KR930701263A - 빛에 의해 생성되는 산화물 제거제를 포함하는 땜납 융제 - Google Patents

빛에 의해 생성되는 산화물 제거제를 포함하는 땜납 융제

Info

Publication number
KR930701263A
KR930701263A KR1019930700403A KR930700403A KR930701263A KR 930701263 A KR930701263 A KR 930701263A KR 1019930700403 A KR1019930700403 A KR 1019930700403A KR 930700403 A KR930700403 A KR 930700403A KR 930701263 A KR930701263 A KR 930701263A
Authority
KR
South Korea
Prior art keywords
light
pcbs
compounds
solder flux
containing oxide
Prior art date
Application number
KR1019930700403A
Other languages
English (en)
Other versions
KR960010513B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR930701263A publication Critical patent/KR930701263A/ko
Application granted granted Critical
Publication of KR960010513B1 publication Critical patent/KR960010513B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Adornments (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1019930700403A 1990-08-13 1991-08-13 광에 의해 발생되는 산화물 제거제를 포함하는 땜납 용제 KR960010513B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/566,029 1990-08-13
US07/566,029 US5045128A (en) 1990-08-13 1990-08-13 Solder fluxes bearing oxide removers generated by light
PCT/US1991/005760 WO1992003252A1 (en) 1990-08-13 1991-08-13 Solder fluxes bearing oxide removers generated by light

Publications (2)

Publication Number Publication Date
KR930701263A true KR930701263A (ko) 1993-06-11
KR960010513B1 KR960010513B1 (ko) 1996-08-02

Family

ID=24261162

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930700403A KR960010513B1 (ko) 1990-08-13 1991-08-13 광에 의해 발생되는 산화물 제거제를 포함하는 땜납 용제

Country Status (8)

Country Link
US (1) US5045128A (ko)
EP (1) EP0550460B1 (ko)
JP (1) JPH084954B2 (ko)
KR (1) KR960010513B1 (ko)
AT (1) ATE152021T1 (ko)
CA (1) CA2088148C (ko)
DE (1) DE69125841T2 (ko)
WO (1) WO1992003252A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5195674A (en) * 1991-02-14 1993-03-23 Matsushita Electric Industrial Co., Ltd. Reflow system
US5398865A (en) * 1993-05-20 1995-03-21 Electrovert Ltd. Preparation of surfaces for solder joining
US5648196A (en) * 1995-07-14 1997-07-15 Cornell Research Foundation, Inc. Water-soluble photoinitiators
CN105345193B (zh) * 2015-11-02 2017-12-01 苏州威兹泰克自动化科技有限公司 自动锡焊线
JP6754091B1 (ja) * 2020-03-30 2020-09-09 千住金属工業株式会社 フラックス、はんだペーストおよびはんだ付け製品の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1056368A (ko) * 1951-04-28 1954-02-26
US4733039A (en) * 1985-05-06 1988-03-22 General Electric Company Method of laser soldering
US4759490A (en) * 1986-10-23 1988-07-26 Fujitsu Limited Method for soldering electronic components onto a printed wiring board using a solder paste

Also Published As

Publication number Publication date
US5045128A (en) 1991-09-03
JPH084954B2 (ja) 1996-01-24
DE69125841D1 (de) 1997-05-28
DE69125841T2 (de) 1997-10-16
KR960010513B1 (ko) 1996-08-02
EP0550460A1 (en) 1993-07-14
CA2088148C (en) 1997-09-23
CA2088148A1 (en) 1992-02-14
ATE152021T1 (de) 1997-05-15
JPH06500051A (ja) 1994-01-06
EP0550460A4 (ko) 1994-01-19
EP0550460B1 (en) 1997-04-23
WO1992003252A1 (en) 1992-03-05

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee