DE584356T1 - Verfahren zum löten. - Google Patents
Verfahren zum löten.Info
- Publication number
- DE584356T1 DE584356T1 DE0584356T DE92903329T DE584356T1 DE 584356 T1 DE584356 T1 DE 584356T1 DE 0584356 T DE0584356 T DE 0584356T DE 92903329 T DE92903329 T DE 92903329T DE 584356 T1 DE584356 T1 DE 584356T1
- Authority
- DE
- Germany
- Prior art keywords
- probe
- soldering
- laser light
- solder
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims 16
- 238000005476 soldering Methods 0.000 title claims 16
- 239000000523 sample Substances 0.000 claims 28
- 229910000679 solder Inorganic materials 0.000 claims 8
- 239000000463 material Substances 0.000 claims 3
- 239000013307 optical fiber Substances 0.000 claims 3
- 239000002826 coolant Substances 0.000 claims 2
- 238000002356 laser light scattering Methods 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- 239000011261 inert gas Substances 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 230000002829 reductive effect Effects 0.000 claims 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0221—Laser welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01025—Manganese [Mn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0104—Zirconium [Zr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01067—Holmium [Ho]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Laser Beam Processing (AREA)
Claims (15)
1. Verfahren zum Löten eines Teils, das mit einem Basismaterial verbunden werden soll, durch Bestrahlen des Teils, das Verbunden
werden soll, mit Laserlicht, das aufweist:
Ausrichten des Laserlichts derart, daß es auf einen laserlicht-übertragenden Tastkopf auftrifft;
Emittieren des Laserlichts von dem Frontende des Tastkopfes und im wesentlichen Inberührungbringen des Frontendes des
Tastkopfes mit einem Lot oder dem zu verbindenden Teil.
2. Verfahren zum Löten, wie in Anspruch 1 definiert, bei dem der Tastkopf an dessen Frontende mit einer Vertiefung ausgebildet
ist, die im wesentlichen identisch mit der Berührungsoberfläche des Lotes ist, so daß das Frontende des Tastkopfes in
Oberflächenberührung mit dem Lot ist.
3. Verfahren, wie in Anspruch 1 definiert, bei dem der Tastkopf mit einer Schicht, die eine Laserlicht-Streuungs-Einrichtung hat,
am Frontende des Tastkopfes in der Berührungsposition ausgebildet ist.
4. Verfahren zum Löten, wie in Anspruch 1 definiert, bei dem der Tastkopf mit einer Einrichtung zum Umwandeln eines Teils des
Laserlichts in infrarote Strahlen, die leicht von einem Material absorbiert werden, das das zu bestrahlende Objekt bildet, am
Frontende des Tastkopfes in der Berührungsposition ausgebildet ist.
0534 356
5. Verfahren zum Löten, wie in Anspruch 1 definiert, bei dem der Tastkopf mit einer Schicht, in der Laserlicht-Streuungs-Partikel
und Infrarot-Strahlungs-Umwandlungs-Partikel enthalten sind, am
Frontende des Tastkopfes in Berührungsposition ausgebildet ist.
6. Verfahren zum Löten, wie in Anspruch 1 definiert, bei dem der Tastkopf mit einem Lot-Zuführloch ausgebildet ist, das sich durch
den Tastkopf zu der Berührungsposition erstreckt.
7. Verfahren zum Löten, wie in Anspruch 1 definiert, bei dem der Tastkopf mit einem Lot-Zuführloch, das sich durch den Tastkopf zu
der Berührungsposition erstreckt, zum Zuführen eines atomosphärischen Gases ausgebildet ist, um die Berührungsposition
in ein reduktives oder inertes Gas zu setzen.
8. Verfahren zum Löten, wie in Anspruch 1 definiert, bei dem der Tastkopf mit einem Kühlmedium-Weg zum Zuführen eines Kühlmediums
ausgebildet ist, der sich durch den Tastkopf zu der Berührungsposition erstreckt.
9. Verfahren zum Löten, wie in Anspruch 1 definiert, bei dem die Menge des Laserlichts, das von der Auftreff-Oberfläche des
Tastkopfes zurückkehrt, detektiert wird und bei dem die Menge des auftreffenden Laserlichts als ein Temperaturindex an der
Bestrahlungsposition gesteuert wird.
10. Verfahren zum Löten, wie in Anspruch 1 definiert, bei dem ein Temperatur-Tastkopf in dem Tastkopf derart angeordnet ist, daß er
sich durch den Tastkopf erstreckt und das Lot berührt oder nahe zum Lot ist, und bei dem die Energie des emittierten Laserlichtes
auf der Basis eines Temperatursignals von dem Temperatur-Tastkopf gesteuert wird.
11. Verfahren zum Löten, wie in Anspruch 1 definiert, bei dem eine Vielzahl von Tastköpfen an einem Lötkopf angebracht ist, und
Laserlicht von jedem der Tastköpfe emittiert wird.
12. Verfahren zum Löten, wie in Anspruch 1 definiert, bei dem der Tastkopf dem geschmolzenen Zustand des Lots folgt und ständig das
Lot berührt, indem er sich in Richtung des Basismaterials bewegt.
13. Verfahren zum Löten, wie in Anspruch 1 definiert, bei dem der Tastkopf aus wärmebeständigen und licht-übertragenden Keramiken
besteht.
14. Verfahren zum Löten, wie in Anspruch l definiert, bei dem der
Tastkopf eine optische Faser ist, die selbst ein Frontende hat, das das Objekt in der Bestrahlungsposition berührt oder nahe zum
Objekt in der Bestrahlungsposition ist.
15. Verfahren zum Löten, wie in Anspruch 1 definiert, bei dem das Laserlicht über eine optische Faser auf einen separaten Tastkopf
auftrifft, der in Front der optischen Faser angeordnet ist.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP1992/000032 WO1993013903A1 (fr) | 1992-01-17 | 1992-01-17 | Procede de brasage |
Publications (1)
Publication Number | Publication Date |
---|---|
DE584356T1 true DE584356T1 (de) | 1994-11-03 |
Family
ID=14042129
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69211850T Expired - Fee Related DE69211850T2 (de) | 1992-01-17 | 1992-01-17 | Verfahren zum löten |
DE0584356T Pending DE584356T1 (de) | 1992-01-17 | 1992-01-17 | Verfahren zum löten. |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69211850T Expired - Fee Related DE69211850T2 (de) | 1992-01-17 | 1992-01-17 | Verfahren zum löten |
Country Status (7)
Country | Link |
---|---|
US (1) | US5272310A (de) |
EP (1) | EP0584356B1 (de) |
KR (1) | KR970004225B1 (de) |
AU (1) | AU662893B2 (de) |
DE (2) | DE69211850T2 (de) |
RU (1) | RU2095206C1 (de) |
WO (1) | WO1993013903A1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6471115B1 (en) | 1990-02-19 | 2002-10-29 | Hitachi, Ltd. | Process for manufacturing electronic circuit devices |
US6227436B1 (en) * | 1990-02-19 | 2001-05-08 | Hitachi, Ltd. | Method of fabricating an electronic circuit device and apparatus for performing the method |
US5904868A (en) * | 1994-06-16 | 1999-05-18 | International Business Machines Corporation | Mounting and/or removing of components using optical fiber tools |
US5847356A (en) * | 1996-08-30 | 1998-12-08 | Hewlett-Packard Company | Laser welded inkjet printhead assembly utilizing a combination laser and fiber optic push connect system |
US6286746B1 (en) * | 1997-08-28 | 2001-09-11 | Axya Medical, Inc. | Fused loop of filamentous material and apparatus for making same |
US6758610B2 (en) | 2001-12-10 | 2004-07-06 | Jds Uniphase Corporation | Optical component attachment to optoelectronic packages |
KR100688507B1 (ko) * | 2004-12-08 | 2007-03-02 | 삼성전자주식회사 | 반도체 칩 검사 장치 및 이를 이용한 반도체 칩 검사 방법 |
JP2009536044A (ja) * | 2006-04-18 | 2009-10-08 | アクシーア メディカル インコーポレイテッド | 複数材料構成の溶融縫合糸及びその製造用装置 |
DE102008002910A1 (de) * | 2008-06-26 | 2010-01-07 | Reis Lasertec Gmbh | Verfahren und Vorrichtung zum Verbinden von Bauteilen mittels Laserstrahlung |
DE102009017659A1 (de) | 2009-04-16 | 2010-10-28 | Schott Ag | Verfahren zur leitenden Verbindung eines Bauelementes auf einem transprenten Substrat |
JP2013219404A (ja) * | 2013-08-02 | 2013-10-24 | Sumida Corporation | アンテナ部品の製造方法 |
DE102015013312B4 (de) | 2015-10-13 | 2023-06-15 | Hochschule Mittweida (Fh) | Verfahren und Einrichtung zum schnellen stoffschlüssigen Löten von Körpern odervon Schichten oder von Körpern und Schichten mit Laserstrahlen |
EP3340287B1 (de) * | 2016-12-23 | 2020-10-28 | Huawei Technologies Co., Ltd. | Musterbasierte temperaturmessung für eine verbindungsvorrichtung und ein verbindungssystem |
RU183152U1 (ru) * | 2017-11-07 | 2018-09-12 | ООО "Евроинтех" | Установка для лазерной пайки |
KR102480461B1 (ko) * | 2017-11-30 | 2022-12-21 | 쌩-고벵 글래스 프랑스 | 차량용 창유리의 터미널 솔더링 장치 및 방법 |
DE102019124334A1 (de) * | 2019-09-11 | 2021-03-11 | Hesse Gmbh | Bondanordnung und Bondwerkzeug |
DE102020102938A1 (de) * | 2020-02-05 | 2021-08-05 | Marelli Automotive Lighting Reutlingen (Germany) GmbH | Schaltungsträgerplatte und Verfahren zum Herstellen einer Schaltungsträgerplatte |
CN114260649B (zh) * | 2021-12-09 | 2024-03-12 | 扬州盛威封头有限公司 | 封头温压成型工艺 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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US3304403A (en) * | 1963-10-14 | 1967-02-14 | Texas Instruments Inc | Laser welding of contacts |
US3463898A (en) * | 1965-07-09 | 1969-08-26 | Tokyo Shibaura Electric Co | Welding device utilizing laser beams |
JPS58173093A (ja) * | 1982-04-05 | 1983-10-11 | Toshiba Corp | ワイヤボンデイング方法 |
JPS5944669U (ja) * | 1982-09-14 | 1984-03-24 | 富士通株式会社 | レ−ザ−ボンデイングチツプ |
US4736743A (en) * | 1986-05-12 | 1988-04-12 | Surgical Laser Technology, Inc. | Vaporization contact laser probe |
JPS6350867A (ja) * | 1986-08-21 | 1988-03-03 | Minolta Camera Co Ltd | 静電潜像現像剤用キヤリア |
US4893742A (en) * | 1988-12-21 | 1990-01-16 | Hughes Aircraft Company | Ultrasonic laser soldering |
US4906812A (en) * | 1988-12-22 | 1990-03-06 | General Electric Company | Fiber optic laser joining apparatus |
JPH02213075A (ja) * | 1989-02-14 | 1990-08-24 | Matsushita Electric Ind Co Ltd | リードの接合方法 |
US4970365A (en) * | 1989-09-28 | 1990-11-13 | International Business Machines Corporation | Method and apparatus for bonding components leads to pads located on a non-rigid substrate |
-
1992
- 1992-01-17 DE DE69211850T patent/DE69211850T2/de not_active Expired - Fee Related
- 1992-01-17 RU RU9293054775A patent/RU2095206C1/ru active
- 1992-01-17 EP EP92903329A patent/EP0584356B1/de not_active Expired - Lifetime
- 1992-01-17 WO PCT/JP1992/000032 patent/WO1993013903A1/ja active IP Right Grant
- 1992-01-17 DE DE0584356T patent/DE584356T1/de active Pending
- 1992-01-17 KR KR1019930702220A patent/KR970004225B1/ko not_active IP Right Cessation
- 1992-01-17 AU AU11690/92A patent/AU662893B2/en not_active Ceased
- 1992-03-16 US US07/852,050 patent/US5272310A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0584356A4 (en) | 1994-07-06 |
EP0584356A1 (de) | 1994-03-02 |
US5272310A (en) | 1993-12-21 |
DE69211850T2 (de) | 1996-10-24 |
KR970004225B1 (ko) | 1997-03-26 |
RU2095206C1 (ru) | 1997-11-10 |
AU662893B2 (en) | 1995-09-21 |
EP0584356B1 (de) | 1996-06-26 |
KR930703722A (ko) | 1993-11-30 |
AU1169092A (en) | 1993-08-03 |
DE69211850D1 (de) | 1996-08-01 |
WO1993013903A1 (fr) | 1993-07-22 |
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