PL1748864T3 - Sposób lutowania - Google Patents

Sposób lutowania

Info

Publication number
PL1748864T3
PL1748864T3 PL05779064T PL05779064T PL1748864T3 PL 1748864 T3 PL1748864 T3 PL 1748864T3 PL 05779064 T PL05779064 T PL 05779064T PL 05779064 T PL05779064 T PL 05779064T PL 1748864 T3 PL1748864 T3 PL 1748864T3
Authority
PL
Poland
Prior art keywords
soldering process
soldering
Prior art date
Application number
PL05779064T
Other languages
English (en)
Polish (pl)
Inventor
Lawrence C. Kay
Erik J. Severin
Luis A. Aguirre
Original Assignee
P. Kay Metal, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by P. Kay Metal, Inc. filed Critical P. Kay Metal, Inc.
Publication of PL1748864T3 publication Critical patent/PL1748864T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture And Refinement Of Metals (AREA)
PL05779064T 2004-04-16 2005-04-18 Sposób lutowania PL1748864T3 (pl)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US56296404P 2004-04-16 2004-04-16
US60958904P 2004-09-14 2004-09-14
EP05779064.4A EP1748864B1 (en) 2004-04-16 2005-04-18 Soldering process
PCT/US2005/013153 WO2005110657A2 (en) 2004-04-16 2005-04-18 Soldering process

Publications (1)

Publication Number Publication Date
PL1748864T3 true PL1748864T3 (pl) 2017-12-29

Family

ID=35107043

Family Applications (1)

Application Number Title Priority Date Filing Date
PL05779064T PL1748864T3 (pl) 2004-04-16 2005-04-18 Sposób lutowania

Country Status (13)

Country Link
EP (1) EP1748864B1 (https=)
JP (1) JP5021460B2 (https=)
KR (1) KR101297611B1 (https=)
AU (1) AU2005243743A1 (https=)
BR (1) BRPI0509932A (https=)
CA (1) CA2563385C (https=)
HU (1) HUE033419T2 (https=)
IL (1) IL178640A (https=)
MX (1) MXPA06011954A (https=)
PL (1) PL1748864T3 (https=)
RU (1) RU2372175C2 (https=)
SG (1) SG152220A1 (https=)
WO (1) WO2005110657A2 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2926233B1 (fr) * 2008-01-10 2010-08-13 Air Liquide Dispositif d'alimentation en gaz d'une machine de brasage ou etamage a la vague.
JP4375485B2 (ja) * 2008-02-22 2009-12-02 日本ジョイント株式会社 鉛フリーはんだ合金の製造方法及び半導体装置の製造方法
JP4375491B1 (ja) * 2008-06-23 2009-12-02 日本ジョイント株式会社 電子部品のはんだ付け装置およびはんだ付け方法
WO2011022514A1 (en) 2009-08-18 2011-02-24 Ms2 Technologies, Llc Tool for removing solder dross with a receptacle and a lift; method of treating solder dross using such tool
JP6310894B2 (ja) * 2015-09-30 2018-04-11 株式会社タムラ製作所 はんだ組成物および電子基板の製造方法
JP6460198B1 (ja) 2017-10-11 2019-01-30 千住金属工業株式会社 フラックス及びソルダペースト
JP6540789B1 (ja) * 2017-12-29 2019-07-10 千住金属工業株式会社 樹脂組成物及びはんだ付け用フラックス
JP6540788B1 (ja) * 2017-12-29 2019-07-10 千住金属工業株式会社 フラックス及びソルダペースト
JP6501003B1 (ja) * 2018-01-17 2019-04-17 千住金属工業株式会社 はんだ付け用樹脂組成物、やに入りはんだ、フラックスコートはんだ及び液状フラックス
JP6540833B1 (ja) * 2018-01-17 2019-07-10 千住金属工業株式会社 フラックス及びソルダペースト
CN108471678B (zh) * 2018-04-13 2019-02-22 荆门紫菘电子有限公司 一种电子焊接用单片机基座安装装置
CN113977963B (zh) * 2021-12-02 2022-11-29 山东润德复合材料有限公司 一种基于土工格栅的焊接装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3058441A (en) * 1956-10-02 1962-10-16 Sanders Associates Inc Soldering apparatus and method of soldering electrical conductors
US3445919A (en) * 1968-07-11 1969-05-27 Electronic Eng Co California Method of using a solder contact fluid
US3755886A (en) * 1971-10-22 1973-09-04 Magnavox Co Method for soldering electrical conductors
SU408736A1 (https=) * 1972-03-20 1973-11-30
JPS5276250A (en) * 1975-12-23 1977-06-27 Yoshio Tobari Antioxidant for solder
SU578170A1 (ru) * 1976-06-18 1977-10-30 Уфимский Приборостроительный Завод Им.В.И.Ленина Устройство дл пайки струей припо
US4171761A (en) * 1978-03-20 1979-10-23 Rockwell International Corporation Wave solder apparatus
SU969487A1 (ru) * 1980-07-25 1982-10-30 Предприятие П/Я В-8525 Жидкость дл защиты припо от окислени
CH660145A5 (de) * 1983-07-15 1987-03-31 Landis & Gyr Ag Verfahren zum schutz der oberflaeche eines loetbads.
US4495007A (en) * 1984-03-12 1985-01-22 At&T Technologies, Inc. Soldering flux
RU2116172C1 (ru) * 1995-12-27 1998-07-27 Московский государственный технический университет гражданской авиации Способ увеличения эксплуатационных свойств изделий авионики
JPH10163617A (ja) * 1996-11-26 1998-06-19 Sony Corp はんだドロスの還元方法および還元装置
JP2001320162A (ja) * 1998-02-27 2001-11-16 Matsushita Electric Ind Co Ltd はんだ回収装置と酸化物の除去方法
DE69939072D1 (de) * 1998-02-27 2008-08-21 Matsushita Electric Industrial Co Ltd Verfahren zum Trennen des Lötmaterials von der Oxidlötung
JP2001068848A (ja) * 1999-08-24 2001-03-16 Furukawa Electric Co Ltd:The 半田組成物およびそれを用いた半田供給方法

Also Published As

Publication number Publication date
EP1748864B1 (en) 2017-06-07
HUE033419T2 (en) 2017-11-28
CA2563385C (en) 2012-02-21
MXPA06011954A (es) 2007-03-26
WO2005110657A3 (en) 2006-01-12
IL178640A0 (en) 2007-02-11
AU2005243743A1 (en) 2005-11-24
BRPI0509932A (pt) 2007-09-25
KR101297611B1 (ko) 2013-08-19
RU2006140378A (ru) 2008-05-27
WO2005110657A2 (en) 2005-11-24
JP5021460B2 (ja) 2012-09-05
SG152220A1 (en) 2009-05-29
HK1105918A1 (zh) 2008-02-29
CA2563385A1 (en) 2005-11-24
JP2007532321A (ja) 2007-11-15
KR20070006901A (ko) 2007-01-11
RU2372175C2 (ru) 2009-11-10
EP1748864A2 (en) 2007-02-07
IL178640A (en) 2011-10-31

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