SG152124A1 - Simultaneous double-side grinding of semiconductor wafers - Google Patents
Simultaneous double-side grinding of semiconductor wafersInfo
- Publication number
- SG152124A1 SG152124A1 SG200806346-3A SG2008063463A SG152124A1 SG 152124 A1 SG152124 A1 SG 152124A1 SG 2008063463 A SG2008063463 A SG 2008063463A SG 152124 A1 SG152124 A1 SG 152124A1
- Authority
- SG
- Singapore
- Prior art keywords
- grinding
- spindles
- semiconductor wafers
- inclinometer
- sensors
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007049810A DE102007049810B4 (de) | 2007-10-17 | 2007-10-17 | Simultanes Doppelseitenschleifen von Halbleiterscheiben |
Publications (1)
Publication Number | Publication Date |
---|---|
SG152124A1 true SG152124A1 (en) | 2009-05-29 |
Family
ID=40458798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200806346-3A SG152124A1 (en) | 2007-10-17 | 2008-08-27 | Simultaneous double-side grinding of semiconductor wafers |
Country Status (7)
Country | Link |
---|---|
US (1) | US8197300B2 (de) |
JP (1) | JP4921444B2 (de) |
KR (1) | KR101023997B1 (de) |
CN (1) | CN101417405B (de) |
DE (1) | DE102007049810B4 (de) |
SG (1) | SG152124A1 (de) |
TW (1) | TWI370040B (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101103146B1 (ko) * | 2011-09-05 | 2012-01-04 | 이화다이아몬드공업 주식회사 | 연삭 품질이 우수한 oled 기판용 멀티 연삭 휠 및 이를 이용한 oled 기판 연삭 방법 |
US9960088B2 (en) * | 2011-11-07 | 2018-05-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | End point detection in grinding |
US9358660B2 (en) | 2011-11-07 | 2016-06-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Grinding wheel design with elongated teeth arrangement |
WO2013119261A1 (en) * | 2012-02-09 | 2013-08-15 | Duescher Wayne O | Coplanar alignment apparatus for rotary spindles |
US20130217228A1 (en) | 2012-02-21 | 2013-08-22 | Masako Kodera | Method for fabricating semiconductor device |
JP5724958B2 (ja) * | 2012-07-03 | 2015-05-27 | 信越半導体株式会社 | 両頭研削装置及びワークの両頭研削方法 |
GB2516916B (en) | 2013-08-06 | 2016-09-14 | Lacsop Ltd | Method and apparatus for determining the mass of a body |
GB2516917B (en) * | 2013-08-06 | 2018-02-07 | Lacsop Ltd | Surface angle measuring device |
JP6327007B2 (ja) | 2014-06-24 | 2018-05-23 | 株式会社Sumco | 研削装置および研削方法 |
KR101597209B1 (ko) * | 2014-07-30 | 2016-02-24 | 주식회사 엘지실트론 | 웨이퍼 연마 장치 |
CN105881213A (zh) * | 2014-09-01 | 2016-08-24 | 曾庆明 | 一种精密双面研磨机的控制器 |
DE102017215705A1 (de) | 2017-09-06 | 2019-03-07 | Siltronic Ag | Vorrichtung und Verfahren zum doppelseitigen Schleifen von Halbleiterscheiben |
KR20200063491A (ko) * | 2018-11-28 | 2020-06-05 | 주식회사 케이씨텍 | 기판 처리 장치 |
EP3900876B1 (de) | 2020-04-23 | 2024-05-01 | Siltronic AG | Verfahren zum schleifen einer halbleiterscheibe |
CN112985281B (zh) * | 2021-02-22 | 2022-08-30 | 彩虹(合肥)液晶玻璃有限公司 | 一种液晶玻璃基板磨边磨轮外径测量装置 |
EP4144480B1 (de) | 2021-09-01 | 2024-01-31 | Siltronic AG | Verfahren zum schleifen von halbleiterscheiben |
CN114871955B (zh) * | 2022-05-25 | 2023-05-05 | 郑州磨料磨具磨削研究所有限公司 | 一种超硬磨料磨具的精密加工方法及系统 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56133637A (en) * | 1980-03-24 | 1981-10-19 | Agency Of Ind Science & Technol | Torque meter for grinder |
JPH0679596A (ja) * | 1992-09-01 | 1994-03-22 | Matsushita Electric Ind Co Ltd | 両頭研削機 |
US6296553B1 (en) * | 1997-04-02 | 2001-10-02 | Nippei Toyama Corporation | Grinding method, surface grinder, workpiece support, mechanism and work rest |
JPH11254312A (ja) | 1998-03-11 | 1999-09-21 | Super Silicon Kenkyusho:Kk | 形状制御を伴ったウェーハの枚葉加工方法及び加工装置 |
EP1118429B1 (de) | 1999-05-07 | 2007-10-24 | Shin-Etsu Handotai Co., Ltd | Entsprechende verfahren und vorrichtungen zum schleifen und läppen gleichzeitig von doppelseitigen oberflächen |
JP2001062718A (ja) * | 1999-08-20 | 2001-03-13 | Super Silicon Kenkyusho:Kk | 両頭研削装置及び砥石位置修正方法 |
JP2002292558A (ja) | 2001-03-30 | 2002-10-08 | Toyoda Mach Works Ltd | 枚葉式研磨装置 |
KR100954534B1 (ko) | 2002-10-09 | 2010-04-23 | 고요 기카이 고교 가부시키가이샤 | 얇은 원판형상 공작물의 양면 연삭방법 및 양면 연삭장치 |
JP2005201862A (ja) * | 2004-01-19 | 2005-07-28 | Keyence Corp | 接触式変位測定器 |
DE102004005702A1 (de) | 2004-02-05 | 2005-09-01 | Siltronic Ag | Halbleiterscheibe, Vorrichtung und Verfahren zur Herstellung der Halbleiterscheibe |
DE102004011996B4 (de) * | 2004-03-11 | 2007-12-06 | Siltronic Ag | Vorrichtung zum simultanen beidseitigen Schleifen von scheibenförmigen Werkstücken |
DE102004053308A1 (de) * | 2004-11-04 | 2006-03-23 | Siltronic Ag | Verfahren und Vorrichtung zum gleichzeitigen Schleifen beider Seiten eines scheibenförmigen Werkstücks sowie damit herstellbare Halbleiterscheibe |
-
2007
- 2007-10-17 DE DE102007049810A patent/DE102007049810B4/de active Active
-
2008
- 2008-08-27 SG SG200806346-3A patent/SG152124A1/en unknown
- 2008-09-11 CN CN2008102153595A patent/CN101417405B/zh active Active
- 2008-09-17 KR KR1020080090996A patent/KR101023997B1/ko active IP Right Grant
- 2008-10-01 US US12/242,959 patent/US8197300B2/en active Active
- 2008-10-15 TW TW097139545A patent/TWI370040B/zh active
- 2008-10-17 JP JP2008268225A patent/JP4921444B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
KR20090039604A (ko) | 2009-04-22 |
JP2009095976A (ja) | 2009-05-07 |
US8197300B2 (en) | 2012-06-12 |
DE102007049810B4 (de) | 2012-03-22 |
KR101023997B1 (ko) | 2011-03-28 |
TW200918237A (en) | 2009-05-01 |
JP4921444B2 (ja) | 2012-04-25 |
CN101417405A (zh) | 2009-04-29 |
TWI370040B (en) | 2012-08-11 |
DE102007049810A1 (de) | 2009-04-23 |
CN101417405B (zh) | 2011-12-14 |
US20090104846A1 (en) | 2009-04-23 |
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