DE69939072D1 - Verfahren zum Trennen des Lötmaterials von der Oxidlötung - Google Patents

Verfahren zum Trennen des Lötmaterials von der Oxidlötung

Info

Publication number
DE69939072D1
DE69939072D1 DE69939072T DE69939072T DE69939072D1 DE 69939072 D1 DE69939072 D1 DE 69939072D1 DE 69939072 T DE69939072 T DE 69939072T DE 69939072 T DE69939072 T DE 69939072T DE 69939072 D1 DE69939072 D1 DE 69939072D1
Authority
DE
Germany
Prior art keywords
separating
solder material
soldering
oxide
oxide soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69939072T
Other languages
English (en)
Inventor
Yasuji Kawashima
Kaoru Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4694498A external-priority patent/JP2899584B1/ja
Priority claimed from JP35894798A external-priority patent/JP3241013B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69939072D1 publication Critical patent/DE69939072D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B25/00—Obtaining tin
    • C22B25/06—Obtaining tin from scrap, especially tin scrap
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B25/00—Obtaining tin
    • C22B25/08—Refining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69939072T 1998-02-27 1999-02-13 Verfahren zum Trennen des Lötmaterials von der Oxidlötung Expired - Lifetime DE69939072D1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP4694398 1998-02-27
JP4694498A JP2899584B1 (ja) 1998-02-27 1998-02-27 酸化物の分離剤と分離方法と容器
JP30054698 1998-10-22
JP35894798A JP3241013B2 (ja) 1998-02-27 1998-12-17 はんだ付け装置とはんだ回収装置と酸化物の除去方法と酸化物の分離剤

Publications (1)

Publication Number Publication Date
DE69939072D1 true DE69939072D1 (de) 2008-08-21

Family

ID=27461965

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69939072T Expired - Lifetime DE69939072D1 (de) 1998-02-27 1999-02-13 Verfahren zum Trennen des Lötmaterials von der Oxidlötung
DE1999622069 Expired - Lifetime DE69922069T2 (de) 1998-02-27 1999-02-13 Lötvorrichtung und Verfahren zum Entzweien des Lötmaterials von der Oxidslötung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE1999622069 Expired - Lifetime DE69922069T2 (de) 1998-02-27 1999-02-13 Lötvorrichtung und Verfahren zum Entzweien des Lötmaterials von der Oxidslötung

Country Status (10)

Country Link
US (2) US6214218B1 (de)
EP (2) EP1378309B1 (de)
KR (1) KR100322901B1 (de)
CN (1) CN1199535C (de)
BR (1) BR9900837A (de)
CZ (1) CZ301222B6 (de)
DE (2) DE69939072D1 (de)
MY (1) MY115409A (de)
SG (1) SG80611A1 (de)
TW (1) TW404155B (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002080950A (ja) * 2000-09-07 2002-03-22 Senju Metal Ind Co Ltd ドロスから酸化物を分離する方法および噴流はんだ槽
EP1259101A4 (de) 2000-09-26 2003-04-09 Matsushita Electric Ind Co Ltd Schwallötvorrichtung und -methode
US6948650B2 (en) 2001-01-12 2005-09-27 Speedline Technologies, Inc. Dross removal and solder reclamation improvements
JP3539935B2 (ja) * 2001-05-02 2004-07-07 千住金属工業株式会社 はんだドロスの分離装置
US7146409B1 (en) * 2001-07-24 2006-12-05 Brightplanet Corporation System and method for efficient control and capture of dynamic database content
JP4647150B2 (ja) * 2001-08-07 2011-03-09 千住金属工業株式会社 酸化物の分離装置
US6942791B1 (en) * 2002-07-16 2005-09-13 Radko G. Petrov Apparatus and method for recycling of dross in a soldering apparatus
JP5021460B2 (ja) * 2004-04-16 2012-09-05 ピー．ケイ メタル，インコーポレイティド はんだ付け方法および装置
US7861915B2 (en) 2004-04-16 2011-01-04 Ms2 Technologies, Llc Soldering process
EP1778592B1 (de) * 2004-07-07 2013-07-31 Disney Enterprises, Inc. Prozessgesteuerte oxidation
JP4777759B2 (ja) * 2005-12-01 2011-09-21 富士フイルム株式会社 配線基板及び配線基板接続装置
DE202009010159U1 (de) * 2009-07-28 2010-12-30 Seho Systemtechnik Gmbh Lötdüse für eine Wellenlötvorrichtung
WO2011022514A1 (en) 2009-08-18 2011-02-24 Ms2 Technologies, Llc Tool for removing solder dross with a receptacle and a lift; method of treating solder dross using such tool
KR20110129151A (ko) * 2010-05-25 2011-12-01 삼성전자주식회사 부력 인가 수단을 가진 웨이브 솔더링 장치와 솔더링 방법 및 플립 칩용 솔더 범프 형성 방법
US7866530B1 (en) * 2010-06-28 2011-01-11 Valeri Riachentsev Clean tip soldering station
EP2790845B1 (de) * 2011-12-15 2017-02-08 Entegris Inc. Vorrichtung und verfahren zur beseitigung von lötmetallen während des recyclings von abfällen aus elektrischen und elektronischen geräten
WO2016022755A2 (en) 2014-08-06 2016-02-11 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2451505A (en) * 1945-05-21 1948-10-19 Edwin T Myskowski Screen for casting risers
US2757425A (en) * 1952-11-18 1956-08-07 Aluminium Lab Ltd Apparatus and procedure for treatment of molten aluminum
DE1807989C3 (de) * 1968-11-06 1979-12-13 Ersa, Ernst Sachs Kg Gmbh & Co, 6980 Wertheim Vorrichtung zur Lötung elektrischer Verbindungen, insbesondere gedruckter Schaltungen
CH511057A (de) * 1970-07-17 1971-08-15 Lonza Ag Verfahren zur Abtrennung von Agglomeraten von Haarkristallen
US3734718A (en) * 1971-12-15 1973-05-22 Dow Chemical Co Magnesium-magnesium chloride bath separation
US3843355A (en) * 1972-04-04 1974-10-22 Dow Chemical Co Method for melting and purifying magnesium
CH591303A5 (de) * 1974-04-19 1977-09-15 Meteor Ag
US4007119A (en) * 1975-09-09 1977-02-08 Blackstone Corporation Methods and apparatus for skimming liquids
WO1981002268A1 (en) * 1980-02-15 1981-08-20 Johnson Matthey Co Ltd Improvements in and relating to the joining of tubes
US4339784A (en) * 1980-08-11 1982-07-13 Rca Corporation Solder draw pad
GB8600734D0 (en) * 1986-01-14 1986-02-19 Hallam Ind Supplies Ltd Casting of metals
JPS62179867A (ja) 1986-01-31 1987-08-07 Nippon Aitemu Kk 浮遊物処理装置
JPS63281770A (ja) 1987-05-13 1988-11-18 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
JPH0289569A (ja) 1988-09-26 1990-03-29 Matsushita Electric Ind Co Ltd 半田装置
JPH0292453A (ja) * 1988-09-29 1990-04-03 Fuji Seiki Mach Works Ltd 噴流ハンダ付け装置
US5087356A (en) * 1990-05-16 1992-02-11 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Solder dross removal apparatus
DE4041270A1 (de) * 1990-12-21 1992-06-25 Grasmann Karl Heinz Wls Verfahren und vorrichtung zur verarbeitung von elektronischen flachbaugruppen, insbesondere mit bauelementen bestueckten leiterplatten
US5100048A (en) * 1991-01-25 1992-03-31 Alcan International Limited Method of brazing aluminum
US5139704A (en) 1991-02-12 1992-08-18 Hughes Aircraft Company Fluxless solder
JP3090733B2 (ja) 1991-09-04 2000-09-25 ソニー株式会社 噴流半田槽
JPH06198426A (ja) 1992-12-28 1994-07-19 Yokota Kikai Kk 自動半田付け装置
US5568894A (en) * 1993-06-04 1996-10-29 Electrovert Ltd. Applying flux to a solder wave for wave soldering an element
CA2111124A1 (en) 1993-08-19 1995-02-20 D. Morgan Tench Hydrogen assisted reduced oxide soldering system
JP3157970B2 (ja) * 1993-11-30 2001-04-23 日本電熱計器株式会社 はんだ付け装置
US5388756A (en) * 1993-12-27 1995-02-14 At&T Corp. Method and apparatus for removing contaminants from solder
JPH08316623A (ja) * 1995-05-22 1996-11-29 Osaka Asahi Kagaku Kk 噴流半田付け装置
JPH10163617A (ja) 1996-11-26 1998-06-19 Sony Corp はんだドロスの還元方法および還元装置
US5845839A (en) * 1996-12-19 1998-12-08 General Motors Corporation Method and apparatus for dip solder processing

Also Published As

Publication number Publication date
EP1378309A2 (de) 2004-01-07
EP0938944B1 (de) 2004-11-24
EP1378309A3 (de) 2005-06-08
CN1237874A (zh) 1999-12-08
MY115409A (en) 2003-05-31
BR9900837A (pt) 1999-12-14
DE69922069T2 (de) 2006-03-02
SG80611A1 (en) 2001-05-22
US6235208B1 (en) 2001-05-22
US6214218B1 (en) 2001-04-10
TW404155B (en) 2000-09-01
CZ53899A3 (cs) 2000-06-14
CZ301222B6 (cs) 2009-12-16
CN1199535C (zh) 2005-04-27
EP1378309B1 (de) 2008-07-09
KR100322901B1 (ko) 2002-03-18
EP0938944A3 (de) 2000-12-27
DE69922069D1 (de) 2004-12-30
EP0938944A2 (de) 1999-09-01
KR19990072895A (ko) 1999-09-27

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8364 No opposition during term of opposition