WO2012014137A3 - Grinding tool for trapezoid grinding of a wafer - Google Patents

Grinding tool for trapezoid grinding of a wafer Download PDF

Info

Publication number
WO2012014137A3
WO2012014137A3 PCT/IB2011/053282 IB2011053282W WO2012014137A3 WO 2012014137 A3 WO2012014137 A3 WO 2012014137A3 IB 2011053282 W IB2011053282 W IB 2011053282W WO 2012014137 A3 WO2012014137 A3 WO 2012014137A3
Authority
WO
WIPO (PCT)
Prior art keywords
grinding
wafer
grooves
trapezoid
wheel
Prior art date
Application number
PCT/IB2011/053282
Other languages
French (fr)
Other versions
WO2012014137A2 (en
Inventor
Guoqiang David Zhang
Roland Vandamme
Peter D. Albrecht
Original Assignee
Memc Electronic Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials, Inc. filed Critical Memc Electronic Materials, Inc.
Priority to CN2011800376052A priority Critical patent/CN103180098A/en
Priority to SG2013002647A priority patent/SG187057A1/en
Priority to KR1020137002424A priority patent/KR20130132388A/en
Priority to EP11760557.6A priority patent/EP2598286A2/en
Priority to JP2013521270A priority patent/JP2013532587A/en
Publication of WO2012014137A2 publication Critical patent/WO2012014137A2/en
Publication of WO2012014137A3 publication Critical patent/WO2012014137A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/14—Zonally-graded wheels; Composite wheels comprising different abrasives

Abstract

A grinding tool for trapezoid grinding of a wafer on a profiling machine includes an annular wheel including a central hole adapted for mounting the wheel on a spindle. The wheel includes at least two grooves disposed at an outer edge of the wheel and the grooves are sized for receiving an outer edge of the wafer. At least one of the grooves is adapted for rough grinding of the wafer. At least one other of the grooves is adapted for fine grinding of the wafer.
PCT/IB2011/053282 2010-07-30 2011-07-22 Grinding tool for trapezoid grinding of a wafer WO2012014137A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2011800376052A CN103180098A (en) 2010-07-30 2011-07-22 Grinding tool for trapezoid grinding of a wafer
SG2013002647A SG187057A1 (en) 2010-07-30 2011-07-22 Grinding tool for trapezoid grinding of a wafer
KR1020137002424A KR20130132388A (en) 2010-07-30 2011-07-22 Grinding tool for trapezoid grinding of a wafer
EP11760557.6A EP2598286A2 (en) 2010-07-30 2011-07-22 Grinding tool for trapezoid grinding of a wafer
JP2013521270A JP2013532587A (en) 2010-07-30 2011-07-22 Grinding tool for trapezoidal grinding of wafers

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/847,015 2010-07-30
US12/847,015 US20120028555A1 (en) 2010-07-30 2010-07-30 Grinding Tool For Trapezoid Grinding Of A Wafer

Publications (2)

Publication Number Publication Date
WO2012014137A2 WO2012014137A2 (en) 2012-02-02
WO2012014137A3 true WO2012014137A3 (en) 2012-03-22

Family

ID=44674831

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2011/053282 WO2012014137A2 (en) 2010-07-30 2011-07-22 Grinding tool for trapezoid grinding of a wafer

Country Status (8)

Country Link
US (1) US20120028555A1 (en)
EP (1) EP2598286A2 (en)
JP (1) JP2013532587A (en)
KR (1) KR20130132388A (en)
CN (1) CN103180098A (en)
SG (1) SG187057A1 (en)
TW (1) TW201212116A (en)
WO (1) WO2012014137A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5926527B2 (en) * 2011-10-17 2016-05-25 信越化学工業株式会社 Manufacturing method of transparent SOI wafer
KR101871854B1 (en) * 2016-05-31 2018-06-28 주식회사 케이엔제이 Substrate treatment apparatus
CN106239306B (en) * 2016-08-01 2018-07-31 中国电子科技集团公司第四十六研究所 A kind of change R value Waffer edge chamfering methods
CN112005344B (en) * 2018-04-27 2023-11-17 东京毅力科创株式会社 Substrate processing system and substrate processing method
CN109571183B (en) * 2018-11-30 2024-02-20 温州市华晖汽摩配件厂(普通合伙) Self-water-outlet multi-radian lens glass chamfering grinding head for lens edging machine
KR102195461B1 (en) * 2019-03-28 2020-12-29 주식회사 케이엔제이 Substrate grinding apparatus
KR102199074B1 (en) * 2019-05-28 2021-01-06 주식회사 케이엔제이 Substrate grinding apparatus
CN111390713B (en) * 2020-04-09 2020-12-11 山东广域科技有限责任公司 Electric insulator machining and forming process

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001048752A1 (en) * 1999-12-27 2001-07-05 3M Innovative Properties Company Process for mirror-finishing the edge of a recording disk raw plate
EP1618988A2 (en) * 1998-05-18 2006-01-25 Tokyo Seimitsu Co.,Ltd. Method for chamfering wafers

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61256621A (en) 1985-05-08 1986-11-14 Toshiba Corp Production of bound-type semiconductor substrate
JP2658135B2 (en) 1988-03-08 1997-09-30 ソニー株式会社 Semiconductor substrate
JPH0485827A (en) 1990-07-26 1992-03-18 Fujitsu Ltd Manufacture of semiconductor device
JP3635200B2 (en) 1998-06-04 2005-04-06 信越半導体株式会社 Manufacturing method of SOI wafer
JP2001246536A (en) * 1999-12-27 2001-09-11 Three M Innovative Properties Co Method of mirror-finishing edge of recording medium disc original plate
US6482749B1 (en) * 2000-08-10 2002-11-19 Seh America, Inc. Method for etching a wafer edge using a potassium-based chemical oxidizer in the presence of hydrofluoric acid
JP4162892B2 (en) * 2002-01-11 2008-10-08 日鉱金属株式会社 Semiconductor wafer and manufacturing method thereof
JP4441823B2 (en) * 2003-11-26 2010-03-31 株式会社東京精密 Truing method and chamfering device for chamfering grindstone
JP4839818B2 (en) 2005-12-16 2011-12-21 信越半導体株式会社 Manufacturing method of bonded substrate
CN201350598Y (en) * 2008-12-30 2009-11-25 浙江水晶光电科技股份有限公司 Processing abrasive wheel for rounding wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1618988A2 (en) * 1998-05-18 2006-01-25 Tokyo Seimitsu Co.,Ltd. Method for chamfering wafers
WO2001048752A1 (en) * 1999-12-27 2001-07-05 3M Innovative Properties Company Process for mirror-finishing the edge of a recording disk raw plate

Also Published As

Publication number Publication date
TW201212116A (en) 2012-03-16
EP2598286A2 (en) 2013-06-05
US20120028555A1 (en) 2012-02-02
CN103180098A (en) 2013-06-26
KR20130132388A (en) 2013-12-04
WO2012014137A2 (en) 2012-02-02
SG187057A1 (en) 2013-02-28
JP2013532587A (en) 2013-08-19

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