DE60016413D1 - Verfahren zum löten mit bleifreiem lötmaterial - Google Patents
Verfahren zum löten mit bleifreiem lötmaterialInfo
- Publication number
- DE60016413D1 DE60016413D1 DE60016413T DE60016413T DE60016413D1 DE 60016413 D1 DE60016413 D1 DE 60016413D1 DE 60016413 T DE60016413 T DE 60016413T DE 60016413 T DE60016413 T DE 60016413T DE 60016413 D1 DE60016413 D1 DE 60016413D1
- Authority
- DE
- Germany
- Prior art keywords
- soldering
- lead
- solder material
- free solder
- free
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 title 1
- 238000005476 soldering Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16516599 | 1999-06-11 | ||
JP16516599A JP3580731B2 (ja) | 1999-06-11 | 1999-06-11 | 鉛フリー半田の半田付け方法、及び当該半田付け方法にて半田付けされた接合体 |
PCT/JP2000/003678 WO2000076708A1 (fr) | 1999-06-11 | 2000-06-07 | Procede de soudage utilisant une brasure sans plomb et article lie prepare par soudage selon le procede |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60016413D1 true DE60016413D1 (de) | 2005-01-05 |
DE60016413T2 DE60016413T2 (de) | 2005-11-03 |
Family
ID=15807104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60016413T Expired - Lifetime DE60016413T2 (de) | 1999-06-11 | 2000-06-07 | Verfahren zum löten mit bleifreiem lötmaterial |
Country Status (5)
Country | Link |
---|---|
US (2) | US6702175B1 (de) |
EP (1) | EP1195217B1 (de) |
JP (1) | JP3580731B2 (de) |
DE (1) | DE60016413T2 (de) |
WO (1) | WO2000076708A1 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3580731B2 (ja) * | 1999-06-11 | 2004-10-27 | 和美 松重 | 鉛フリー半田の半田付け方法、及び当該半田付け方法にて半田付けされた接合体 |
US20040155097A1 (en) * | 2003-02-04 | 2004-08-12 | Matsushita Electric Industrial Co., Ltd. | Soldering method and method for manufacturing component mounting board |
JP3918779B2 (ja) * | 2003-06-13 | 2007-05-23 | 松下電器産業株式会社 | 非耐熱部品のはんだ付け方法 |
US7287685B2 (en) * | 2004-09-20 | 2007-10-30 | International Business Machines Corporation | Structure and method to gain substantial reliability improvements in lead-free BGAs assembled with lead-bearing solders |
US8220697B2 (en) * | 2005-01-18 | 2012-07-17 | Siemens Energy, Inc. | Weldability of alloys with directionally-solidified grain structure |
DE102006035626A1 (de) * | 2006-07-31 | 2008-02-07 | Zentrum für Material- und Umwelttechnik GmbH | Verfahren zum Anbringen eines Verbindungsleiters an einer photovoltaischen Solarzelle |
JP2010142848A (ja) * | 2008-12-19 | 2010-07-01 | Ijr:Kk | ろう付け方法及びろう付け装置 |
DE102010000520A1 (de) * | 2010-02-23 | 2011-08-25 | SCHOTT Solar AG, 55122 | Verfahren und Vorrichtung zum Aufbringen von Lot auf ein Werkstück |
US20120000964A1 (en) * | 2010-07-01 | 2012-01-05 | Gm Global Technology Operations, Inc. | Battery tab joints and methods of making |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55136562A (en) * | 1979-04-09 | 1980-10-24 | Hitachi Ltd | Ultrasonic pre-soldering method and apparatus thereof |
DE3240540A1 (de) * | 1982-11-03 | 1984-06-14 | GeWerTec Gesellschaft für Werkstofftechnik mbH, 4600 Dortmund | Verfahren und vorrichtung zum hochtemperatur- und hartloeten |
JPS6437077A (en) * | 1987-08-03 | 1989-02-07 | Hitachi Ltd | Reflow soldering |
US4885841A (en) | 1989-02-21 | 1989-12-12 | Micron Technology, Inc. | Vibrational method of aligning the leads of surface-mount electronic components with the mounting pads of printed circuit boards during the molten solder mounting process |
US5094700A (en) * | 1990-03-22 | 1992-03-10 | University Of Cincinnati | Solder and brazing alloys having improved properties and method of preparation |
US5256370B1 (en) * | 1992-05-04 | 1996-09-03 | Indium Corp America | Lead-free alloy containing tin silver and indium |
JPH067926A (ja) * | 1992-06-10 | 1994-01-18 | Showa Alum Corp | アルミニウム材の接合方法 |
JPH06342976A (ja) * | 1993-06-01 | 1994-12-13 | Nippondenso Co Ltd | 基板の接続方法 |
US5492263A (en) * | 1994-05-26 | 1996-02-20 | Delco Electronics Corp. | Method for wire bonding an aluminum wire to a lead of an electronics package |
JP2843814B2 (ja) * | 1994-12-14 | 1999-01-06 | 株式会社アルテクス | 超音波半田接合方法 |
JP3347512B2 (ja) | 1995-03-17 | 2002-11-20 | 富士通株式会社 | 低温接合用はんだ合金、これを用いた電子機器およびその製造方法 |
JP3220635B2 (ja) * | 1996-02-09 | 2001-10-22 | 松下電器産業株式会社 | はんだ合金及びクリームはんだ |
US5730932A (en) * | 1996-03-06 | 1998-03-24 | International Business Machines Corporation | Lead-free, tin-based multi-component solder alloys |
JP3963501B2 (ja) * | 1996-06-12 | 2007-08-22 | 内橋エステック株式会社 | 電子部品の実装方法 |
JPH10216630A (ja) * | 1997-01-31 | 1998-08-18 | Shibaura Eng Works Co Ltd | 超音波振動子の半田付け方法および超音波振動装置 |
JP3688429B2 (ja) * | 1997-04-25 | 2005-08-31 | 株式会社東芝 | 電子部品実装用基板および電子部品実装基板 |
JP3592486B2 (ja) * | 1997-06-18 | 2004-11-24 | 株式会社東芝 | ハンダ付け装置 |
US6047876A (en) * | 1997-09-12 | 2000-04-11 | Materials Resources International | Process of using an active solder alloy |
JPH11330134A (ja) * | 1998-05-12 | 1999-11-30 | Hitachi Ltd | ワイヤボンディング方法およびその装置並びに半導体装置 |
US6171415B1 (en) * | 1998-09-03 | 2001-01-09 | Uit, Llc | Ultrasonic impact methods for treatment of welded structures |
JP3580731B2 (ja) * | 1999-06-11 | 2004-10-27 | 和美 松重 | 鉛フリー半田の半田付け方法、及び当該半田付け方法にて半田付けされた接合体 |
KR20010072364A (ko) * | 1999-06-11 | 2001-07-31 | 이즈하라 요조 | 무연 땜납 |
JP2001230272A (ja) * | 2000-02-21 | 2001-08-24 | Nippon Avionics Co Ltd | 鉛フリーはんだ多層バンプを有するフリップチップ及び鉛フリー・フリップチップアセンブリ |
JP2002076590A (ja) * | 2000-08-29 | 2002-03-15 | Matsushita Electric Ind Co Ltd | 部品装着装置、部品装着方法、及び部品実装システム、並びに回路基板 |
TW490821B (en) * | 2000-11-16 | 2002-06-11 | Orient Semiconductor Elect Ltd | Application of wire bonding technique on manufacture of wafer bump and wafer level chip scale package |
-
1999
- 1999-06-11 JP JP16516599A patent/JP3580731B2/ja not_active Expired - Fee Related
-
2000
- 2000-06-07 DE DE60016413T patent/DE60016413T2/de not_active Expired - Lifetime
- 2000-06-07 WO PCT/JP2000/003678 patent/WO2000076708A1/ja active IP Right Grant
- 2000-06-07 US US10/009,168 patent/US6702175B1/en not_active Expired - Fee Related
- 2000-06-07 EP EP00935564A patent/EP1195217B1/de not_active Expired - Lifetime
-
2004
- 2004-01-20 US US10/759,191 patent/US20040144829A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP3580731B2 (ja) | 2004-10-27 |
WO2000076708A1 (fr) | 2000-12-21 |
EP1195217A1 (de) | 2002-04-10 |
JP2000351065A (ja) | 2000-12-19 |
EP1195217B1 (de) | 2004-12-01 |
EP1195217A4 (de) | 2003-07-23 |
US6702175B1 (en) | 2004-03-09 |
DE60016413T2 (de) | 2005-11-03 |
US20040144829A1 (en) | 2004-07-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |