
AT91915204T
Other languages
English (en)
Inventor
Bobby Dean Landreth
Robert W Pennisi
James Lynn Davis
Fadia Nounou
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of ATE152021T1 publication Critical patent/ATE152021T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Adornments (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AT91915204T 1990-08-13 1991-08-13 Lötflussmittel, enthaltend durch licht erzeugte oxidentferner ATE152021T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/566,029 US5045128A (en) 1990-08-13 1990-08-13 Solder fluxes bearing oxide removers generated by light

Publications (1)

Publication Number Publication Date
ATE152021T1 true ATE152021T1 (de) 1997-05-15

Family

ID=24261162

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91915204T ATE152021T1 (de) 1990-08-13 1991-08-13 Lötflussmittel, enthaltend durch licht erzeugte oxidentferner

Country Status (8)

Country Link
US (1) US5045128A (de)
EP (1) EP0550460B1 (de)
JP (1) JPH084954B2 (de)
KR (1) KR960010513B1 (de)
AT (1) ATE152021T1 (de)
CA (1) CA2088148C (de)
DE (1) DE69125841T2 (de)
WO (1) WO1992003252A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5195674A (en) * 1991-02-14 1993-03-23 Matsushita Electric Industrial Co., Ltd. Reflow system
US5398865A (en) * 1993-05-20 1995-03-21 Electrovert Ltd. Preparation of surfaces for solder joining
US5648196A (en) * 1995-07-14 1997-07-15 Cornell Research Foundation, Inc. Water-soluble photoinitiators
CN105345193B (zh) * 2015-11-02 2017-12-01 苏州威兹泰克自动化科技有限公司 自动锡焊线
JP6754091B1 (ja) * 2020-03-30 2020-09-09 千住金属工業株式会社 フラックス、はんだペーストおよびはんだ付け製品の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1056368A (de) * 1951-04-28 1954-02-26
US4733039A (en) * 1985-05-06 1988-03-22 General Electric Company Method of laser soldering
US4759490A (en) * 1986-10-23 1988-07-26 Fujitsu Limited Method for soldering electronic components onto a printed wiring board using a solder paste

Also Published As

Publication number Publication date
US5045128A (en) 1991-09-03
KR930701263A (ko) 1993-06-11
JPH084954B2 (ja) 1996-01-24
DE69125841D1 (de) 1997-05-28
DE69125841T2 (de) 1997-10-16
KR960010513B1 (ko) 1996-08-02
EP0550460A1 (de) 1993-07-14
CA2088148C (en) 1997-09-23
CA2088148A1 (en) 1992-02-14
JPH06500051A (ja) 1994-01-06
EP0550460A4 (de) 1994-01-19
EP0550460B1 (de) 1997-04-23
WO1992003252A1 (en) 1992-03-05

Similar Documents

Publication Publication Date Title
MY124297A (en) Flux composition and corresponding soldering method
EP0257792A3 (de) Chemische Zusammensetzung eines Mittels und Verfahren zum Abziehen von Filmen von gedruckten Schaltungen
EP1149661A3 (de) Weichlötflussmittel für Leiterplatten und so erhaltene Leiterplatten
CA2261258A1 (en) A flux formulation
US5443660A (en) Water-based no-clean flux formulation
US5334261A (en) Soldering flux composition and solder paste composition
JP2854782B2 (ja) 電子部品の固定方法、回路基板の製造方法及び回路基板
ATE152021T1 (de) Lötflussmittel, enthaltend durch licht erzeugte oxidentferner
US5141568A (en) Water-soluble soldering paste
US4215025A (en) Water soluble adhesive coating for mounting components to printed wiring boards
KR20010049653A (ko) 솔더 페이스트 및 그 솔더링 방법
EP0538822B1 (de) Schäumendes Flussmittel für automatisches Lötverfahren
EP0458161B1 (de) Wasserlöslisches Weichlötflussmittel
EP0675675B1 (de) Reinigungsverfahren
JPH05212584A (ja) ソルダーペースト
JPH08132282A (ja) 半田付け用フラックス
US4340167A (en) Coated printed circuit wiring board and method of soldering
CA2053751C (en) Water-soluble soldering paste
Schneider VOC-free fluxes
Minahara et al. Soldering Flux Composition Containing Peroxide Generator and an Ester
CA2068357C (en) Water-soluble flux for cored solder
SE8800928D0 (sv) Metod att i en lodprocess avlegsna organiska och oorganiska rester
US5192360A (en) Water-soluble flux for cored solder
JP3213745B2 (ja) 噴流はんだ槽
Pascoe Recent Advances in Removing Electronic Flux Residues.(Retroactive Coverage)

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties